JP5463729B2 - 半導体処理装置 - Google Patents

半導体処理装置 Download PDF

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Publication number
JP5463729B2
JP5463729B2 JP2009116987A JP2009116987A JP5463729B2 JP 5463729 B2 JP5463729 B2 JP 5463729B2 JP 2009116987 A JP2009116987 A JP 2009116987A JP 2009116987 A JP2009116987 A JP 2009116987A JP 5463729 B2 JP5463729 B2 JP 5463729B2
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Japan
Prior art keywords
substrate
substrate holder
processing apparatus
semiconductor processing
suction
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Expired - Fee Related
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JP2009116987A
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English (en)
Japanese (ja)
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JP2010267746A (ja
JP2010267746A5 (enExample
Inventor
栄裕 前田
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Nikon Corp
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Nikon Corp
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Priority to JP2009116987A priority Critical patent/JP5463729B2/ja
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Publication of JP2010267746A5 publication Critical patent/JP2010267746A5/ja
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009116987A 2009-05-13 2009-05-13 半導体処理装置 Expired - Fee Related JP5463729B2 (ja)

Priority Applications (1)

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JP2009116987A JP5463729B2 (ja) 2009-05-13 2009-05-13 半導体処理装置

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JP2009116987A JP5463729B2 (ja) 2009-05-13 2009-05-13 半導体処理装置

Publications (3)

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JP2010267746A JP2010267746A (ja) 2010-11-25
JP2010267746A5 JP2010267746A5 (enExample) 2012-09-13
JP5463729B2 true JP5463729B2 (ja) 2014-04-09

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JP2009116987A Expired - Fee Related JP5463729B2 (ja) 2009-05-13 2009-05-13 半導体処理装置

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5847419B2 (ja) * 2011-03-31 2016-01-20 京セラクリスタルデバイス株式会社 ウエハの接合方法
CN104221131B (zh) 2012-09-07 2016-12-21 富士电机株式会社 半导体元件的制造方法
WO2017066311A1 (en) * 2015-10-12 2017-04-20 Applied Materials, Inc. Substrate carrier for active/passive bonding and de-bonding of a substrate
KR102616658B1 (ko) * 2017-06-06 2023-12-21 에이에스엠엘 네델란즈 비.브이. 지지 테이블로부터 대상물을 언로딩하는 방법
JP2019075477A (ja) * 2017-10-17 2019-05-16 株式会社ディスコ チャックテーブル機構

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4598641B2 (ja) * 2000-11-30 2010-12-15 富士通株式会社 貼り合せ基板製造システム
JP2003043458A (ja) * 2001-07-31 2003-02-13 Matsushita Electric Ind Co Ltd 液晶表示素子基板の吸着方法及び液晶表示素子基板の吸着装置
JP2005086126A (ja) * 2003-09-11 2005-03-31 Advanced Display Inc ステージ、ホットプレート、加工装置及び電子機器の製造方法
JP3894562B2 (ja) * 2003-10-01 2007-03-22 キヤノン株式会社 基板吸着装置、露光装置およびデバイス製造方法
JP4763380B2 (ja) * 2005-08-25 2011-08-31 株式会社アルバック 吸着装置の製造方法
JP2007073892A (ja) * 2005-09-09 2007-03-22 Ulvac Japan Ltd 吸着装置、貼り合わせ装置、封着方法
JP2007113939A (ja) * 2005-10-18 2007-05-10 Nikon Corp 計測装置及び計測方法、ステージ装置、並びに露光装置及び露光方法
JP2007142238A (ja) * 2005-11-21 2007-06-07 Nikon Corp 基板保持装置、露光装置及びデバイスの製造方法
JP4150041B2 (ja) * 2005-12-26 2008-09-17 富士通株式会社 貼合せ基板製造装置
JP4631748B2 (ja) * 2006-03-02 2011-02-16 Ｔｏｔｏ株式会社 静電吸着方法
JP4938352B2 (ja) * 2006-05-17 2012-05-23 株式会社ディスコ 静電チャックテーブル機構
US8469342B2 (en) * 2007-07-23 2013-06-25 Creative Technology Corporation Substrate suction apparatus and method for manufacturing the same
WO2009022457A1 (ja) * 2007-08-10 2009-02-19 Nikon Corporation 基板貼り合わせ装置及び基板貼り合わせ方法

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