JP5454414B2 - 厚膜導体形成用組成物、この組成物を用いて形成された厚膜導体、およびこの厚膜導体を用いたチップ抵抗器 - Google Patents

厚膜導体形成用組成物、この組成物を用いて形成された厚膜導体、およびこの厚膜導体を用いたチップ抵抗器 Download PDF

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JP5454414B2
JP5454414B2 JP2010183323A JP2010183323A JP5454414B2 JP 5454414 B2 JP5454414 B2 JP 5454414B2 JP 2010183323 A JP2010183323 A JP 2010183323A JP 2010183323 A JP2010183323 A JP 2010183323A JP 5454414 B2 JP5454414 B2 JP 5454414B2
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powder
thick film
film conductor
mass
composition
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Japanese (ja)
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JP2012043622A (ja
JP2012043622A5 (enrdf_load_stackoverflow
Inventor
直希 石山
慎吾 粟ヶ窪
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
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Priority to JP2010183323A priority Critical patent/JP5454414B2/ja
Priority to KR1020110075793A priority patent/KR101274927B1/ko
Priority to CN201110234203.3A priority patent/CN102426871B/zh
Priority to TW100129331A priority patent/TWI429609B/zh
Publication of JP2012043622A publication Critical patent/JP2012043622A/ja
Publication of JP2012043622A5 publication Critical patent/JP2012043622A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Glass Compositions (AREA)
JP2010183323A 2010-08-18 2010-08-18 厚膜導体形成用組成物、この組成物を用いて形成された厚膜導体、およびこの厚膜導体を用いたチップ抵抗器 Active JP5454414B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010183323A JP5454414B2 (ja) 2010-08-18 2010-08-18 厚膜導体形成用組成物、この組成物を用いて形成された厚膜導体、およびこの厚膜導体を用いたチップ抵抗器
KR1020110075793A KR101274927B1 (ko) 2010-08-18 2011-07-29 후막도체형성용 조성물, 이 조성물을 이용하여 형성된 후막도체 및 이 후막도체를 이용한 칩 저항기
CN201110234203.3A CN102426871B (zh) 2010-08-18 2011-08-12 厚膜导体形成用组合物、使用该组合物形成的厚膜导体及使用该厚膜导体的芯片电阻器
TW100129331A TWI429609B (zh) 2010-08-18 2011-08-17 厚膜導體形成用組成物、使用該組成物形成的厚膜導體及使用該厚膜導體的晶片電阻器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010183323A JP5454414B2 (ja) 2010-08-18 2010-08-18 厚膜導体形成用組成物、この組成物を用いて形成された厚膜導体、およびこの厚膜導体を用いたチップ抵抗器

Publications (3)

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JP2012043622A JP2012043622A (ja) 2012-03-01
JP2012043622A5 JP2012043622A5 (enrdf_load_stackoverflow) 2012-12-27
JP5454414B2 true JP5454414B2 (ja) 2014-03-26

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JP2010183323A Active JP5454414B2 (ja) 2010-08-18 2010-08-18 厚膜導体形成用組成物、この組成物を用いて形成された厚膜導体、およびこの厚膜導体を用いたチップ抵抗器

Country Status (4)

Country Link
JP (1) JP5454414B2 (enrdf_load_stackoverflow)
KR (1) KR101274927B1 (enrdf_load_stackoverflow)
CN (1) CN102426871B (enrdf_load_stackoverflow)
TW (1) TWI429609B (enrdf_load_stackoverflow)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6011006B2 (ja) * 2012-04-27 2016-10-19 ブラザー工業株式会社 液滴噴射装置
JP6114001B2 (ja) * 2012-10-26 2017-04-12 京セラ株式会社 導電性ペーストおよび回路基板ならびに電子装置
JP6201190B2 (ja) * 2014-04-25 2017-09-27 住友金属鉱山株式会社 厚膜導体形成用組成物及びそれを用いて得られる厚膜導体
CA2939537C (en) 2014-09-12 2017-07-18 Shoei Chemical Inc. Resistive composition
CN109065837B (zh) 2014-11-10 2021-08-24 株式会社村田制作所 锂离子导体、电池及电子装置
JP2016219256A (ja) * 2015-05-20 2016-12-22 住友金属鉱山株式会社 Ｃｕペースト組成物および厚膜導体
JP6952949B2 (ja) * 2016-10-04 2021-10-27 日本電気硝子株式会社 ホウケイ酸系ガラス、複合粉末材料及び複合粉末材料ペースト
WO2018190057A1 (ja) * 2017-04-14 2018-10-18 パナソニックＩｐマネジメント株式会社 チップ抵抗器
KR102639865B1 (ko) 2017-12-15 2024-02-22 스미토모 긴조쿠 고잔 가부시키가이샤 후막 도체 형성용 분말 조성물 및 후막 도체 형성용 페이스트
CN111453987B (zh) * 2019-01-21 2022-04-22 中国科学院过程工程研究所 一种与氧化铝完全化学相容的玻璃组合物、其制备方法和应用
CN110660544B (zh) * 2019-10-14 2021-09-28 安徽翔胜科技有限公司 一种抗环境气体腐蚀的电阻
CN112071465B (zh) * 2020-09-18 2022-04-08 西安宏星电子浆料科技股份有限公司 一种包含含镍的合金粉的抗银迁移片式电阻正面电极浆料
CN113782251A (zh) * 2021-09-09 2021-12-10 南京汇聚新材料科技有限公司 一种电极膏体和电极厚膜及其制备方法
CN118280627A (zh) * 2024-04-29 2024-07-02 江苏日御光伏新材料股份有限公司 一种TOPCon电池用低固含背面浆料，制备方法，电极及电池

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06223616A (ja) * 1993-01-27 1994-08-12 Sumitomo Metal Mining Co Ltd 導電ペースト用組成物
JPH0797269A (ja) * 1993-09-27 1995-04-11 Mitsubishi Materials Corp 低温焼結性セラミックスの製造方法
JP4432161B2 (ja) 1999-10-20 2010-03-17 株式会社村田製作所 ガラスセラミック基板の製造方法
US20060102228A1 (en) * 2004-11-12 2006-05-18 Ferro Corporation Method of making solar cell contacts
JP4466402B2 (ja) 2005-02-17 2010-05-26 住友金属鉱山株式会社 厚膜導体形成用組成物
JP2006294589A (ja) * 2005-03-17 2006-10-26 Sumitomo Metal Mining Co Ltd 抵抗ペースト及び抵抗体
ES2651625T3 (es) * 2007-04-25 2018-01-29 Heraeus Precious Metals North America Conshohocken Llc Formulaciones para conductores de película gruesa, que comprenden plata y níquel o aleaciones de plata y níquel y celdas solares fabricadas a partir de las mismas

Also Published As

Publication number Publication date
KR101274927B1 (ko) 2013-06-17
JP2012043622A (ja) 2012-03-01
TWI429609B (zh) 2014-03-11
KR20120017396A (ko) 2012-02-28
TW201213269A (en) 2012-04-01
CN102426871A (zh) 2012-04-25
CN102426871B (zh) 2015-07-01

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