JP5438114B2 - 材料ボンディングのための方法およびシステム - Google Patents

材料ボンディングのための方法およびシステム Download PDF

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JP5438114B2
JP5438114B2 JP2011527336A JP2011527336A JP5438114B2 JP 5438114 B2 JP5438114 B2 JP 5438114B2 JP 2011527336 A JP2011527336 A JP 2011527336A JP 2011527336 A JP2011527336 A JP 2011527336A JP 5438114 B2 JP5438114 B2 JP 5438114B2
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intermetallic layer
layer
solder material
intermetallic
conductive material
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JP2012503321A5 (enExample
JP2012503321A (ja
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チャン・ウェンキ
エリック・ベイネ
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Interuniversitair Microelektronica Centrum vzw IMEC
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Interuniversitair Microelektronica Centrum vzw IMEC
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
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    • H01L2924/30105—Capacitance

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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
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WO2010031845A1 (en) 2010-03-25
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