KR20100088578A - 다이싱 테이프 일체형 웨이퍼 이면 보호필름 - Google Patents

다이싱 테이프 일체형 웨이퍼 이면 보호필름 Download PDF

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Publication number
KR20100088578A
KR20100088578A KR1020100008701A KR20100008701A KR20100088578A KR 20100088578 A KR20100088578 A KR 20100088578A KR 1020100008701 A KR1020100008701 A KR 1020100008701A KR 20100008701 A KR20100008701 A KR 20100008701A KR 20100088578 A KR20100088578 A KR 20100088578A
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KR
South Korea
Prior art keywords
protective film
back surface
surface protective
wafer back
dicing tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020100008701A
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English (en)
Korean (ko)
Inventor
나오히데 다카모토
Original Assignee
닛토덴코 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛토덴코 가부시키가이샤 filed Critical 닛토덴코 가부시키가이샤
Publication of KR20100088578A publication Critical patent/KR20100088578A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1467—Coloring agent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Laser Beam Processing (AREA)
KR1020100008701A 2009-01-30 2010-01-29 다이싱 테이프 일체형 웨이퍼 이면 보호필름 Ceased KR20100088578A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2009-020458 2009-01-30
JP2009020458 2009-01-30
JPJP-P-2009-251126 2009-10-30
JP2009251126A JP5456441B2 (ja) 2009-01-30 2009-10-30 ダイシングテープ一体型ウエハ裏面保護フィルム

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020130116405A Division KR101563784B1 (ko) 2009-01-30 2013-09-30 반도체 디바이스의 제조 방법
KR1020140004961A Division KR20140012207A (ko) 2009-01-30 2014-01-15 다이싱 테이프 일체형 웨이퍼 이면 보호필름

Publications (1)

Publication Number Publication Date
KR20100088578A true KR20100088578A (ko) 2010-08-09

Family

ID=42397025

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020100008701A Ceased KR20100088578A (ko) 2009-01-30 2010-01-29 다이싱 테이프 일체형 웨이퍼 이면 보호필름
KR1020130116405A Expired - Fee Related KR101563784B1 (ko) 2009-01-30 2013-09-30 반도체 디바이스의 제조 방법
KR1020140004961A Ceased KR20140012207A (ko) 2009-01-30 2014-01-15 다이싱 테이프 일체형 웨이퍼 이면 보호필름
KR1020150053906A Expired - Fee Related KR101563846B1 (ko) 2009-01-30 2015-04-16 다이싱 테이프 일체형 웨이퍼 이면 보호필름

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020130116405A Expired - Fee Related KR101563784B1 (ko) 2009-01-30 2013-09-30 반도체 디바이스의 제조 방법
KR1020140004961A Ceased KR20140012207A (ko) 2009-01-30 2014-01-15 다이싱 테이프 일체형 웨이퍼 이면 보호필름
KR1020150053906A Expired - Fee Related KR101563846B1 (ko) 2009-01-30 2015-04-16 다이싱 테이프 일체형 웨이퍼 이면 보호필름

Country Status (5)

Country Link
US (1) US20100193969A1 (https=)
JP (1) JP5456441B2 (https=)
KR (4) KR20100088578A (https=)
CN (1) CN101794722B (https=)
TW (2) TWI609940B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101488587B1 (ko) * 2012-03-07 2015-02-02 후루카와 덴키 고교 가부시키가이샤 점착 테이프
KR102012905B1 (ko) * 2018-10-19 2019-08-22 (주)엠티아이 웨이퍼 가공용 테이프

