JP5425822B2 - 回路基板組み立て品および回路基板へのチップの取り付け方法 - Google Patents
回路基板組み立て品および回路基板へのチップの取り付け方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title description 26
- 239000004593 Epoxy Substances 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 230000000712 assembly Effects 0.000 description 5
- 238000000429 assembly Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 4
- 238000006731 degradation reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- CFAKWWQIUFSQFU-UHFFFAOYSA-N 2-hydroxy-3-methylcyclopent-2-en-1-one Chemical compound CC1=C(O)C(=O)CC1 CFAKWWQIUFSQFU-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000001837 2-hydroxy-3-methylcyclopent-2-en-1-one Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
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- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- DGAHKUBUPHJKDE-UHFFFAOYSA-N indium lead Chemical compound [In].[Pb] DGAHKUBUPHJKDE-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
- H01Q21/0025—Modular arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Wire Bonding (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Details Of Aerials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
以下に、本願出願時の特許請求の範囲に記載された発明を付記する。
[1]フリップチップ送信/受信(T/R)モジュール1をアンテナ回路基板2に直接取り付けることと、
前記フリップチップT/Rモジュール1の周辺の少なくとも一部の周囲において前記回路基板2と前記フリップチップT/Rモジュール1にフィレットボンド6を付けることと、
を具備する、アンテナアレイ100の組み立て方法。
[2]前記アンテナ回路基板2が多層フレキシブル回路基板である、[1]の方法。
[3]前記フリップチップT/Rモジュール1を直接取り付けることが、R/F接続、DC電力接続、デジタル接続の少なくとも1つをなすことを具備する、[1]または[2]の方法。
[4]前記フリップチップT/Rモジュール1を取り付けることが、前記フィレットボンド6を前記回路基板2上のR/F経路7に付けることなく、前記フリップチップT/Rモジュール1を取り付けることを具備する、[1]乃至[3]のいずれかの方法。
[5]前記フリップチップT/Rモジュール1が、約6GHzを越える周波数で動作する、[1]乃至[4]のいずれかの方法。
[6]前記フィレットボンド6が、前記フリップチップT/Rモジュール1の全周囲に亘って広がっている、[1]乃至[4]のいずれかの方法。
[7]前記フリップチップT/Rモジュール1が、約6GHz未満の周波数で動作する、[6]の方法。
[8]前記フリップチップT/Rモジュールをアンダーフィルすることをさらに具備する、[6]または[7]の方法。
[9]前記フリップチップT/Rモジュール1を前記回路基板2に直接取り付けることが、前記フリップチップT/Rモジュール1上のバンプ3を前記回路基板2上の対応するコンタクトパッド4に導電媒体5を用いて接続することを具備する、[1]乃至[8]のいずれかの方法。
[10]前記導電媒体5が、電気的導電接着剤、半田、異方性導電フィルムの少なくとも1つを具備する、[9]の方法。
[11]前記直接取り付けることが、圧着または超音波コンタクト52を形成することを具備する、[9]の方法。
Claims (17)
- チップと、
前記チップを回路基板に接続するフリップチップ接続であって、前記回路基板はRF経路を具備し、前記フリップチップ接続は少なくともRF接続、DC電力接続、およびディジタル接続を具備する、フリップチップ接続と、
前記チップの少なくとも一部の周りで前記回路基板および前記チップに接続されたフィレットボンドであって、あらゆる前記RF経路のいずれの部分も覆わないフィレットボンドと、
を具備し、
前記チップが6GHz乃至11GHzの周波数で動作し、前記フィレットボンドがエポキシを具備する、組立品。 - 前記チップがT/Rモジュールである、
請求項1の組立品。 - 前記回路基板が多層フレキシブルアンテナ回路基板を具備する、
請求項1の組立品。 - 前記チップの少なくとも一部と前記回路基板との間のアンダーフィルをさらに具備する、
請求項1の組立品。 - 前記アンダーフィルがエポキシを具備する、
請求項4の組立品。 - 複数のコンタクトパッドと、
上に前記複数のコンタクトパッドが配置される回路基板であって、RF経路を具備する回路基板と、
前記複数のコンタクトパッドの対応するコンタクトパッドと接続するための複数の接続部分を具備する送信/受信チップと、
前記チップの少なくとも一部の周りにおける前記回路基板と前記チップとの間のフィレットボンドであって、前記回路基板上のRF経路上に付されていないフィレットボンドと、
複数の接続部分の少なくともいくつかとそれぞれの対応するコンタクトパッドとの間でRF、ディジタル、およびDC電力接続を形成する導電媒体と、
を具備し、
前記チップが6GHz乃至11GHzの周波数で動作し、前記フィレットボンドがエポキシを具備する、
する回路。 - 前記導電媒体が導電性接着剤またははんだのうちの1つを具備する、
請求項6の回路。 - 前記導電媒体が異方性導電膜を具備する、
請求項6の回路。 - 前記複数の接続部分の少なくとも1つが、圧力または超音波コンタクトのうちの1つによって、前記複数のコンタクトパッドの対応する少なくとも1つに接続されている、
請求項6の回路。 - 前記チップと前記回路基板との間のエポキシ製アンダーフィルをさらに具備する、
請求項6の回路。 - 前記チップが高周波モジュールである、
請求項6の回路。 - 前記フィレットボンドが非導電性接着剤を具備する、
請求項6の回路。 - 前記非導電性接着剤が高い粘性を有する、
請求項12の回路。 - 前記フィレットボンドが高い曲げ弾性率を有する、
請求項6の回路。 - 前記フィレットボンドが、前記チップのエッジ上で、前記チップの前記エッジの厚さの50%乃至100%の間で広がっている、
請求項6の回路。 - 前記フィレットボンドが前記チップの周囲の一部の周りで広がっている、
請求項6の回路。 - エポキシ製アンダーフィルをさらに具備する、
