JP5429300B2 - 複合部材 - Google Patents
複合部材 Download PDFInfo
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- JP5429300B2 JP5429300B2 JP2011537207A JP2011537207A JP5429300B2 JP 5429300 B2 JP5429300 B2 JP 5429300B2 JP 2011537207 A JP2011537207 A JP 2011537207A JP 2011537207 A JP2011537207 A JP 2011537207A JP 5429300 B2 JP5429300 B2 JP 5429300B2
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- JP
- Japan
- Prior art keywords
- adhesive
- thermoplastic polyurethane
- epoxy resin
- molecular weight
- seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002131 composite material Substances 0.000 title claims description 12
- 239000000853 adhesive Substances 0.000 claims description 57
- 230000001070 adhesive effect Effects 0.000 claims description 57
- 239000000428 dust Substances 0.000 claims description 36
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 29
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 29
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000005011 phenolic resin Substances 0.000 claims description 9
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 8
- 150000002009 diols Chemical class 0.000 claims description 8
- 230000009477 glass transition Effects 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 7
- 239000004417 polycarbonate Substances 0.000 claims description 7
- 229920000515 polycarbonate Polymers 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 238000000113 differential scanning calorimetry Methods 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 5
- 239000004970 Chain extender Substances 0.000 claims description 4
- 150000002460 imidazoles Chemical class 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 238000012360 testing method Methods 0.000 description 12
- 239000000243 solution Substances 0.000 description 11
- 229910000831 Steel Inorganic materials 0.000 description 9
- 229920002635 polyurethane Polymers 0.000 description 9
- 239000004814 polyurethane Substances 0.000 description 9
- 239000010959 steel Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 239000007787 solid Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- -1 3-aminopropyl group Chemical group 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 150000002596 lactones Chemical class 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 150000003077 polyols Chemical class 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000007665 sagging Methods 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 239000010720 hydraulic oil Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- LRXTYHSAJDENHV-UHFFFAOYSA-H zinc phosphate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LRXTYHSAJDENHV-UHFFFAOYSA-H 0.000 description 2
