JP5449597B2 - 接触端子 - Google Patents
接触端子 Download PDFInfo
- Publication number
- JP5449597B2 JP5449597B2 JP2013088790A JP2013088790A JP5449597B2 JP 5449597 B2 JP5449597 B2 JP 5449597B2 JP 2013088790 A JP2013088790 A JP 2013088790A JP 2013088790 A JP2013088790 A JP 2013088790A JP 5449597 B2 JP5449597 B2 JP 5449597B2
- Authority
- JP
- Japan
- Prior art keywords
- main body
- plunger pin
- body case
- coil spring
- contact terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000002093 peripheral effect Effects 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 4
- 230000006835 compression Effects 0.000 description 8
- 238000007906 compression Methods 0.000 description 8
- 230000004308 accommodation Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000087 stabilizing effect Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013088790A JP5449597B2 (ja) | 2011-09-05 | 2013-04-19 | 接触端子 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011192407 | 2011-09-05 | ||
| JP2011192407 | 2011-09-05 | ||
| JP2013088790A JP5449597B2 (ja) | 2011-09-05 | 2013-04-19 | 接触端子 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011271985A Division JP5280511B2 (ja) | 2011-09-05 | 2011-12-13 | 接触端子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013148594A JP2013148594A (ja) | 2013-08-01 |
| JP2013148594A5 JP2013148594A5 (enExample) | 2013-11-28 |
| JP5449597B2 true JP5449597B2 (ja) | 2014-03-19 |
Family
ID=49046186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013088790A Active JP5449597B2 (ja) | 2011-09-05 | 2013-04-19 | 接触端子 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5449597B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016153757A (ja) * | 2015-02-20 | 2016-08-25 | ピエゾパーツ株式会社 | 成膜センサーユニット |
| JP6658048B2 (ja) * | 2016-02-15 | 2020-03-04 | 富士ゼロックス株式会社 | 検査装置、検査装置の製造方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54129750U (enExample) * | 1978-03-01 | 1979-09-08 | ||
| JPS5872668U (ja) | 1981-11-12 | 1983-05-17 | 株式会社ヨコオ | 導電接触針装置 |
| JPS597571U (ja) * | 1982-07-07 | 1984-01-18 | 富士通株式会社 | 接触ピン |
| JPH0342377Y2 (enExample) | 1985-11-01 | 1991-09-05 | ||
| JPH047589Y2 (enExample) * | 1986-08-01 | 1992-02-27 | ||
| JP2567591Y2 (ja) | 1991-11-15 | 1998-04-02 | プレシジョンスプリング株式会社 | コンタクトプローブ |
| JPH0661321A (ja) | 1992-08-12 | 1994-03-04 | Hitachi Ltd | コンタクトプローブピンおよび半導体検査装置 |
| JPH06168756A (ja) | 1992-11-30 | 1994-06-14 | Nec Kansai Ltd | コンタクトピン |
| JPH0734375U (ja) * | 1993-11-29 | 1995-06-23 | ビー・エル・オートテック株式会社 | コンタクトプローブ |
| JP2002040049A (ja) | 2000-07-19 | 2002-02-06 | Suncall Corp | コンタクトプローブ |
| US6696850B1 (en) * | 2002-10-02 | 2004-02-24 | Interconnect Devices, Inc. | Contact probe with off-centered back-drilled aperture |
| JP2004179066A (ja) | 2002-11-28 | 2004-06-24 | Yamaichi Electronics Co Ltd | コネクタ装置 |
| JP5280511B2 (ja) * | 2011-09-05 | 2013-09-04 | 株式会社島野製作所 | 接触端子 |
-
2013
- 2013-04-19 JP JP2013088790A patent/JP5449597B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013148594A (ja) | 2013-08-01 |
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