JP5437179B2 - 半導体パッケージ及びその製造方法 - Google Patents

半導体パッケージ及びその製造方法 Download PDF

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Publication number
JP5437179B2
JP5437179B2 JP2010147951A JP2010147951A JP5437179B2 JP 5437179 B2 JP5437179 B2 JP 5437179B2 JP 2010147951 A JP2010147951 A JP 2010147951A JP 2010147951 A JP2010147951 A JP 2010147951A JP 5437179 B2 JP5437179 B2 JP 5437179B2
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Prior art keywords
upper substrate
semiconductor element
semiconductor package
resin
hole
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JP2010147951A
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Japanese (ja)
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JP2012015192A5 (enExample
JP2012015192A (ja
Inventor
信幸 倉嶋
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2010147951A priority Critical patent/JP5437179B2/ja
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Publication of JP2012015192A5 publication Critical patent/JP2012015192A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2010147951A 2010-06-29 2010-06-29 半導体パッケージ及びその製造方法 Active JP5437179B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010147951A JP5437179B2 (ja) 2010-06-29 2010-06-29 半導体パッケージ及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010147951A JP5437179B2 (ja) 2010-06-29 2010-06-29 半導体パッケージ及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012015192A JP2012015192A (ja) 2012-01-19
JP2012015192A5 JP2012015192A5 (enExample) 2013-05-16
JP5437179B2 true JP5437179B2 (ja) 2014-03-12

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Family Applications (1)

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JP2010147951A Active JP5437179B2 (ja) 2010-06-29 2010-06-29 半導体パッケージ及びその製造方法

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JP (1) JP5437179B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5945326B2 (ja) * 2012-07-30 2016-07-05 パナソニック株式会社 放熱構造を備えた半導体装置
KR102486784B1 (ko) 2016-08-26 2023-01-09 삼성전기주식회사 반도체 패키지
KR102554690B1 (ko) * 2018-11-06 2023-07-13 삼성전자주식회사 반도체 패키지
TWI733569B (zh) * 2020-08-27 2021-07-11 矽品精密工業股份有限公司 電子封裝件及其製法
KR102921409B1 (ko) * 2021-11-30 2026-02-02 삼성전기주식회사 반도체 패키지

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004014863A (ja) * 2002-06-07 2004-01-15 Mitsubishi Electric Corp 電力用半導体装置
JP3934565B2 (ja) * 2003-02-21 2007-06-20 富士通株式会社 半導体装置
JP2004363568A (ja) * 2003-05-09 2004-12-24 Matsushita Electric Ind Co Ltd 回路素子内蔵モジュール
JP2009110979A (ja) * 2007-10-26 2009-05-21 Shinko Electric Ind Co Ltd 発熱電子部品内装の配線基板及びその製造方法

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Publication number Publication date
JP2012015192A (ja) 2012-01-19

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