- 229910000165 zinc phosphate Inorganic materials 0.000 description 2
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- KKKDZZRICRFGSD-UHFFFAOYSA-N 1-benzylimidazole Chemical compound C1=CN=CN1CC1=CC=CC=C1 KKKDZZRICRFGSD-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000012844 infrared spectroscopy analysis Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14311—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using means for bonding the coating to the articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/095—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/44—Polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2581/00—Seals; Sealing equipment; Gaskets
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Sealing Devices (AREA)
Description
XnSi(OR)4-n
R:炭素数1〜3のアルキル基
X:3-アミノプロピル基、N-β-(アミノエチル)-γ-アミ
ノプロピル基、N-フェニル-3-アミノプロピル基、3-
メタクリロキシプロピル基、3-グリシドキシプロピ
ル基、3-メルカプトプロピル基またはビニル基
n:1〜3の整数
で表わされ、具体的には、例えば3-アミノプロピルトリエトキシシラン、3-アミノプロピルトリメトキシシラン、N-β-(アミノエチル)-γ-アミノプロピルトリエトキシシラン、N-β-(アミノエチル)-γ-アミノプロピルトリメトキシシラン、3-グリシドキシプロピルトリメトキシシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン等が用いられる。
ポリカーボネート系ポリオール(日本ポリウレタン製品ニッポラン980;数平均分子量Mn約2000、OH価56.1)400gを110℃で溶融した後、110℃で45分間減圧乾燥した。これを、120℃に予熱した反応器に仕込み、攪拌しながらトリジンジイソシアネート211g(ポリカーボネート系ポリオール100重量部当り53重量部、NCO/OH比1.10)を加えて30分間反応させてプレポリマーを形成させ、このプレポリマーを攪拌しながら1,4-ブタンジオール47g(ポリカーボネート系ポリオール100重量部当り11.8重量部)を加えて60秒間攪拌した。その後、反応混合物を反応器から熱板上に注いで硬化させ、硬化物を100℃のオーブン中に入れて15時間放置し、冷却して、熱可塑性ポリウレタンを得た。
示差走査熱熱量測定(DSC):10〜20mgの測定用小片サンプルについて、パーキンエルマー製DSC7を用い、窒素ガス雰囲気下、10℃/分の昇温速度で、Tg(ガラス転移点)およびΔH(エンタルピー)の値を測定
Tg=207℃、ΔH=7.1J/gという値が得られた
成形性:東洋精機製キャピログラフC1を用い、温度230℃、せん断速度121.6/秒の条件下で溶融粘度を測定すると共に、射出成形性についてはウェルドラインなしを○、ウェルドラインありを△と評価
溶融粘度234Pa・sec、射出成形性○という結果が得られた
成形品物性:ASTD D-412-83に準拠して、硬度、破断時強度および破断時伸びを測定すると共に、80℃、100℃または120℃での70時間、25%圧縮時の圧縮永久歪を測定
硬度(JIS-A) A94、破断時強度44.7MPa、破断時伸び528%という値が得られた
圧縮永久歪 80℃、70時間:40%
100℃、70時間:44%
120℃、70時間:67%
という値が得られた
耐摩擦性:ダフニーハイドロウリックフルイド#46油中、温度100℃、周速667mm/秒、荷重294.2Nの条件下で鈴木式摩擦試験を行い、静摩擦係数と動摩擦係数を測定
静摩擦係数0.24、動摩擦係数0.10という値が得られた
赤外分光分析:NCO/C=C(芳香族基)比
NCO/C=C(芳香族基)比=0.05という値が得られた
リン酸亜鉛処理を施したSPCC鋼板(25×60×1.6mm)上に、上記参考例で得られた熱可塑性ポリウレタン粉砕物を、射出成形機を用い、ノズル部温度230℃、シリンダ部温度180℃の成形条件下で、厚さ2mmになるように射出成形を行い、鋼板と接着させた後、積層シートを150℃の空気循環式オーブン中で72時間熱処理して、テストピースを作製した。
ビスフェノールA型エポキシ樹脂系接着剤 90重量%
(ジャパンエポキシレジン製品1001)
3-アミノプロピルトリエトキシシラン 9重量%
メチルイミダゾール 1重量%
90°剥離試験:ASTM D429、ISO 8510-1に対応するJIS K6854-1に準拠
して、鋼板とポリウレタン層との間の剥離強度を測定
大気中放置試験:ASTM D573、ISO 188に対応するJIS K6257に準拠し
て、100℃の大気中に500時間放置後の剥離強度変化
率を下記基準に従って評価
水中浸漬試験:ASTM D471、ISO 1817に対応するJIS K6258に準拠して
