JP5428748B2 - 検査用治具のメンテナンス方法及び基板検査装置 - Google Patents

検査用治具のメンテナンス方法及び基板検査装置 Download PDF

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Publication number
JP5428748B2
JP5428748B2 JP2009242875A JP2009242875A JP5428748B2 JP 5428748 B2 JP5428748 B2 JP 5428748B2 JP 2009242875 A JP2009242875 A JP 2009242875A JP 2009242875 A JP2009242875 A JP 2009242875A JP 5428748 B2 JP5428748 B2 JP 5428748B2
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JP
Japan
Prior art keywords
inspection
resistance value
contact
contacts
pair
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Application number
JP2009242875A
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English (en)
Japanese (ja)
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JP2011089858A (ja
Inventor
朋果 苅谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nidec Read Corp
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Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Priority to JP2009242875A priority Critical patent/JP5428748B2/ja
Priority to KR1020100097257A priority patent/KR101157878B1/ko
Priority to TW099135059A priority patent/TWI404949B/zh
Publication of JP2011089858A publication Critical patent/JP2011089858A/ja
Application granted granted Critical
Publication of JP5428748B2 publication Critical patent/JP5428748B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/28—Provision in measuring instruments for reference values, e.g. standard voltage, standard waveform
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2009242875A 2009-10-21 2009-10-21 検査用治具のメンテナンス方法及び基板検査装置 Active JP5428748B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009242875A JP5428748B2 (ja) 2009-10-21 2009-10-21 検査用治具のメンテナンス方法及び基板検査装置
KR1020100097257A KR101157878B1 (ko) 2009-10-21 2010-10-06 검사용 치구의 유지보수방법 및 기판검사장치
TW099135059A TWI404949B (zh) 2009-10-21 2010-10-14 檢查用治具之維修方法及基板檢查裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009242875A JP5428748B2 (ja) 2009-10-21 2009-10-21 検査用治具のメンテナンス方法及び基板検査装置

Publications (2)

Publication Number Publication Date
JP2011089858A JP2011089858A (ja) 2011-05-06
JP5428748B2 true JP5428748B2 (ja) 2014-02-26

Family

ID=44048705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009242875A Active JP5428748B2 (ja) 2009-10-21 2009-10-21 検査用治具のメンテナンス方法及び基板検査装置

Country Status (3)

Country Link
JP (1) JP5428748B2 (ko)
KR (1) KR101157878B1 (ko)
TW (1) TWI404949B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5400107B2 (ja) * 2011-08-16 2014-01-29 Ｃｋｄ株式会社 基板検査装置
JP5866943B2 (ja) * 2011-10-06 2016-02-24 日本電産リード株式会社 基板検査装置
JP6252106B2 (ja) * 2013-10-31 2017-12-27 日本電産リード株式会社 接触子のメンテナンス方法及び検査装置
JP6375661B2 (ja) * 2014-03-26 2018-08-22 日本電産リード株式会社 抵抗測定装置、基板検査装置、検査方法、及び検査用治具のメンテナンス方法
JP6696523B2 (ja) * 2018-03-14 2020-05-20 日本電産リード株式会社 抵抗測定方法、抵抗測定装置、及び基板検査装置
TWI716106B (zh) * 2019-09-16 2021-01-11 力成科技股份有限公司 封裝基板之電阻量測方法及其封裝基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001201529A (ja) * 2000-01-21 2001-07-27 Hitachi Telecom Technol Ltd プリント配線板の試験方法及び試験装置
JP4607295B2 (ja) * 2000-08-02 2011-01-05 日置電機株式会社 回路基板検査装置
JP3950713B2 (ja) * 2002-02-28 2007-08-01 日置電機株式会社 回路配線検査方法およびその装置
JP2008002823A (ja) * 2006-06-20 2008-01-10 Nidec-Read Corp 基板検査装置及び基板検査方法
JP2008008773A (ja) * 2006-06-29 2008-01-17 Nidec-Read Corp 基板検査方法及び基板検査装置
JP2008076281A (ja) * 2006-09-22 2008-04-03 Nidec-Read Corp 基板検査治具、基板検査装置及び検査方法
TWI320485B (en) * 2007-03-08 2010-02-11 Test Research Inc Open-circuit testing system and method
KR100975808B1 (ko) * 2007-04-17 2010-08-13 니혼덴산리드가부시키가이샤 기판검사용 치구

Also Published As

Publication number Publication date
TWI404949B (zh) 2013-08-11
KR101157878B1 (ko) 2012-06-22
KR20110043446A (ko) 2011-04-27
TW201115160A (en) 2011-05-01
JP2011089858A (ja) 2011-05-06

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