JP5459739B2 - 蒸着装置及び薄膜製造方法 - Google Patents
蒸着装置及び薄膜製造方法 Download PDFInfo
- Publication number
- JP5459739B2 JP5459739B2 JP2012266436A JP2012266436A JP5459739B2 JP 5459739 B2 JP5459739 B2 JP 5459739B2 JP 2012266436 A JP2012266436 A JP 2012266436A JP 2012266436 A JP2012266436 A JP 2012266436A JP 5459739 B2 JP5459739 B2 JP 5459739B2
- Authority
- JP
- Japan
- Prior art keywords
- vapor deposition
- deposition source
- correction
- correction member
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007740 vapor deposition Methods 0.000 title claims description 192
- 239000010409 thin film Substances 0.000 title claims description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 230000008021 deposition Effects 0.000 claims description 52
- 239000000463 material Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 30
- 238000001704 evaporation Methods 0.000 description 10
- 230000008020 evaporation Effects 0.000 description 9
- 239000010408 film Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Description
11 ガイドレール
12 基板
20 蒸着源
21 坩堝
22 第1蒸着源
23 第2蒸着源
30 第1補正部材
31 第1遮蔽壁
32、42 第1補正板
33、43 第2補正板
34、44 支持部
40 第2補正部材
41 第2遮蔽壁
Claims (10)
- 第1方向に直線動するように備えられた第1蒸着源と、
前記第1蒸着源から前記第1方向と垂直の第2方向に離隔され、前記第1蒸着源と同時に前記第1方向に直線動するように備えられた第2蒸着源と、
前記第1蒸着源及び前記第2蒸着源と被処理体との間に位置し、前記第1蒸着源及び前記第2蒸着源と同時に前記第1方向に直線動するように備えられた第1補正部材と、
前記第1蒸着源及び前記第2蒸着源と被処理体との間に位置し、前記第1蒸着源及び前記第2蒸着源と同時に前記第1方向に直線動するように備えられ、
前記第1補正部材から前記第1方向に離隔され、前記第1補正部材との間に対応する位置に前記第1蒸着源及び前記第2蒸着源が位置するように備えられた第2補正部材と、
を含み、
前記第1補正部材及び前記第2補正部材は、
前記第1蒸着源に対応する位置に備えられた第1補正板と、
前記第2蒸着源に対応する位置に備えられた第2補正板と、
を含み、
前記第1補正部材及び前記第2補正部材の各第1補正板は相互対向し、前記第1補正部材及び前記第2補正部材の各第2補正板は相互対向し、
前記第1補正部材及び前記第2補正部材の相互離隔された間にはいかなる部材も位置しないこととを特徴する、蒸着装置。 - 前記第1補正部材及び前記第2補正部材は、前記第1補正板と前記第2補正板とを連結する支持部をさらに備えることを特徴とする請求項1に記載の蒸着装置。
- 前記第1補正板及び前記第2補正板は、前記支持部から前記第1蒸着源及び第2蒸着源の方向に突出していることを特徴とする請求項2に記載の蒸着装置。
- 前記第1補正板及び前記第2補正板は、前記支持部から前記第1蒸着源及び第2蒸着源にそれぞれ平行に突出していることを特徴とする請求項2又は3に記載の蒸着装置。
- 前記第1補正部材及び前記第2補正部材は、少なくとも、前記第1蒸着源及び前記第2蒸着源の進行方向の前方に配置されることを特徴とする請求項1〜4のいずれかに記載の蒸着装置。
- 前記第1蒸着源及び前記第2蒸着源は、往復直線動することを特徴とする請求項1〜5のいずれかに記載の蒸着装置。
- 前記第1補正部材及び前記第2補正部材は、少なくとも、前記第1蒸着源及び前記第2蒸着源の進行方向の後方に配置されることを特徴とする請求項1〜6のいずれかに記載の蒸着装置。
- 相互離隔されて直線動する少なくとも二つの蒸着源を準備するステップと、
前記蒸着源に対向して被処理体を配置するステップと、
前記蒸着源を一方向に同時に移動させつつ、前記被処理体に薄膜を形成するステップと、
前記蒸着源の進行方向の前方及び後方のうち、少なくとも一方の前記蒸着源と被処理体との間の空間を遮蔽することによって、前記各蒸着源の位置にそれぞれ対応する位置における前記蒸着源と前記被処理体との間の空間を遮蔽するステップと、
を含み、
前記各蒸着源に対向する位置での蒸着物質の遮蔽量は、前記各蒸着源の間に対応する位置での蒸着物質の遮蔽量より多いことを特徴する、薄膜形成方法。 - 前記各蒸着源に対応する位置での遮蔽量は、前記各蒸着源の間隔に対応する位置での遮蔽量より多いことを特徴とする請求項8に記載の薄膜製造方法。
- 前記蒸着源及び補正部材を往復動させつつ、前記被処理体に薄膜を形成するステップを含むことを特徴とする請求項8又は9に記載の薄膜製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080018529A KR100964224B1 (ko) | 2008-02-28 | 2008-02-28 | 증착 장치 및 박막 형성 방법 |
KR10-2008-0018529 | 2008-02-28 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009022715A Division JP2009203551A (ja) | 2008-02-28 | 2009-02-03 | 蒸着装置及び薄膜製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013053374A JP2013053374A (ja) | 2013-03-21 |
