JP5439451B2 - 塗布装置及び塗布方法 - Google Patents
塗布装置及び塗布方法 Download PDFInfo
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- JP5439451B2 JP5439451B2 JP2011208426A JP2011208426A JP5439451B2 JP 5439451 B2 JP5439451 B2 JP 5439451B2 JP 2011208426 A JP2011208426 A JP 2011208426A JP 2011208426 A JP2011208426 A JP 2011208426A JP 5439451 B2 JP5439451 B2 JP 5439451B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/04—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the spray heads being moved during spraying operation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/002—Pretreatement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0466—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being a non-reacting gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/10—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by other chemical means
- B05D3/104—Pretreatment of other substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
以下、第1実施形態かかる塗布装置及び塗布方法について、図1乃至5を参照して説明する。各図中矢印X,Y,Zはそれぞれ互いに直交する3方向を示す。また、各図において説明のため、適宜構成を拡大、縮小または省略して示している。
以下に、本願出願の当初の特許請求の範囲に記載された発明を付記する。
[1] 塗布対象物を支持するステージと、
前記ステージに対して相対移動可能であり、前記ステージ上の塗布対象物に塗布材料を吐出する材料吐出部と、前記材料吐出部とともに前記ステージに対して相対移動可能であり、前記ステージ上の塗布対象物に気体を噴射する気体噴射部と、を一体に備える塗布ヘッドと、
を備えたことを特徴とする塗布装置。
[2] 前記塗布ヘッドは、前記材料吐出部と前記気体噴射部との離間距離が調節可能であるとともに、前記ステージの面に直交する回転軸を中心に回転可能に構成され、
前記回転により、前記材料吐出部と前記気体噴射部との前後位置を変更可能であることを特徴とする[1]記載の塗布装置。
[3] 塗布対象物に対して塗布ヘッドを相対移動させながら、前記塗布ヘッドに設けられた材料吐出部から塗布材料を吐出するとともに、前記塗布ヘッドに設けられた気体噴射部から気体を供給することを特徴とする塗布方法。
[4] 前記気体噴射部が前記液体吐出部の塗布方向の前方に配置された状態で、前記相対移動に伴って、前記気体の噴射と前記材料吐出とが塗布対象物に順次行われ、
前記気体は前記塗布材料の溶媒、前記塗布材料に対して相溶性がある液体、または前記塗布材料に対して親和性を有する材料を含有した液体、の蒸気であることを特徴とする[3]記載の塗布方法。
[5] 前記気体噴射部が前記液体吐出部の塗布方向の後方に配置された状態で、前記相対移動に伴って、前記材料吐出と前記気体の噴射とが塗布対象物に順次行われ、
前記気体は前記塗布材料の溶媒、または前記塗布材料に対して相溶性がある液体、の蒸気であることを特徴とする[3]記載の塗布方法。
7b…ノズル孔、8…蒸気噴射ノズル、8b…ノズル孔、9…連結部、10…制御部。
Claims (4)
- 塗布対象物を支持するステージと、
前記ステージに対して相対移動可能であり、前記ステージ上の塗布対象物に塗布材料を吐出する材料吐出部と、前記材料吐出部とともに前記ステージに対して相対移動可能であり、前記ステージ上の塗布対象物に気体を噴射する気体噴射部と、を一体に備える塗布ヘッドと、
を備え、
前記塗布ヘッドは、前記材料吐出部と前記気体噴射部との離間距離が調節可能であるとともに、前記ステージの面に直交する回転軸を中心に回転可能に構成され、
前記回転により、前記材料吐出部と前記気体噴射部との前後位置を変更可能であることを特徴とする塗布装置。 - ステージに対して相対移動可能であり、前記ステージ上の塗布対象物に塗布材料を吐出する材料吐出部と、前記材料吐出部とともに前記ステージに対して相対移動可能であり、前記ステージ上の塗布対象物に気体を噴射する気体噴射部と、を一体に備え、前記材料吐出部と前記気体噴射部との離間距離が調節可能であるとともに、前記ステージの面に直交する回転軸を中心に回転可能に構成され、前記回転により、前記材料吐出部と前記気体噴射部との前後位置を変更可能である塗布ヘッドを、前記ステージに支持された前記塗布対象物に対して相対移動させながら、前記材料吐出部から前記塗布材料を吐出するとともに、前記気体噴射部から気体を供給することを特徴とする塗布方法。
- 前記気体噴射部が前記液体吐出部の塗布方向の前方に配置された状態で、前記相対移動に伴って、前記気体の噴射と前記材料吐出とが塗布対象物に順次行われ、
前記気体は前記塗布材料の溶媒、前記塗布材料に対して相溶性がある液体、または前記塗布材料に対して親和性を有する材料を含有した液体、の蒸気であることを特徴とする請求項2記載の塗布方法。 - 前記気体噴射部が前記液体吐出部の塗布方向の後方に配置された状態で、前記相対移動に伴って、前記材料吐出と前記気体の噴射とが塗布対象物に順次行われ、
前記気体は前記塗布材料の溶媒、または前記塗布材料に対して相溶性がある液体、の蒸気であることを特徴とする請求項2記載の塗布方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011208426A JP5439451B2 (ja) | 2011-09-26 | 2011-09-26 | 塗布装置及び塗布方法 |
TW101132073A TWI475327B (zh) | 2011-09-26 | 2012-09-03 | 塗佈裝置及塗佈方法 |
US13/609,893 US20130078378A1 (en) | 2011-09-26 | 2012-09-11 | Coating apparatus and coating method |
KR1020120101326A KR101366434B1 (ko) | 2011-09-26 | 2012-09-13 | 도포 장치 및 도포 방법 |
CN201210342345.6A CN103008175B (zh) | 2011-09-26 | 2012-09-14 | 涂覆设备和涂覆方法 |
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---|---|---|---|
