JP5456441B2 - ダイシングテープ一体型ウエハ裏面保護フィルム - Google Patents

ダイシングテープ一体型ウエハ裏面保護フィルム Download PDF

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Publication number
JP5456441B2
JP5456441B2 JP2009251126A JP2009251126A JP5456441B2 JP 5456441 B2 JP5456441 B2 JP 5456441B2 JP 2009251126 A JP2009251126 A JP 2009251126A JP 2009251126 A JP2009251126 A JP 2009251126A JP 5456441 B2 JP5456441 B2 JP 5456441B2
Authority
JP
Japan
Prior art keywords
back surface
protective film
surface protective
wafer back
dicing tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009251126A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010199542A (ja
JP2010199542A5 (https=
Inventor
尚英 高本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2009251126A priority Critical patent/JP5456441B2/ja
Priority to KR1020100008701A priority patent/KR20100088578A/ko
Priority to TW099102715A priority patent/TWI609940B/zh
Priority to US12/696,174 priority patent/US20100193969A1/en
Priority to CN2010101060321A priority patent/CN101794722B/zh
Priority to TW103136368A priority patent/TWI591150B/zh
Publication of JP2010199542A publication Critical patent/JP2010199542A/ja
Publication of JP2010199542A5 publication Critical patent/JP2010199542A5/ja
Priority to KR1020130116405A priority patent/KR101563784B1/ko
Priority to KR1020140004961A priority patent/KR20140012207A/ko
Application granted granted Critical
Publication of JP5456441B2 publication Critical patent/JP5456441B2/ja
Priority to KR1020150053906A priority patent/KR101563846B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1467—Coloring agent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Laser Beam Processing (AREA)
JP2009251126A 2009-01-30 2009-10-30 ダイシングテープ一体型ウエハ裏面保護フィルム Expired - Fee Related JP5456441B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2009251126A JP5456441B2 (ja) 2009-01-30 2009-10-30 ダイシングテープ一体型ウエハ裏面保護フィルム
KR1020100008701A KR20100088578A (ko) 2009-01-30 2010-01-29 다이싱 테이프 일체형 웨이퍼 이면 보호필름
TW099102715A TWI609940B (zh) 2009-01-30 2010-01-29 使用切晶帶一體型晶圓背面保護膜製造半導體器件之方法
US12/696,174 US20100193969A1 (en) 2009-01-30 2010-01-29 Dicing tape-integrated wafer back surface protective film
CN2010101060321A CN101794722B (zh) 2009-01-30 2010-01-29 切割带集成晶片背面保护膜
TW103136368A TWI591150B (zh) 2009-01-30 2010-01-29 切晶帶一體型晶圓背面保護膜、半導體器件之製造方法、覆晶安裝半導體器件
KR1020130116405A KR101563784B1 (ko) 2009-01-30 2013-09-30 반도체 디바이스의 제조 방법
KR1020140004961A KR20140012207A (ko) 2009-01-30 2014-01-15 다이싱 테이프 일체형 웨이퍼 이면 보호필름
KR1020150053906A KR101563846B1 (ko) 2009-01-30 2015-04-16 다이싱 테이프 일체형 웨이퍼 이면 보호필름

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009020458 2009-01-30
JP2009020458 2009-01-30
JP2009251126A JP5456441B2 (ja) 2009-01-30 2009-10-30 ダイシングテープ一体型ウエハ裏面保護フィルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012185526A Division JP5640051B2 (ja) 2009-01-30 2012-08-24 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2010199542A JP2010199542A (ja) 2010-09-09
JP2010199542A5 JP2010199542A5 (https=) 2012-09-27
JP5456441B2 true JP5456441B2 (ja) 2014-03-26

Family

ID=42397025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009251126A Expired - Fee Related JP5456441B2 (ja) 2009-01-30 2009-10-30 ダイシングテープ一体型ウエハ裏面保護フィルム

Country Status (5)

Country Link
US (1) US20100193969A1 (https=)
JP (1) JP5456441B2 (https=)
KR (4) KR20100088578A (https=)
CN (1) CN101794722B (https=)
TW (2) TWI609940B (https=)