JP5459739B2 true JP5459739B2 (ja) | 2014-04-02 |
Family
ID=41013377
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009022715A Pending JP2009203551A (ja) | 2008-02-28 | 2009-02-03 | 蒸着装置及び薄膜製造方法 |
JP2012266436A Active JP5459739B2 (ja) | 2008-02-28 | 2012-12-05 | 蒸着装置及び薄膜製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009022715A Pending JP2009203551A (ja) | 2008-02-28 | 2009-02-03 | 蒸着装置及び薄膜製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8186299B2 (ja) |
JP (2) | JP2009203551A (ja) |
KR (1) | KR100964224B1 (ja) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI472639B (zh) | 2009-05-22 | 2015-02-11 | Samsung Display Co Ltd | 薄膜沉積設備 |
TWI475124B (zh) | 2009-05-22 | 2015-03-01 | Samsung Display Co Ltd | 薄膜沉積設備 |
US8882920B2 (en) | 2009-06-05 | 2014-11-11 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
US8882921B2 (en) | 2009-06-08 | 2014-11-11 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
KR101074792B1 (ko) * | 2009-06-12 | 2011-10-19 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
KR101117719B1 (ko) | 2009-06-24 | 2012-03-08 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
KR101127575B1 (ko) | 2009-08-10 | 2012-03-23 | 삼성모바일디스플레이주식회사 | 증착 가림막을 가지는 박막 증착 장치 |
JP5328726B2 (ja) | 2009-08-25 | 2013-10-30 | 三星ディスプレイ株式會社 | 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法 |
JP5677785B2 (ja) | 2009-08-27 | 2015-02-25 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法 |
US8696815B2 (en) | 2009-09-01 | 2014-04-15 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
US8876975B2 (en) | 2009-10-19 | 2014-11-04 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
KR101084184B1 (ko) | 2010-01-11 | 2011-11-17 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
KR101174875B1 (ko) | 2010-01-14 | 2012-08-17 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
KR101193186B1 (ko) | 2010-02-01 | 2012-10-19 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
KR20120094112A (ko) * | 2010-02-03 | 2012-08-23 | 샤프 가부시키가이샤 | 증착 마스크, 증착장치 및 증착 방법 |
KR101156441B1 (ko) | 2010-03-11 | 2012-06-18 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
KR101202348B1 (ko) | 2010-04-06 | 2012-11-16 | 삼성디스플레이 주식회사 | 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
US8894458B2 (en) | 2010-04-28 | 2014-11-25 | Samsung Display Co., Ltd. | Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method |
JP5656987B2 (ja) * | 2010-05-18 | 2015-01-21 | シャープ株式会社 | 有機el素子の製造方法及び製造装置 |
KR101223723B1 (ko) | 2010-07-07 | 2013-01-18 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
KR101673017B1 (ko) | 2010-07-30 | 2016-11-07 | 삼성디스플레이 주식회사 | 박막 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조 방법 |
JP5612106B2 (ja) * | 2010-08-30 | 2014-10-22 | シャープ株式会社 | 蒸着方法、蒸着装置、及び有機el表示装置 |
