JP5492509B2 - 基板移載方法及び半導体装置の製造方法及び基板処理装置及び搬送制御プログラム - Google Patents

基板移載方法及び半導体装置の製造方法及び基板処理装置及び搬送制御プログラム Download PDF

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JP5492509B2
JP5492509B2 JP2009220418A JP2009220418A JP5492509B2 JP 5492509 B2 JP5492509 B2 JP 5492509B2 JP 2009220418 A JP2009220418 A JP 2009220418A JP 2009220418 A JP2009220418 A JP 2009220418A JP 5492509 B2 JP5492509 B2 JP 5492509B2
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仁 関原
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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JP2009220418A 2009-09-25 2009-09-25 基板移載方法及び半導体装置の製造方法及び基板処理装置及び搬送制御プログラム Active JP5492509B2 (ja)

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JP6572854B2 (ja) * 2016-09-09 2019-09-11 株式会社ダイフク 容器収納設備
US11121014B2 (en) * 2018-06-05 2021-09-14 Asm Ip Holding B.V. Dummy wafer storage cassette
JP7157786B2 (ja) * 2020-09-23 2022-10-20 株式会社Screenホールディングス 基板処理装置および基板処理方法

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JP2829367B2 (ja) * 1996-03-08 1998-11-25 国際電気株式会社 ウェーハ移載方法

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