TWI404949B - 檢查用治具之維修方法及基板檢查裝置 - Google Patents

檢查用治具之維修方法及基板檢查裝置 Download PDF

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Publication number
TWI404949B
TWI404949B TW099135059A TW99135059A TWI404949B TW I404949 B TWI404949 B TW I404949B TW 099135059 A TW099135059 A TW 099135059A TW 99135059 A TW99135059 A TW 99135059A TW I404949 B TWI404949 B TW I404949B
Authority
TW
Taiwan
Prior art keywords
inspection
resistance value
contact
contacts
pair
Prior art date
Application number
TW099135059A
Other languages
English (en)
Chinese (zh)
Other versions
TW201115160A (en
Inventor
Tomoka Kariya
Original Assignee
Nidec Read Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec Read Corp filed Critical Nidec Read Corp
Publication of TW201115160A publication Critical patent/TW201115160A/zh
Application granted granted Critical
Publication of TWI404949B publication Critical patent/TWI404949B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/28—Provision in measuring instruments for reference values, e.g. standard voltage, standard waveform
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
TW099135059A 2009-10-21 2010-10-14 檢查用治具之維修方法及基板檢查裝置 TWI404949B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009242875A JP5428748B2 (ja) 2009-10-21 2009-10-21 検査用治具のメンテナンス方法及び基板検査装置

Publications (2)

Publication Number Publication Date
TW201115160A TW201115160A (en) 2011-05-01
TWI404949B true TWI404949B (zh) 2013-08-11

Family

ID=44048705

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099135059A TWI404949B (zh) 2009-10-21 2010-10-14 檢查用治具之維修方法及基板檢查裝置

Country Status (3)

Country Link
JP (1) JP5428748B2 (ko)
KR (1) KR101157878B1 (ko)
TW (1) TWI404949B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5400107B2 (ja) * 2011-08-16 2014-01-29 Ｃｋｄ株式会社 基板検査装置
JP5866943B2 (ja) * 2011-10-06 2016-02-24 日本電産リード株式会社 基板検査装置
JP6252106B2 (ja) * 2013-10-31 2017-12-27 日本電産リード株式会社 接触子のメンテナンス方法及び検査装置
JP6375661B2 (ja) * 2014-03-26 2018-08-22 日本電産リード株式会社 抵抗測定装置、基板検査装置、検査方法、及び検査用治具のメンテナンス方法
JP6696523B2 (ja) * 2018-03-14 2020-05-20 日本電産リード株式会社 抵抗測定方法、抵抗測定装置、及び基板検査装置
TWI716106B (zh) * 2019-09-16 2021-01-11 力成科技股份有限公司 封裝基板之電阻量測方法及其封裝基板

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200809226A (en) * 2006-06-20 2008-02-16 Nidec Read Corp Substrate inspecting apparatus and substrate inspecting method
TW200809227A (en) * 2006-06-29 2008-02-16 Nidec Read Corp Board inspecting method and board inspecting device
US20080218175A1 (en) * 2007-03-08 2008-09-11 Test Research, Inc. Open-Circuit Testing System and Method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001201529A (ja) * 2000-01-21 2001-07-27 Hitachi Telecom Technol Ltd プリント配線板の試験方法及び試験装置
JP4607295B2 (ja) * 2000-08-02 2011-01-05 日置電機株式会社 回路基板検査装置
JP3950713B2 (ja) * 2002-02-28 2007-08-01 日置電機株式会社 回路配線検査方法およびその装置
JP2008076281A (ja) * 2006-09-22 2008-04-03 Nidec-Read Corp 基板検査治具、基板検査装置及び検査方法
KR100975808B1 (ko) * 2007-04-17 2010-08-13 니혼덴산리드가부시키가이샤 기판검사용 치구

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200809226A (en) * 2006-06-20 2008-02-16 Nidec Read Corp Substrate inspecting apparatus and substrate inspecting method
TW200809227A (en) * 2006-06-29 2008-02-16 Nidec Read Corp Board inspecting method and board inspecting device
US20080218175A1 (en) * 2007-03-08 2008-09-11 Test Research, Inc. Open-Circuit Testing System and Method

Also Published As

Publication number Publication date
KR101157878B1 (ko) 2012-06-22
KR20110043446A (ko) 2011-04-27
TW201115160A (en) 2011-05-01
JP5428748B2 (ja) 2014-02-26
JP2011089858A (ja) 2011-05-06

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