請求項16の回路。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/756,649 US7298235B2 (en) | 2004-01-13 | 2004-01-13 | Circuit board assembly and method of attaching a chip to a circuit board with a fillet bond not covering RF traces |
US10/756,649 | 2004-01-13 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2006549699A Division JP5015607B2 (ja) | 2004-01-13 | 2005-01-13 | 回路基板組み立て品および回路基板へのチップの取り付け方法 |
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JP2011151815A JP2011151815A (ja) | 2011-08-04 |
JP5425822B2 true JP5425822B2 (ja) | 2014-02-26 |
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JP2006549699A Active JP5015607B2 (ja) | 2004-01-13 | 2005-01-13 | 回路基板組み立て品および回路基板へのチップの取り付け方法 |
JP2011028794A Active JP5425822B2 (ja) | 2004-01-13 | 2011-02-14 | 回路基板組み立て品および回路基板へのチップの取り付け方法 |
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Country Status (9)
Country | Link |
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US (1) | US7298235B2 (ja) |
EP (1) | EP1704618B1 (ja) |
JP (2) | JP5015607B2 (ja) |
KR (1) | KR100825159B1 (ja) |
CA (1) | CA2538100C (ja) |
DE (1) | DE602005023121D1 (ja) |
ES (1) | ES2349039T3 (ja) |
NO (1) | NO337415B1 (ja) |
WO (1) | WO2005069430A2 (ja) |
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US6395124B1 (en) * | 1999-07-30 | 2002-05-28 | 3M Innovative Properties Company | Method of producing a laminated structure |
US6853087B2 (en) * | 2000-09-19 | 2005-02-08 | Nanopierce Technologies, Inc. | Component and antennae assembly in radio frequency identification devices |
JP2002190545A (ja) * | 2000-12-22 | 2002-07-05 | Matsushita Commun Ind Co Ltd | 高周波集積回路装置 |
US6734567B2 (en) * | 2002-08-23 | 2004-05-11 | Texas Instruments Incorporated | Flip-chip device strengthened by substrate metal ring |
US6885107B2 (en) | 2002-08-29 | 2005-04-26 | Micron Technology, Inc. | Flip-chip image sensor packages and methods of fabrication |
US6998709B2 (en) * | 2003-11-05 | 2006-02-14 | Broadcom Corp. | RFIC die-package configuration |
-
2004
- 2004-01-13 US US10/756,649 patent/US7298235B2/en active Active
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2005
- 2005-01-13 WO PCT/US2005/001800 patent/WO2005069430A2/en not_active Application Discontinuation
- 2005-01-13 ES ES05711705T patent/ES2349039T3/es active Active
- 2005-01-13 KR KR1020067014035A patent/KR100825159B1/ko active IP Right Grant
- 2005-01-13 CA CA2538100A patent/CA2538100C/en not_active Expired - Fee Related
- 2005-01-13 JP JP2006549699A patent/JP5015607B2/ja active Active
- 2005-01-13 EP EP05711705A patent/EP1704618B1/en not_active Expired - Fee Related
- 2005-01-13 DE DE602005023121T patent/DE602005023121D1/de active Active
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Also Published As
Publication number | Publication date |
---|---|
WO2005069430A2 (en) | 2005-07-28 |
JP2007518379A (ja) | 2007-07-05 |
WO2005069430A3 (en) | 2005-10-13 |
CA2538100A1 (en) | 2005-07-28 |
US20050151215A1 (en) | 2005-07-14 |
EP1704618B1 (en) | 2010-08-25 |
JP5015607B2 (ja) | 2012-08-29 |
ES2349039T3 (es) | 2010-12-22 |
NO337415B1 (no) | 2016-04-11 |
US7298235B2 (en) | 2007-11-20 |
DE602005023121D1 (de) | 2010-10-07 |
NO20063547L (no) | 2006-08-03 |
KR100825159B1 (ko) | 2008-04-24 |
KR20060109982A (ko) | 2006-10-23 |
CA2538100C (en) | 2011-01-11 |
JP2011151815A (ja) | 2011-08-04 |
EP1704618A2 (en) | 2006-09-27 |
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