JP2012015192A5 - - Google Patents
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- Publication number
- JP2012015192A5 JP2012015192A5 JP2010147951A JP2010147951A JP2012015192A5 JP 2012015192 A5 JP2012015192 A5 JP 2012015192A5 JP 2010147951 A JP2010147951 A JP 2010147951A JP 2010147951 A JP2010147951 A JP 2010147951A JP 2012015192 A5 JP2012015192 A5 JP 2012015192A5
- Authority
- JP
- Japan
- Prior art keywords
- upper substrate
- resin
- semiconductor package
- heat dissipation
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 55
- 239000004065 semiconductor Substances 0.000 claims description 51
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 230000017525 heat dissipation Effects 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 4
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 239000000945 filler Substances 0.000 claims 4
- 238000000465 moulding Methods 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 230000001681 protective effect Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010147951A JP5437179B2 (ja) | 2010-06-29 | 2010-06-29 | 半導体パッケージ及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010147951A JP5437179B2 (ja) | 2010-06-29 | 2010-06-29 | 半導体パッケージ及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012015192A JP2012015192A (ja) | 2012-01-19 |
| JP2012015192A5 true JP2012015192A5 (enExample) | 2013-05-16 |
| JP5437179B2 JP5437179B2 (ja) | 2014-03-12 |
Family
ID=45601311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010147951A Active JP5437179B2 (ja) | 2010-06-29 | 2010-06-29 | 半導体パッケージ及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5437179B2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5945326B2 (ja) * | 2012-07-30 | 2016-07-05 | パナソニック株式会社 | 放熱構造を備えた半導体装置 |
| KR102486784B1 (ko) | 2016-08-26 | 2023-01-09 | 삼성전기주식회사 | 반도체 패키지 |
| KR102554690B1 (ko) * | 2018-11-06 | 2023-07-13 | 삼성전자주식회사 | 반도체 패키지 |
| TWI733569B (zh) * | 2020-08-27 | 2021-07-11 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
| KR102921409B1 (ko) * | 2021-11-30 | 2026-02-02 | 삼성전기주식회사 | 반도체 패키지 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004014863A (ja) * | 2002-06-07 | 2004-01-15 | Mitsubishi Electric Corp | 電力用半導体装置 |
| JP3934565B2 (ja) * | 2003-02-21 | 2007-06-20 | 富士通株式会社 | 半導体装置 |
| JP2004363568A (ja) * | 2003-05-09 | 2004-12-24 | Matsushita Electric Ind Co Ltd | 回路素子内蔵モジュール |
| JP2009110979A (ja) * | 2007-10-26 | 2009-05-21 | Shinko Electric Ind Co Ltd | 発熱電子部品内装の配線基板及びその製造方法 |
-
2010
- 2010-06-29 JP JP2010147951A patent/JP5437179B2/ja active Active
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