、25℃の水中に1000時間浸漬後の剥離強度変化率を下
記基準に従って評価
(評価基準) ◎:剥離強度変化率が20%以下
○:剥離強度変化率が20〜40%
△:剥離強度変化率が40〜60%
×:剥離強度変化率が60%以上
実施例1において、接合用接着剤溶液を塗布する前に、フェノール樹脂・エポキシ樹脂含有接着剤(東洋化学研究所製品メタロックPH-50)が下塗り接着剤溶液(固形分濃度16重量%)として塗布され、180℃で10分間焼付け処理されたSPCC鋼板が用いられた。
実施例1において、ビスフェノールA型エポキシ樹脂系接着剤99重量%およびメチルイミダゾール1重量%よりなる接着剤溶液(固形分濃度21重量%)が用いられた。
実施例1において、フェノール樹脂系接着剤(ロード・ファー・イースト・インコーポレイテッド製品ケムロック219)が接着剤溶液(固形分濃度21重量%)として用いられ、それの焼付け処理が150℃で25分間行われた。
実施例1において、フェノキシ型エポキシ樹脂系接着剤(同社製品ケムロック210)が接着剤溶液(固形分濃度21重量%)として用いられた。
表
例 剥離強度(kN/m) 大気中放置試験 水中浸漬試験
実施例1 31 ◎ ○
〃 2 31 ◎ ◎
比較例1 31 ◎ △
〃 2 14 △ ×
〃 3 5 △ ×
(1) 接合用接着剤をビスフェノールA型エポキシ樹脂とシランカップリング剤とのブレンド系接着剤とすることにより、鋼板と特定の熱可塑性ポリウレタンとの間に良好な接着性を得ることができる(実施例1)。
(2) 下塗り接着剤として、フェノール樹脂・エポキシ樹脂含有接着剤を用いると、耐水性がさらに向上する(実施例2)。
(3) 従来のフェノール樹脂系接着剤を接合用接着剤として用いると、接着性や耐水性が悪く(比較例2)、これに比べてビスフェノールA型エポキシ樹脂系接着剤およびメチルイミダゾールよりなる接合用接着剤を用いた場合には、接着性は向上するが、耐水性の点で未だ十分とはいえない(比較例1)。
(4) ビスフェノールA型エポキシ樹脂ではないフェノキシ型エポキシ樹脂系接着剤を接合用接着剤として用いた場合には、接着性が著しく低下するばかりではなく、耐水性の点でも劣っている(比較例3)。
実施例1、2で用いられた接着剤を使用してダストシール(DKBI型ダストシール)を作製し、25℃の水中に250時間、500時間および1000時間浸漬した後、ダストシール試験片一端部のSPCC製環部品積層部分を万力で挟み付けて固定した状態で、ダストシール試験片他端部のSPCC製環部品とそこに接着、積層された熱可塑性ポリウレタン製成形部品との剥離試験を行ったが、いずれの場合にも剥離力200Nで引張っても剥離はみられず、良好な接着性が示された。
Claims (4)
- (A)数平均分子量Mnが500〜6000の高分子量ポリカーボネートジオール、(B)芳香族ジイソシアネートおよび(C)鎖伸長剤としての低分子量ジオールをNCO/OH比0.95〜1.20で反応させて得られた熱可塑性ポリウレタン製部品を、示差走査熱量測定によるハード相ガラス転移点(Tg)が170〜230℃でかつTgの吸熱ピークの面積(ΔH)が5J/g以上となるような条件下で加熱処理した熱可塑性ポリウレタン製部品と金属製部品とを、ビスフェノールA型エポキシ樹脂を75〜95重量%、シランカップリング剤を2〜20重量%およびイミダゾール類硬化剤を0.3〜3重量%の割合で含有する接合用接着剤で接着させた、往復動する2部材間の環状隙間に流体圧側から外部側へバッファリング、ロッドシールおよびダストシールを順番に配置した構成を有するロッドシーリング構造におけるダストシールとして用いられる複合部材。
- 接合用接着剤の塗布に先立って、フェノール樹脂およびエポキシ樹脂を含有する接着剤を下塗り接着剤として塗布して用いた請求項1記載の複合部材。
- 加熱処理が、金属製部品に熱可塑性ポリウレタンを射出成形して接着一体化した後加熱処理することにより行われた請求項1記載の複合部材。
- 加熱処理が135〜170℃で10〜100時間行われた請求項3記載の複合材料。
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JP2001260235A (ja) * | 2000-03-22 | 2001-09-25 | Yokohama Rubber Co Ltd:The | ゴムと金属との接着方法、および、これを用いた構造体 |
JP2004059796A (ja) * | 2002-07-30 | 2004-02-26 | Koa Corp | エポキシ接着剤 |
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JPH10298527A (ja) * | 1997-04-24 | 1998-11-10 | Asahi Denka Kogyo Kk | エポキシ樹脂系接着性組成物 |
JP2001260233A (ja) * | 2000-03-15 | 2001-09-25 | Bridgestone Corp | ゴムと金属との加硫接着方法 |
JP2001355739A (ja) * | 2000-06-13 | 2001-12-26 | Nok Corp | シーリングシステム |
JP2004250463A (ja) * | 2003-02-18 | 2004-09-09 | Nok Corp | 加硫接着剤組成物 |
WO2007066630A1 (ja) * | 2005-12-06 | 2007-06-14 | Nok Corporation | ロッドシーリングシステム |
WO2008023568A1 (fr) * | 2006-08-22 | 2008-02-28 | Nok Corporation | Joint collé pour piston |
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