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JP6144868B2 (ja) 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法
JP5023225B1 (ja) * 2011-03-10 2012-09-12 日東電工株式会社 半導体装置用フィルムの製造方法
US8507363B2 (en) * 2011-06-15 2013-08-13 Applied Materials, Inc. Laser and plasma etch wafer dicing using water-soluble die attach film
JP5820170B2 (ja) * 2011-07-13 2015-11-24 日東電工株式会社 半導体装置用の接着フィルム、フリップチップ型半導体裏面用フィルム、及び、ダイシングテープ一体型半導体裏面用フィルム
US20160176169A1 (en) * 2013-08-01 2016-06-23 Lintec Corporation Protective Film Formation-Use Composite Sheet
SG11201606008WA (en) * 2014-01-22 2016-08-30 Lintec Corp Protective film-forming film, sheet for protective film, complex sheet for forming protective film, and method of producing manufactured product
JP5978246B2 (ja) * 2014-05-13 2016-08-24 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法
JP2016111236A (ja) * 2014-12-08 2016-06-20 株式会社ディスコ ウエーハの加工方法
CN105778644B (zh) * 2014-12-15 2019-01-29 碁達科技股份有限公司 雷射切割用保护膜组成物及应用
JP6078581B2 (ja) * 2015-04-30 2017-02-08 日東電工株式会社 一体型フィルム、フィルム、半導体装置の製造方法および保護チップの製造方法
JP2016210837A (ja) * 2015-04-30 2016-12-15 日東電工株式会社 裏面保護フィルム、フィルム、半導体装置の製造方法および保護チップの製造方法
JP6571398B2 (ja) 2015-06-04 2019-09-04 リンテック株式会社 半導体用保護フィルム、半導体装置及び複合シート
TWI641494B (zh) 2015-11-04 2018-11-21 日商琳得科股份有限公司 第一保護膜形成用片、第一保護膜形成方法以及半導體晶片的製造方法
GB2551732B (en) * 2016-06-28 2020-05-27 Disco Corp Method of processing wafer
JP7007827B2 (ja) * 2017-07-28 2022-01-25 日東電工株式会社 ダイボンドフィルム、ダイシングダイボンドフィルム、および半導体装置製造方法
JP7313767B2 (ja) * 2019-04-10 2023-07-25 株式会社ディスコ ウェーハの加工方法
KR102417467B1 (ko) * 2019-05-10 2022-07-06 쇼와덴코머티리얼즈가부시끼가이샤 픽업성의 평가 방법, 다이싱·다이본딩 일체형 필름, 다이싱·다이본딩 일체형 필름의 평가 방법과 선별 방법, 및 반도체 장치의 제조 방법
CN110396379A (zh) * 2019-07-16 2019-11-01 湖北锂诺新能源科技有限公司 一种可进行激光喷码的锂离子电池保护胶带
CN113725169B (zh) * 2021-04-22 2024-06-14 成都芯源系统有限公司 倒装芯片封装单元及相关封装方法
CN113478110B (zh) * 2021-07-19 2022-03-04 无锡昌盛胶粘制品有限公司 一种非复合离型膜的用于银镜玻璃激光切割的保护膜
CN114774020B (zh) * 2022-05-07 2024-01-30 广东莱尔新材料科技股份有限公司 一种复合晶圆保护膜及其制备方法

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US20080131715A1 (en) * 2004-02-04 2008-06-05 Du Pont-Mitsui Polychemicals Co., Ltd. Resin Composition and Multi-Layer Article Thereof
US7452786B2 (en) * 2004-06-29 2008-11-18 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing thin film integrated circuit, and element substrate
JP4776188B2 (ja) * 2004-08-03 2011-09-21 古河電気工業株式会社 半導体装置製造方法およびウエハ加工用テープ
JP4642436B2 (ja) * 2004-11-12 2011-03-02 リンテック株式会社 マーキング方法および保護膜形成兼ダイシング用シート
JP4858678B2 (ja) * 2005-05-24 2012-01-18 ソニーケミカル＆インフォメーションデバイス株式会社 エステル基含有ポリ（イミド−アゾメチン）共重合体、エステル基含有ポリ（アミド酸−アゾメチン）共重合体及びポジ型感光性樹脂組成物
JP5456440B2 (ja) * 2009-01-30 2014-03-26 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP5805367B2 (ja) * 2009-01-30 2015-11-04 日東電工株式会社 ダイシングテープ一体型ウエハ裏面保護フィルム
JP6144868B2 (ja) * 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101488587B1 (ko) * 2012-03-07 2015-02-02 후루카와 덴키 고교 가부시키가이샤 점착 테이프
KR102012905B1 (ko) * 2018-10-19 2019-08-22 (주)엠티아이 웨이퍼 가공용 테이프
WO2020080707A1 (ko) * 2018-10-19 2020-04-23 (주)엠티아이 웨이퍼 가공용 테이프

Also Published As

Publication number Publication date
CN101794722A (zh) 2010-08-04
TW201506121A (zh) 2015-02-16
JP2010199542A (ja) 2010-09-09
TWI591150B (zh) 2017-07-11
JP5456441B2 (ja) 2014-03-26
KR101563846B1 (ko) 2015-10-27
KR20150045991A (ko) 2015-04-29
KR20130121781A (ko) 2013-11-06
KR101563784B1 (ko) 2015-10-27
KR20140012207A (ko) 2014-01-29
US20100193969A1 (en) 2010-08-05
TWI609940B (zh) 2018-01-01
CN101794722B (zh) 2012-08-08
TW201109410A (en) 2011-03-16

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St.27 status event code: A-3-3-R10-R18-oth-X000

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St.27 status event code: A-3-3-R10-R18-oth-X000

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St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000