TWI609940B - 使用切晶帶一體型晶圓背面保護膜製造半導體器件之方法 - Google Patents

使用切晶帶一體型晶圓背面保護膜製造半導體器件之方法 Download PDF

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Publication number
TWI609940B
TWI609940B TW099102715A TW99102715A TWI609940B TW I609940 B TWI609940 B TW I609940B TW 099102715 A TW099102715 A TW 099102715A TW 99102715 A TW99102715 A TW 99102715A TW I609940 B TWI609940 B TW I609940B
Authority
TW
Taiwan
Prior art keywords
protective film
wafer
backside protective
colored
dicing tape
Prior art date
Application number
TW099102715A
Other languages
English (en)
Chinese (zh)
Other versions
TW201109410A (en
Inventor
高本尚英
Naohide Takamoto
Original Assignee
日東電工股份有限公司
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工股份有限公司, Nitto Denko Corporation filed Critical 日東電工股份有限公司
Publication of TW201109410A publication Critical patent/TW201109410A/zh
Application granted granted Critical
Publication of TWI609940B publication Critical patent/TWI609940B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/401—Marks applied to devices, e.g. for alignment or identification for identification or tracking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1467—Coloring agent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Laser Beam Processing (AREA)
TW099102715A 2009-01-30 2010-01-29 使用切晶帶一體型晶圓背面保護膜製造半導體器件之方法 TWI609940B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009-020458 2009-01-30
JP2009020458 2009-01-30
JP2009-251126 2009-10-30
JP2009251126A JP5456441B2 (ja) 2009-01-30 2009-10-30 ダイシングテープ一体型ウエハ裏面保護フィルム

Publications (2)

Publication Number Publication Date
TW201109410A TW201109410A (en) 2011-03-16
TWI609940B true TWI609940B (zh) 2018-01-01

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
TW099102715A TWI609940B (zh) 2009-01-30 2010-01-29 使用切晶帶一體型晶圓背面保護膜製造半導體器件之方法
TW103136368A TWI591150B (zh) 2009-01-30 2010-01-29 切晶帶一體型晶圓背面保護膜、半導體器件之製造方法、覆晶安裝半導體器件

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103136368A TWI591150B (zh) 2009-01-30 2010-01-29 切晶帶一體型晶圓背面保護膜、半導體器件之製造方法、覆晶安裝半導體器件

Country Status (5)

Country Link
US (1) US20100193969A1 (https=)
JP (1) JP5456441B2 (https=)
KR (4) KR20100088578A (https=)
CN (1) CN101794722B (https=)
TW (2) TWI609940B (https=)

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JP5023225B1 (ja) * 2011-03-10 2012-09-12 日東電工株式会社 半導体装置用フィルムの製造方法
US8507363B2 (en) * 2011-06-15 2013-08-13 Applied Materials, Inc. Laser and plasma etch wafer dicing using water-soluble die attach film
JP5820170B2 (ja) * 2011-07-13 2015-11-24 日東電工株式会社 半導体装置用の接着フィルム、フリップチップ型半導体裏面用フィルム、及び、ダイシングテープ一体型半導体裏面用フィルム
CN103305142B (zh) * 2012-03-07 2016-01-20 古河电气工业株式会社 粘接带
US20160176169A1 (en) * 2013-08-01 2016-06-23 Lintec Corporation Protective Film Formation-Use Composite Sheet
SG11201606008WA (en) * 2014-01-22 2016-08-30 Lintec Corp Protective film-forming film, sheet for protective film, complex sheet for forming protective film, and method of producing manufactured product
JP5978246B2 (ja) * 2014-05-13 2016-08-24 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム、及び、半導体装置の製造方法
JP2016111236A (ja) * 2014-12-08 2016-06-20 株式会社ディスコ ウエーハの加工方法
CN105778644B (zh) * 2014-12-15 2019-01-29 碁達科技股份有限公司 雷射切割用保护膜组成物及应用
JP6078581B2 (ja) * 2015-04-30 2017-02-08 日東電工株式会社 一体型フィルム、フィルム、半導体装置の製造方法および保護チップの製造方法
JP2016210837A (ja) * 2015-04-30 2016-12-15 日東電工株式会社 裏面保護フィルム、フィルム、半導体装置の製造方法および保護チップの製造方法
JP6571398B2 (ja) 2015-06-04 2019-09-04 リンテック株式会社 半導体用保護フィルム、半導体装置及び複合シート
TWI641494B (zh) 2015-11-04 2018-11-21 日商琳得科股份有限公司 第一保護膜形成用片、第一保護膜形成方法以及半導體晶片的製造方法
GB2551732B (en) * 2016-06-28 2020-05-27 Disco Corp Method of processing wafer
JP7007827B2 (ja) * 2017-07-28 2022-01-25 日東電工株式会社 ダイボンドフィルム、ダイシングダイボンドフィルム、および半導体装置製造方法
KR102012905B1 (ko) * 2018-10-19 2019-08-22 (주)엠티아이 웨이퍼 가공용 테이프
JP7313767B2 (ja) * 2019-04-10 2023-07-25 株式会社ディスコ ウェーハの加工方法
KR102417467B1 (ko) * 2019-05-10 2022-07-06 쇼와덴코머티리얼즈가부시끼가이샤 픽업성의 평가 방법, 다이싱·다이본딩 일체형 필름, 다이싱·다이본딩 일체형 필름의 평가 방법과 선별 방법, 및 반도체 장치의 제조 방법
CN110396379A (zh) * 2019-07-16 2019-11-01 湖北锂诺新能源科技有限公司 一种可进行激光喷码的锂离子电池保护胶带
CN113725169B (zh) * 2021-04-22 2024-06-14 成都芯源系统有限公司 倒装芯片封装单元及相关封装方法
CN113478110B (zh) * 2021-07-19 2022-03-04 无锡昌盛胶粘制品有限公司 一种非复合离型膜的用于银镜玻璃激光切割的保护膜
CN114774020B (zh) * 2022-05-07 2024-01-30 广东莱尔新材料科技股份有限公司 一种复合晶圆保护膜及其制备方法

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JP6144868B2 (ja) * 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法

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Also Published As

Publication number Publication date
CN101794722A (zh) 2010-08-04
TW201506121A (zh) 2015-02-16
KR20100088578A (ko) 2010-08-09
JP2010199542A (ja) 2010-09-09
TWI591150B (zh) 2017-07-11
JP5456441B2 (ja) 2014-03-26
KR101563846B1 (ko) 2015-10-27
KR20150045991A (ko) 2015-04-29
KR20130121781A (ko) 2013-11-06
KR101563784B1 (ko) 2015-10-27
KR20140012207A (ko) 2014-01-29
US20100193969A1 (en) 2010-08-05
CN101794722B (zh) 2012-08-08
TW201109410A (en) 2011-03-16

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