JP5481300B2 - 偏光板切断方法および当該方法によって切断された偏光板 - Google Patents

偏光板切断方法および当該方法によって切断された偏光板 Download PDF

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Publication number
JP5481300B2
JP5481300B2 JP2010170611A JP2010170611A JP5481300B2 JP 5481300 B2 JP5481300 B2 JP 5481300B2 JP 2010170611 A JP2010170611 A JP 2010170611A JP 2010170611 A JP2010170611 A JP 2010170611A JP 5481300 B2 JP5481300 B2 JP 5481300B2
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JP
Japan
Prior art keywords
polarizing plate
film
laser light
cut
cop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010170611A
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English (en)
Japanese (ja)
Other versions
JP2012030243A5 (enrdf_load_stackoverflow
JP2012030243A (ja
Inventor
伸 及川
力也 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP2010170611A priority Critical patent/JP5481300B2/ja
Priority to KR1020137004489A priority patent/KR101706416B1/ko
Priority to PCT/JP2011/065369 priority patent/WO2012014639A1/ja
Priority to CN201180037027.2A priority patent/CN103052464B/zh
Priority to TW100126146A priority patent/TWI485025B/zh
Publication of JP2012030243A publication Critical patent/JP2012030243A/ja
Publication of JP2012030243A5 publication Critical patent/JP2012030243A5/ja
Application granted granted Critical
Publication of JP5481300B2 publication Critical patent/JP5481300B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Polarising Elements (AREA)
  • Liquid Crystal (AREA)
JP2010170611A 2010-07-29 2010-07-29 偏光板切断方法および当該方法によって切断された偏光板 Expired - Fee Related JP5481300B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010170611A JP5481300B2 (ja) 2010-07-29 2010-07-29 偏光板切断方法および当該方法によって切断された偏光板
KR1020137004489A KR101706416B1 (ko) 2010-07-29 2011-07-05 편광판 절단 방법 및 상기 방법에 의해 절단된 편광판
PCT/JP2011/065369 WO2012014639A1 (ja) 2010-07-29 2011-07-05 偏光板切断方法および当該方法によって切断された偏光板
CN201180037027.2A CN103052464B (zh) 2010-07-29 2011-07-05 偏振片的切割方法以及使用该方法切割的偏振片
TW100126146A TWI485025B (zh) 2010-07-29 2011-07-25 偏光板切斷方法及藉由該方法切斷之偏光板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010170611A JP5481300B2 (ja) 2010-07-29 2010-07-29 偏光板切断方法および当該方法によって切断された偏光板

Publications (3)

Publication Number Publication Date
JP2012030243A JP2012030243A (ja) 2012-02-16
JP2012030243A5 JP2012030243A5 (enrdf_load_stackoverflow) 2014-02-20
JP5481300B2 true JP5481300B2 (ja) 2014-04-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010170611A Expired - Fee Related JP5481300B2 (ja) 2010-07-29 2010-07-29 偏光板切断方法および当該方法によって切断された偏光板

Country Status (5)