KR101738531B1 (ko) | 2010-10-22 | 2017-05-23 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
KR101723506B1 (ko) | 2010-10-22 | 2017-04-19 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
KR20120045865A (ko) | 2010-11-01 | 2012-05-09 | 삼성모바일디스플레이주식회사 | 유기층 증착 장치 |
KR20120065789A (ko) | 2010-12-13 | 2012-06-21 | 삼성모바일디스플레이주식회사 | 유기층 증착 장치 |
KR101760897B1 (ko) | 2011-01-12 | 2017-07-25 | 삼성디스플레이 주식회사 | 증착원 및 이를 구비하는 유기막 증착 장치 |
KR101857992B1 (ko) | 2011-05-25 | 2018-05-16 | 삼성디스플레이 주식회사 | 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시 장치 제조 방법 및 유기 발광 표시 장치 |
KR101840654B1 (ko) | 2011-05-25 | 2018-03-22 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
KR101852517B1 (ko) | 2011-05-25 | 2018-04-27 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
KR101857249B1 (ko) | 2011-05-27 | 2018-05-14 | 삼성디스플레이 주식회사 | 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치 |
KR101288307B1 (ko) * | 2011-05-31 | 2013-07-22 | 주성엔지니어링(주) | 증발 증착 장치 및 증발 증착 방법 |
KR101826068B1 (ko) | 2011-07-04 | 2018-02-07 | 삼성디스플레이 주식회사 | 유기층 증착 장치 |
KR101906358B1 (ko) | 2012-02-21 | 2018-10-11 | 삼성디스플레이 주식회사 | 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조방법 |
KR101942471B1 (ko) | 2012-06-15 | 2019-01-28 | 삼성디스플레이 주식회사 | 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조방법 |
CN102808154A (zh) * | 2012-08-01 | 2012-12-05 | 东莞宏威数码机械有限公司 | 侧向蒸镀用的立式蒸发舟及侧向蒸镀用的立式蒸发装置 |
CN103866236A (zh) * | 2012-12-18 | 2014-06-18 | 北京汉能创昱科技有限公司 | 一种铜铟镓硒薄膜电池共蒸发线性源的布置方法 |
KR20140118551A (ko) | 2013-03-29 | 2014-10-08 | 삼성디스플레이 주식회사 | 증착 장치, 유기 발광 표시 장치 제조 방법 및 유기 발광 표시 장치 |
KR102037376B1 (ko) | 2013-04-18 | 2019-10-29 | 삼성디스플레이 주식회사 | 패터닝 슬릿 시트, 이를 구비하는 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조방법 및 유기발광 디스플레이 장치 |
EP3187618A1 (en) | 2013-12-10 | 2017-07-05 | Applied Materials, Inc. | Evaporation source for organic material, deposition apparatus for depositing organic materials in a vacuum chamber having an evaporation source for organic material, and method for evaporating organic material |
KR102307431B1 (ko) * | 2015-01-22 | 2021-09-30 | 삼성디스플레이 주식회사 | 복수의 모듈을 갖는 증착원 |
US9905813B2 (en) | 2015-06-29 | 2018-02-27 | Samsung Display Co., Ltd. | Organic light-emitting display device, organic layer depositing apparatus, and method of manufacturing organic light-emitting display device using the organic layer depositing apparatus |
KR102391346B1 (ko) | 2015-08-04 | 2022-04-28 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치, 유기층 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조방법 |
KR101839879B1 (ko) | 2016-09-13 | 2018-03-19 | (주)알파플러스 | 증착 장치 |
CN108677147B (zh) * | 2018-06-13 | 2020-04-21 | 京东方科技集团股份有限公司 | 蒸镀装置及蒸镀方法 |
CN108823538A (zh) * | 2018-08-22 | 2018-11-16 | 北京铂阳顶荣光伏科技有限公司 | 蒸镀设备及蒸镀方法 |