JP2011208426A JP5439451B2 (ja) | 2011-09-26 | 2011-09-26 | 塗布装置及び塗布方法 |
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JP2013066864A JP2013066864A (ja) | 2013-04-18 |
JP5439451B2 true JP5439451B2 (ja) | 2014-03-12 |
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JP2011208426A Active JP5439451B2 (ja) | 2011-09-26 | 2011-09-26 | 塗布装置及び塗布方法 |
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US (1) | US20130078378A1 (ja) |
JP (1) | JP5439451B2 (ja) |
KR (1) | KR101366434B1 (ja) |
CN (1) | CN103008175B (ja) |
TW (1) | TWI475327B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6160307B2 (ja) * | 2013-07-01 | 2017-07-12 | コニカミノルタ株式会社 | マトリックス型電極基板の製造方法及びタッチパネル |
KR102628875B1 (ko) * | 2015-09-15 | 2024-01-25 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치, 기판 처리 방법 및 기억 매체 |
JP6688695B2 (ja) * | 2016-06-24 | 2020-04-28 | 株式会社ディスコ | 保護膜被覆装置および保護膜被覆方法 |
CN106694319B (zh) * | 2017-03-22 | 2019-06-18 | 京东方科技集团股份有限公司 | 曲面涂布装置及涂胶设备 |
CN107812673B (zh) * | 2017-10-19 | 2020-01-31 | 苏州协鑫纳米科技有限公司 | 钙钛矿薄膜的涂布装置 |
JP6931849B2 (ja) * | 2018-02-01 | 2021-09-08 | パナソニックIpマネジメント株式会社 | 塗工方法および塗工装置 |
CN109517413B (zh) * | 2018-12-29 | 2023-12-26 | 南通南京大学材料工程技术研究院 | 一种热敏基材静电喷涂前导电涂层及其制备和装置 |
CN113804530B (zh) * | 2021-11-19 | 2022-03-29 | 深圳市微升液路技术有限公司 | 一种梅毒血液样品环状卡片试验的样品前处理装置 |
CN116393336B (zh) * | 2023-06-09 | 2023-08-18 | 太原科技大学 | 用于磁致伸缩材料薄膜基体旋转涂布的夹具及其使用方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08293452A (ja) * | 1995-04-25 | 1996-11-05 | Mitsubishi Electric Corp | レジスト塗布装置 |
JP3842487B2 (ja) * | 1998-06-19 | 2006-11-08 | 株式会社東芝 | 成膜装置 |
JP3873516B2 (ja) * | 1999-03-31 | 2007-01-24 | セイコーエプソン株式会社 | レジスト塗布装置およびレジスト塗布方法 |
JP3782294B2 (ja) | 1999-08-10 | 2006-06-07 | 東京エレクトロン株式会社 | レジスト塗布処理装置およびレジスト塗布処理方法 |
JP2001307991A (ja) * | 2000-04-25 | 2001-11-02 | Tokyo Electron Ltd | 膜形成方法 |
JP3808741B2 (ja) * | 2001-10-01 | 2006-08-16 | 東京エレクトロン株式会社 | 処理装置 |
JP3842221B2 (ja) * | 2003-01-08 | 2006-11-08 | 東京エレクトロン株式会社 | 塗布装置 |
US7488389B2 (en) * | 2004-03-26 | 2009-02-10 | Fujifilm Corporation | Nozzle device, film forming apparatus and method using the same, inorganic electroluminescence device, inkjet head, and ultrasonic transducer array |
JP2007019437A (ja) * | 2005-07-11 | 2007-01-25 | Sony Corp | 回転塗布装置および回転塗布方法 |
KR101242989B1 (ko) * | 2008-11-05 | 2013-03-12 | 가부시끼가이샤 도시바 | 성막 장치, 성막 방법 및 반도체 장치 |
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2011
- 2011-09-26 JP JP2011208426A patent/JP5439451B2/ja active Active
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2012
- 2012-09-03 TW TW101132073A patent/TWI475327B/zh active
- 2012-09-11 US US13/609,893 patent/US20130078378A1/en not_active Abandoned
- 2012-09-13 KR KR1020120101326A patent/KR101366434B1/ko active IP Right Grant
- 2012-09-14 CN CN201210342345.6A patent/CN103008175B/zh active Active
Also Published As
Publication number | Publication date |
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CN103008175A (zh) | 2013-04-03 |
KR20130033298A (ko) | 2013-04-03 |
CN103008175B (zh) | 2015-07-08 |
US20130078378A1 (en) | 2013-03-28 |
TWI475327B (zh) | 2015-03-01 |
KR101366434B1 (ko) | 2014-02-24 |
JP2013066864A (ja) | 2013-04-18 |
TW201324058A (zh) | 2013-06-16 |
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