Country Link
JP (1) JP5481300B2 (enrdf_load_stackoverflow)
KR (1) KR101706416B1 (enrdf_load_stackoverflow)
CN (1) CN103052464B (enrdf_load_stackoverflow)
TW (1) TWI485025B (enrdf_load_stackoverflow)
WO (1) WO2012014639A1 (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102031401B1 (ko) * 2012-08-08 2019-10-11 스미또모 가가꾸 가부시키가이샤 광학 표시 디바이스의 생산 시스템 및 생산 방법
WO2014024872A1 (ja) * 2012-08-08 2014-02-13 住友化学株式会社 光学表示デバイスの生産方法および光学表示デバイスの生産システム
WO2014038433A1 (ja) * 2012-09-07 2014-03-13 住友化学株式会社 光学部材貼合体の製造装置
KR102041658B1 (ko) * 2012-12-18 2019-11-08 스미또모 가가꾸 가부시키가이샤 광학 표시 디바이스의 생산 방법 및 광학 표시 디바이스의 생산 시스템
KR101817388B1 (ko) * 2014-09-30 2018-01-10 주식회사 엘지화학 편광판의 절단 방법 및 이를 이용하여 절단된 편광판
KR101683649B1 (ko) 2015-01-27 2016-12-07 현대자동차주식회사 차량 컨텐츠를 통합하고 가변하기 위한 사용자 맞춤 표시 시스템 및 그의 차량 컨텐츠 관리 방법, 그리고 이를 실행하는 컴퓨터 판독 가능한 기록매체
TWI583479B (zh) * 2015-06-12 2017-05-21 住華科技股份有限公司 光學膜片的加工方法
KR101858432B1 (ko) * 2016-03-23 2018-05-16 동우 화인켐 주식회사 윈도우 기판 및 이의 제조 방법
KR102838251B1 (ko) 2017-01-05 2025-07-25 삼성디스플레이 주식회사 편광판 제조방법 및 편광판을 구비하는 표시장치
KR102066471B1 (ko) * 2017-03-10 2020-01-15 주식회사 엘지화학 편광필름의 재단 방법
KR102416550B1 (ko) * 2017-04-28 2022-07-05 삼성디스플레이 주식회사 편광층, 이를 구비하는 표시 장치 및 표시 장치의 제조 방법
JP6792660B2 (ja) * 2019-03-04 2020-11-25 住友化学株式会社 光学積層体及びその製造方法
JP2021149087A (ja) * 2020-03-16 2021-09-27 住友化学株式会社 積層シートおよびその製造方法
WO2021186986A1 (ja) * 2020-03-16 2021-09-23 住友化学株式会社 積層シートおよびその製造方法
JPWO2022085726A1 (enrdf_load_stackoverflow) 2020-10-23 2022-04-28
CN115890030B (zh) * 2022-11-22 2025-06-24 武汉市工程科学技术研究院 一种眼镜镜片加工装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1077074C (zh) * 1998-01-26 2002-01-02 四维企业股份有限公司 封装用复合膜
JP4233999B2 (ja) * 2003-12-25 2009-03-04 日東電工株式会社 積層型偏光板およびその製造方法
JP2006106016A (ja) * 2004-09-10 2006-04-20 Sumitomo Chemical Co Ltd 偏光板及びその製造方法
WO2006075736A1 (ja) * 2005-01-17 2006-07-20 Nitto Denko Corporation 偏光板、その製造方法、光学フィルムおよびそれを用いた画像表示装置
JP2007114270A (ja) * 2005-10-18 2007-05-10 Nippon Oil Corp 光学フィルムの製造方法
JP2008073742A (ja) * 2006-09-22 2008-04-03 Nitto Denko Corp 光学フィルムの切断方法及び光学フィルム
CN101528445B (zh) * 2006-10-17 2016-08-17 日东电工株式会社 光学构件贴合方法以及使用该方法的装置
JP4769165B2 (ja) * 2006-10-27 2011-09-07 富士フイルム株式会社 感光性積層体の製造装置及び製造方法
JP2008155465A (ja) * 2006-12-22 2008-07-10 Fujifilm Corp 感光性積層体の製造装置及び製造方法
JP5096040B2 (ja) * 2007-05-16 2012-12-12 日東電工株式会社 レーザー加工方法及びレーザー加工品
JP5553397B2 (ja) * 2007-07-19 2014-07-16 日東電工株式会社 レーザー加工方法
JP2009157363A (ja) * 2007-12-03 2009-07-16 Nitto Denko Corp 積層光学製品、光学表示装置および光学表示装置の製造方法
KR101102159B1 (ko) * 2009-08-06 2012-01-02 수미토모 케미칼 컴퍼니 리미티드 편광판의 제조 방법

Also Published As

Publication number Publication date
KR20130130692A (ko) 2013-12-02
CN103052464B (zh) 2015-02-11
WO2012014639A1 (ja) 2012-02-02
CN103052464A (zh) 2013-04-17
JP2012030243A (ja) 2012-02-16
TWI485025B (zh) 2015-05-21
TW201219139A (en) 2012-05-16
KR101706416B1 (ko) 2017-02-13

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