KR102631255B1 (ko) | 2018-10-18 | 2024-01-31 | 삼성디스플레이 주식회사 | 하이브리드형 마스크 스틱과, 이를 적용한 마스크 프레임 어셈블리 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW490714B (en) | 1999-12-27 | 2002-06-11 | Semiconductor Energy Lab | Film formation apparatus and method for forming a film |
TWI336905B (en) * | 2002-05-17 | 2011-02-01 | Semiconductor Energy Lab | Evaporation method, evaporation device and method of fabricating light emitting device |
KR100477747B1 (ko) | 2002-07-11 | 2005-03-18 | 삼성에스디아이 주식회사 | 증착장치 및 증착장치용 차단부재의 설계방법 |
JP4515060B2 (ja) | 2002-08-30 | 2010-07-28 | 株式会社半導体エネルギー研究所 | 製造装置および有機化合物を含む層の作製方法 |
JP2004238663A (ja) | 2003-02-05 | 2004-08-26 | Sony Corp | 蒸着装置 |
KR100579406B1 (ko) * | 2004-08-25 | 2006-05-12 | 삼성에스디아이 주식회사 | 수직 이동형 유기물 증착 장치 |
JP5064810B2 (ja) * | 2006-01-27 | 2012-10-31 | キヤノン株式会社 | 蒸着装置および蒸着方法 |
KR100994114B1 (ko) * | 2008-03-11 | 2010-11-12 | 삼성모바일디스플레이주식회사 | 박막 형성 방법 |
-
2008
- 2008-02-28 KR KR1020080018529A patent/KR100964224B1/ko active IP Right Grant
- 2008-12-19 US US12/314,991 patent/US8186299B2/en active Active
-
2009
- 2009-02-03 JP JP2009022715A patent/JP2009203551A/ja active Pending
-
2012
- 2012-12-05 JP JP2012266436A patent/JP5459739B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US8186299B2 (en) | 2012-05-29 |
KR100964224B1 (ko) | 2010-06-17 |
KR20090093161A (ko) | 2009-09-02 |
US20090220691A1 (en) | 2009-09-03 |
JP2009203551A (ja) | 2009-09-10 |
JP2013053374A (ja) | 2013-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5459739B2 (ja) | 蒸着装置及び薄膜製造方法 | |
KR102377183B1 (ko) | 고정밀 섀도 마스크 증착 시스템 및 그 방법 | |
KR101108151B1 (ko) | 증착 장치 | |
JP5160459B2 (ja) | 薄膜形成方法 | |
TWI633197B (zh) | 高精準度蔽蔭遮罩沉積系統及其方法 | |
KR101942471B1 (ko) | 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조방법 | |
US8802200B2 (en) | Method and apparatus for cleaning organic deposition materials | |
US20110033621A1 (en) | Thin film deposition apparatus including deposition blade | |
KR101074792B1 (ko) | 박막 증착 장치 | |
JP5400653B2 (ja) | 真空蒸着装置 | |
JP2005213616A (ja) | 蒸着方法および装置ならびにプラズマディスプレイパネルの製造方法 | |
US9174250B2 (en) | Method and apparatus for cleaning organic deposition materials | |
KR101074793B1 (ko) | 박막 증착 장치 | |
KR102240886B1 (ko) | 전자빔 증착장치 | |
JP2013209696A6 (ja) | 真空蒸着装置およびその蒸着源 | |
KR101648489B1 (ko) | 박막 증착 장치 및 이를 이용한 박막 증착 방법 | |
KR102372878B1 (ko) | 증착 장치 | |
JP7202814B2 (ja) | 成膜装置、成膜方法、および電子デバイスの製造方法 | |
KR20050013500A (ko) | 진공 막 형성 방법 및 진공 막 형성 장치 | |
KR20110016343A (ko) | 박막 증착 장치 | |
KR20170131892A (ko) | 트림 플레이트를 갖는 증착 장치 | |
JP2012214836A (ja) | 真空蒸着装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20121221 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130903 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131129 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20131217 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140108 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5459739 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |