JP5470601B2 - 静電チャック - Google Patents

静電チャック Download PDF

Info

Publication number
JP5470601B2
JP5470601B2 JP2009047767A JP2009047767A JP5470601B2 JP 5470601 B2 JP5470601 B2 JP 5470601B2 JP 2009047767 A JP2009047767 A JP 2009047767A JP 2009047767 A JP2009047767 A JP 2009047767A JP 5470601 B2 JP5470601 B2 JP 5470601B2
Authority
JP
Japan
Prior art keywords
protrusions
electrostatic chuck
dielectric layer
plate
cooling gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009047767A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010205813A5 (enExample
JP2010205813A (ja
Inventor
寛 米倉
晃樹 玉川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009047767A priority Critical patent/JP5470601B2/ja
Priority to US12/714,654 priority patent/US8023248B2/en
Publication of JP2010205813A publication Critical patent/JP2010205813A/ja
Publication of JP2010205813A5 publication Critical patent/JP2010205813A5/ja
Application granted granted Critical
Publication of JP5470601B2 publication Critical patent/JP5470601B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009047767A 2009-03-02 2009-03-02 静電チャック Active JP5470601B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009047767A JP5470601B2 (ja) 2009-03-02 2009-03-02 静電チャック
US12/714,654 US8023248B2 (en) 2009-03-02 2010-03-01 Electrostatic chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009047767A JP5470601B2 (ja) 2009-03-02 2009-03-02 静電チャック

Publications (3)

Publication Number Publication Date
JP2010205813A JP2010205813A (ja) 2010-09-16
JP2010205813A5 JP2010205813A5 (enExample) 2012-01-19
JP5470601B2 true JP5470601B2 (ja) 2014-04-16

Family

ID=42666967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009047767A Active JP5470601B2 (ja) 2009-03-02 2009-03-02 静電チャック

Country Status (2)

