JP5454310B2 - 基板貼り合わせ装置および基板貼り合わせ方法 - Google Patents

基板貼り合わせ装置および基板貼り合わせ方法 Download PDF

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JP5454310B2
JP5454310B2 JP2010085537A JP2010085537A JP5454310B2 JP 5454310 B2 JP5454310 B2 JP 5454310B2 JP 2010085537 A JP2010085537 A JP 2010085537A JP 2010085537 A JP2010085537 A JP 2010085537A JP 5454310 B2 JP5454310 B2 JP 5454310B2
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substrate
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distance
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JP2011216788A5 (https=
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義昭 鬼頭
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Nikon Corp
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JP2010085537A 2010-04-01 2010-04-01 基板貼り合わせ装置および基板貼り合わせ方法 Active JP5454310B2 (ja)

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JP2011216788A5 JP2011216788A5 (https=) 2013-07-18
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Publication number Priority date Publication date Assignee Title
JP6076098B2 (ja) * 2013-01-15 2017-02-08 株式会社アルバック アラインメント装置、及びアラインメント方法
JP2014154749A (ja) * 2013-02-12 2014-08-25 Olympus Corp 基板、半導体装置、撮像装置および基板の製造方法
EP3011589B9 (de) * 2013-06-17 2018-09-05 Ev Group E. Thallner GmbH Vorrichtung und verfahren zum ausrichten von substraten
EP3734650B1 (de) * 2016-08-29 2023-09-27 EV Group E. Thallner GmbH Verfahren und vorrichtung zum ausrichten von substraten
CN116387220B (zh) * 2021-12-22 2025-10-28 拓荆键科(海宁)半导体设备有限公司 用于校准晶圆对准的方法及系统
JP7495151B2 (ja) * 2022-10-03 2024-06-04 ボンドテック株式会社 アライメント装置およびアライメント方法

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JP4978505B2 (ja) * 2008-02-19 2012-07-18 株式会社ニコン 接合装置および製造方法
WO2010023935A1 (ja) * 2008-08-29 2010-03-04 株式会社ニコン 基板位置合わせ装置、基板位置合わせ方法および積層型半導体の製造方法

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