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JP6144868B2 (ja) 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法
JP5023225B1 (ja) * 2011-03-10 2012-09-12 日東電工株式会社 半導体装置用フィルムの製造方法
US8507363B2 (en) * 2011-06-15 2013-08-13 Applied Materials, Inc. Laser and plasma etch wafer dicing using water-soluble die attach film
JP5820170B2 (ja) * 2011-07-13 2015-11-24 日東電工株式会社 半導体装置用の接着フィルム、フリップチップ型半導体裏面用フィルム、及び、ダイシングテープ一体型半導体裏面用フィルム
CN103305142B (zh) * 2012-03-07 2016-01-20 古河电气工业株式会社 粘接带
US20160176169A1 (en) * 2013-08-01 2016-06-23 Lintec Corporation Protective Film Formation-Use Composite Sheet
SG11201606008WA (en) * 2014-01-22 2016-08-30 Lintec Corp Protective film-forming film, sheet for protective film, complex sheet for forming protective film, and method of producing manufactured product
JP5978246B2 (ja) * 2014-05-13 2016-08-24 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法
JP2016111236A (ja) * 2014-12-08 2016-06-20 株式会社ディスコ ウエーハの加工方法
CN105778644B (zh) * 2014-12-15 2019-01-29 碁達科技股份有限公司 雷射切割用保护膜组成物及应用
JP6078581B2 (ja) * 2015-04-30 2017-02-08 日東電工株式会社 一体型フィルム、フィルム、半導体装置の製造方法および保護チップの製造方法
JP2016210837A (ja) * 2015-04-30 2016-12-15 日東電工株式会社 裏面保護フィルム、フィルム、半導体装置の製造方法および保護チップの製造方法
JP6571398B2 (ja) 2015-06-04 2019-09-04 リンテック株式会社 半導体用保護フィルム、半導体装置及び複合シート
TWI641494B (zh) 2015-11-04 2018-11-21 日商琳得科股份有限公司 第一保護膜形成用片、第一保護膜形成方法以及半導體晶片的製造方法
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JP7007827B2 (ja) * 2017-07-28 2022-01-25 日東電工株式会社 ダイボンドフィルム、ダイシングダイボンドフィルム、および半導体装置製造方法
KR102012905B1 (ko) * 2018-10-19 2019-08-22 (주)엠티아이 웨이퍼 가공용 테이프
JP7313767B2 (ja) * 2019-04-10 2023-07-25 株式会社ディスコ ウェーハの加工方法
KR102417467B1 (ko) * 2019-05-10 2022-07-06 쇼와덴코머티리얼즈가부시끼가이샤 픽업성의 평가 방법, 다이싱·다이본딩 일체형 필름, 다이싱·다이본딩 일체형 필름의 평가 방법과 선별 방법, 및 반도체 장치의 제조 방법
CN110396379A (zh) * 2019-07-16 2019-11-01 湖北锂诺新能源科技有限公司 一种可进行激光喷码的锂离子电池保护胶带
CN113725169B (zh) * 2021-04-22 2024-06-14 成都芯源系统有限公司 倒装芯片封装单元及相关封装方法
CN113478110B (zh) * 2021-07-19 2022-03-04 无锡昌盛胶粘制品有限公司 一种非复合离型膜的用于银镜玻璃激光切割的保护膜
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JP5456440B2 (ja) * 2009-01-30 2014-03-26 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP5805367B2 (ja) * 2009-01-30 2015-11-04 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP6144868B2 (ja) * 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法

Also Published As

Publication number Publication date
CN101794722A (zh) 2010-08-04
TW201506121A (zh) 2015-02-16
KR20100088578A (ko) 2010-08-09
JP2010199542A (ja) 2010-09-09
TWI591150B (zh) 2017-07-11
KR101563846B1 (ko) 2015-10-27
KR20150045991A (ko) 2015-04-29
KR20130121781A (ko) 2013-11-06
KR101563784B1 (ko) 2015-10-27
KR20140012207A (ko) 2014-01-29
US20100193969A1 (en) 2010-08-05
TWI609940B (zh) 2018-01-01
CN101794722B (zh) 2012-08-08
TW201109410A (en) 2011-03-16

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