Country Link
US (1) US8023248B2 (enExample)
JP (1) JP5470601B2 (enExample)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310109B1 (ko) * 2011-06-13 2013-09-23 주식회사 엠와이에스 세라믹 몸체의 가장자리에 패드가 형성된 정전기 척
US9620478B2 (en) 2011-11-18 2017-04-11 Apple Inc. Method of fabricating a micro device transfer head
US8426227B1 (en) 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
US8573469B2 (en) 2011-11-18 2013-11-05 LuxVue Technology Corporation Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer
US8349116B1 (en) 2011-11-18 2013-01-08 LuxVue Technology Corporation Micro device transfer head heater assembly and method of transferring a micro device
US8518204B2 (en) 2011-11-18 2013-08-27 LuxVue Technology Corporation Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer
US9773750B2 (en) 2012-02-09 2017-09-26 Apple Inc. Method of transferring and bonding an array of micro devices
US9548332B2 (en) 2012-04-27 2017-01-17 Apple Inc. Method of forming a micro LED device with self-aligned metallization stack
US9105492B2 (en) 2012-05-08 2015-08-11 LuxVue Technology Corporation Compliant micro device transfer head
US9034754B2 (en) 2012-05-25 2015-05-19 LuxVue Technology Corporation Method of forming a micro device transfer head with silicon electrode
US8415771B1 (en) 2012-05-25 2013-04-09 LuxVue Technology Corporation Micro device transfer head with silicon electrode
US8569115B1 (en) 2012-07-06 2013-10-29 LuxVue Technology Corporation Method of forming a compliant bipolar micro device transfer head with silicon electrodes
US8415768B1 (en) 2012-07-06 2013-04-09 LuxVue Technology Corporation Compliant monopolar micro device transfer head with silicon electrode
US8415767B1 (en) 2012-07-06 2013-04-09 LuxVue Technology Corporation Compliant bipolar micro device transfer head with silicon electrodes
US8383506B1 (en) 2012-07-06 2013-02-26 LuxVue Technology Corporation Method of forming a compliant monopolar micro device transfer head with silicon electrode
US8933433B2 (en) 2012-07-30 2015-01-13 LuxVue Technology Corporation Method and structure for receiving a micro device
US8791530B2 (en) 2012-09-06 2014-07-29 LuxVue Technology Corporation Compliant micro device transfer head with integrated electrode leads
US9343347B2 (en) * 2012-09-07 2016-05-17 Applied Materials, Inc. Portable electrostatic chuck carrier for thin substrates
US9162880B2 (en) 2012-09-07 2015-10-20 LuxVue Technology Corporation Mass transfer tool
US8941215B2 (en) 2012-09-24 2015-01-27 LuxVue Technology Corporation Micro device stabilization post
US8835940B2 (en) 2012-09-24 2014-09-16 LuxVue Technology Corporation Micro device stabilization post
US9558721B2 (en) 2012-10-15 2017-01-31 Apple Inc. Content-based adaptive refresh schemes for low-power displays
US9178123B2 (en) 2012-12-10 2015-11-03 LuxVue Technology Corporation Light emitting device reflective bank structure
US9255001B2 (en) 2012-12-10 2016-02-09 LuxVue Technology Corporation Micro device transfer head array with metal electrodes
US9236815B2 (en) 2012-12-10 2016-01-12 LuxVue Technology Corporation Compliant micro device transfer head array with metal electrodes
US9029880B2 (en) 2012-12-10 2015-05-12 LuxVue Technology Corporation Active matrix display panel with ground tie lines
US9159700B2 (en) 2012-12-10 2015-10-13 LuxVue Technology Corporation Active matrix emissive micro LED display
US9166114B2 (en) 2012-12-11 2015-10-20 LuxVue Technology Corporation Stabilization structure including sacrificial release layer and staging cavity
US9105714B2 (en) 2012-12-11 2015-08-11 LuxVue Technology Corporation Stabilization structure including sacrificial release layer and staging bollards
US9314930B2 (en) 2012-12-14 2016-04-19 LuxVue Technology Corporation Micro pick up array with integrated pivot mount
US9391042B2 (en) 2012-12-14 2016-07-12 Apple Inc. Micro device transfer system with pivot mount
US9153171B2 (en) 2012-12-17 2015-10-06 LuxVue Technology Corporation Smart pixel lighting and display microcontroller
US10001713B2 (en) * 2013-02-07 2018-06-19 Asml Holding N.V. Lithographic apparatus and method
US9308649B2 (en) 2013-02-25 2016-04-12 LuxVue Techonology Corporation Mass transfer tool manipulator assembly
US9095980B2 (en) 2013-02-25 2015-08-04 LuxVue Technology Corporation Micro pick up array mount with integrated displacement sensor
US8791474B1 (en) 2013-03-15 2014-07-29 LuxVue Technology Corporation Light emitting diode display with redundancy scheme
US9252375B2 (en) 2013-03-15 2016-02-02 LuxVue Technology Corporation Method of fabricating a light emitting diode display with integrated defect detection test
US9484504B2 (en) 2013-05-14 2016-11-01 Apple Inc. Micro LED with wavelength conversion layer
US9217541B2 (en) 2013-05-14 2015-12-22 LuxVue Technology Corporation Stabilization structure including shear release posts
US9136161B2 (en) 2013-06-04 2015-09-15 LuxVue Technology Corporation Micro pick up array with compliant contact
CN105683872B (zh) 2013-06-12 2020-05-12 罗茵尼公司 安置有光产生源的键盘背后照明
US8987765B2 (en) 2013-06-17 2015-03-24 LuxVue Technology Corporation Reflective bank structure and method for integrating a light emitting device
US9111464B2 (en) 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
US8928021B1 (en) 2013-06-18 2015-01-06 LuxVue Technology Corporation LED light pipe
US9035279B2 (en) 2013-07-08 2015-05-19 LuxVue Technology Corporation Micro device with stabilization post
US9296111B2 (en) 2013-07-22 2016-03-29 LuxVue Technology Corporation Micro pick up array alignment encoder
US9087764B2 (en) 2013-07-26 2015-07-21 LuxVue Technology Corporation Adhesive wafer bonding with controlled thickness variation
US9153548B2 (en) 2013-09-16 2015-10-06 Lux Vue Technology Corporation Adhesive wafer bonding with sacrificial spacers for controlled thickness variation
US9367094B2 (en) 2013-12-17 2016-06-14 Apple Inc. Display module and system applications
US9768345B2 (en) 2013-12-20 2017-09-19 Apple Inc. LED with current injection confinement trench
US9450147B2 (en) 2013-12-27 2016-09-20 Apple Inc. LED with internally confined current injection area
US9583466B2 (en) 2013-12-27 2017-02-28 Apple Inc. Etch removal of current distribution layer for LED current confinement
US9542638B2 (en) 2014-02-18 2017-01-10 Apple Inc. RFID tag and micro chip integration design
US9583533B2 (en) 2014-03-13 2017-02-28 Apple Inc. LED device with embedded nanowire LEDs
US9522468B2 (en) 2014-05-08 2016-12-20 Apple Inc. Mass transfer tool manipulator assembly with remote center of compliance
US9318475B2 (en) 2014-05-15 2016-04-19 LuxVue Technology Corporation Flexible display and method of formation with sacrificial release layer
US9741286B2 (en) 2014-06-03 2017-08-22 Apple Inc. Interactive display panel with emitting and sensing diodes
US9624100B2 (en) 2014-06-12 2017-04-18 Apple Inc. Micro pick up array pivot mount with integrated strain sensing elements
US9425151B2 (en) 2014-06-17 2016-08-23 Apple Inc. Compliant electrostatic transfer head with spring support layer
US9570002B2 (en) 2014-06-17 2017-02-14 Apple Inc. Interactive display panel with IR diodes
JP6168162B2 (ja) * 2014-09-30 2017-07-26 住友大阪セメント株式会社 静電チャック装置
US9705432B2 (en) 2014-09-30 2017-07-11 Apple Inc. Micro pick up array pivot mount design for strain amplification
US9828244B2 (en) 2014-09-30 2017-11-28 Apple Inc. Compliant electrostatic transfer head with defined cavity
US9478583B2 (en) 2014-12-08 2016-10-25 Apple Inc. Wearable display having an array of LEDs on a conformable silicon substrate
WO2017124109A1 (en) 2016-01-15 2017-07-20 Rohinni, LLC Apparatus and method of backlighting through a cover on the apparatus
JP6650345B2 (ja) * 2016-05-26 2020-02-19 日本特殊陶業株式会社 基板保持装置及びその製造方法
JP6703907B2 (ja) 2016-06-30 2020-06-03 新光電気工業株式会社 静電チャック、および、静電チャックの製造方法
KR20220111274A (ko) * 2019-12-09 2022-08-09 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치용 기판 지지체 제조 방법, 기판 테이블, 리소그래피 장치, 디바이스 제조 방법, 사용 방법
EP3882700A1 (en) 2020-03-16 2021-09-22 ASML Netherlands B.V. Object holder, tool and method of manufacturing an object holder
US12033881B2 (en) 2021-03-18 2024-07-09 Applied Materials, Inc. Reduced localized force in electrostatic chucking

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0673760U (ja) * 1993-03-30 1994-10-18 ホーヤ株式会社 フォトマスク基板保持用プレートチャック
US5745331A (en) * 1994-01-31 1998-04-28 Applied Materials, Inc. Electrostatic chuck with conformal insulator film
JPH09172055A (ja) * 1995-12-19 1997-06-30 Fujitsu Ltd 静電チャック及びウエハの吸着方法
JPH11111819A (ja) * 1997-09-30 1999-04-23 Asahi Kasei Micro Syst Co Ltd ウェハーの固定方法及び露光装置
JP2001127145A (ja) * 1999-08-19 2001-05-11 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイス製造方法
JP4094262B2 (ja) * 2001-09-13 2008-06-04 住友大阪セメント株式会社 吸着固定装置及びその製造方法
JP3862676B2 (ja) * 2003-06-23 2006-12-27 東陶機器株式会社 プラズマエッチング方法
JP2005101226A (ja) * 2003-09-24 2005-04-14 Hoya Corp 基板保持装置，基板処理装置，基板検査装置及び基板保持方法
US6897945B1 (en) * 2003-12-15 2005-05-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN100470756C (zh) * 2004-06-28 2009-03-18 京瓷株式会社 静电卡盘
JP4417197B2 (ja) * 2004-07-30 2010-02-17 住友大阪セメント株式会社 サセプタ装置
JP2007173596A (ja) * 2005-12-22 2007-07-05 Ngk Insulators Ltd 静電チャック
TWI449122B (zh) * 2007-06-21 2014-08-11 Asml Netherlands Bv 夾具器件，用於裝載一物件至支撐件上之方法，微影裝置及機器可讀媒體

Also Published As

Publication number Publication date
US20100220425A1 (en) 2010-09-02
JP2010205813A (ja) 2010-09-16
US8023248B2 (en) 2011-09-20

Similar Documents

Publication Publication Date Title
JP5470601B2 (ja) 静電チャック
JP2010205813A5 (enExample)
JP6001675B2 (ja) 載置用部材およびその製造方法
JP3859937B2 (ja) 静電チャック
US10068790B2 (en) Electrostatic chuck device
JP6352326B2 (ja) 下部ウエハ欠陥に対する保持リング
TW200920661A (en) Retaining ring with shaped profile
JP2010123843A (ja) 静電チャック
KR102211328B1 (ko) 연마면 세정 장치, 연마 장치 및 연마면 세정 장치의 제조 방법
JP2009253076A (ja) 基板用ステージ
US9724803B2 (en) Nozzle for stress-free polishing metal layers on semiconductor wafers
CN103419124A (zh) 定位器环
JP4444843B2 (ja) 静電チャック
JP7244276B2 (ja) 耐腐食性保持リング
JP2014090038A (ja) 吸着部材
JP2012064800A (ja) ウェーハ洗浄装置
KR20060131620A (ko) 화학적기계 연마장치의 리테이너 링
JP6433872B2 (ja) 集塵装置及び集塵システム
TWI523133B (zh) 晶圓洗滌器和晶圓清洗程序
JP2009034745A (ja) Ｃｍｐ装置用リテーナリング
JP6993813B2 (ja) 基板保持装置
CN115302403B (zh) 一种用于化学机械抛光的承载头及抛光设备
JP4400797B2 (ja) ディスクスピン乾燥装置
KR20070074398A (ko) 오염 물질 제거부를 포함하는 반도체 웨이퍼
KR100680880B1 (ko) 리테이너 링 및 이를 포함하는 화학적 기계적 연마 장치

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111128

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20111128

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20111128

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20120425

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120426

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120515

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120706

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121009

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121205

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20121225

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130322

A911 Transfer of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20130408

A912 Removal of reconsideration by examiner before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20130607

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131121

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140114

R150 Certificate of patent or registration of utility model

Ref document number: 5470601

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150