JP5425813B2 - レーザ光源のエネルギを制御するための照射装置及び方法 - Google Patents

レーザ光源のエネルギを制御するための照射装置及び方法 Download PDF

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JP5425813B2
JP5425813B2 JP2010545377A JP2010545377A JP5425813B2 JP 5425813 B2 JP5425813 B2 JP 5425813B2 JP 2010545377 A JP2010545377 A JP 2010545377A JP 2010545377 A JP2010545377 A JP 2010545377A JP 5425813 B2 JP5425813 B2 JP 5425813B2
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energy
laser
laser beam
dimension
detector
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JP2011510820A5 (https=
JP2011510820A (ja
Inventor
ベルンハルト ヴァイグル
リチャード サンドストロム
Original Assignee
カール ツァイス レーザー オプティックス ゲゼルシャフト ミット ベシュレンクテル ハフツング
サイマー インコーポレイテッド
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0738—Shaping the laser spot into a linear shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/13—Stabilisation of laser output parameters, e.g. frequency or amplitude
    • H01S3/1305—Feedback control systems

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Automation & Control Theory (AREA)
  • Recrystallisation Techniques (AREA)
  • Laser Beam Processing (AREA)
JP2010545377A 2008-02-07 2009-01-22 レーザ光源のエネルギを制御するための照射装置及び方法 Active JP5425813B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/027,442 US8723073B2 (en) 2008-02-07 2008-02-07 Illumination apparatus and method for controlling energy of a laser source
US12/027,442 2008-02-07
PCT/EP2009/000365 WO2009097967A1 (en) 2008-02-07 2009-01-22 Illuminating apparatus and method for controlling energy of a laser source

Publications (3)

Publication Number Publication Date
JP2011510820A JP2011510820A (ja) 2011-04-07
JP2011510820A5 JP2011510820A5 (https=) 2012-03-08
JP5425813B2 true JP5425813B2 (ja) 2014-02-26

Family

ID=40583220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010545377A Active JP5425813B2 (ja) 2008-02-07 2009-01-22 レーザ光源のエネルギを制御するための照射装置及び方法

Country Status (7)

Country Link
US (1) US8723073B2 (https=)
EP (1) EP2245497B1 (https=)
JP (1) JP5425813B2 (https=)
KR (1) KR101606105B1 (https=)
SG (1) SG188785A1 (https=)
TW (1) TWI481136B (https=)
WO (1) WO2009097967A1 (https=)

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WO2006131924A2 (en) 2005-06-07 2006-12-14 Oree, Advanced Illumination Solutions Inc. Illumination apparatus
US8272758B2 (en) 2005-06-07 2012-09-25 Oree, Inc. Illumination apparatus and methods of forming the same
US8215815B2 (en) 2005-06-07 2012-07-10 Oree, Inc. Illumination apparatus and methods of forming the same
US7929816B2 (en) * 2007-12-19 2011-04-19 Oree, Inc. Waveguide sheet containing in-coupling, propagation, and out-coupling regions
US7907804B2 (en) 2007-12-19 2011-03-15 Oree, Inc. Elimination of stitch artifacts in a planar illumination area
EP2260341A2 (en) 2008-03-05 2010-12-15 Oree, Advanced Illumination Solutions INC. Illumination apparatus and methods of forming the same
US8297786B2 (en) 2008-07-10 2012-10-30 Oree, Inc. Slim waveguide coupling apparatus and method
US8301002B2 (en) 2008-07-10 2012-10-30 Oree, Inc. Slim waveguide coupling apparatus and method
JP4618360B2 (ja) * 2008-10-10 2011-01-26 ソニー株式会社 レーザアニール方法およびレーザアニール装置
US8624527B1 (en) 2009-03-27 2014-01-07 Oree, Inc. Independently controllable illumination device
US8328406B2 (en) 2009-05-13 2012-12-11 Oree, Inc. Low-profile illumination device
WO2010150202A2 (en) 2009-06-24 2010-12-29 Oree, Advanced Illumination Solutions Inc. Illumination apparatus with high conversion efficiency and methods of forming the same
US20120325784A1 (en) * 2011-06-24 2012-12-27 Applied Materials, Inc. Novel thermal processing apparatus
US8591072B2 (en) 2011-11-16 2013-11-26 Oree, Inc. Illumination apparatus confining light by total internal reflection and methods of forming the same
WO2014006501A1 (en) 2012-07-03 2014-01-09 Yosi Shani Planar remote phosphor illumination apparatus
KR102285121B1 (ko) * 2019-04-10 2021-08-03 고려대학교 세종산학협력단 레이저를 이용한 비정질 반도체 결정화 장치 및 그의 제어방법
KR20210131510A (ko) 2020-04-23 2021-11-03 삼성디스플레이 주식회사 라인 빔 형성 장치
DE102020130651B3 (de) * 2020-11-19 2022-05-05 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung zum Erzeugen einer definierten Laserbeleuchtung auf einer Arbeitsebene

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US5331466A (en) * 1991-04-23 1994-07-19 Lions Eye Institute Of Western Australia Inc. Method and apparatus for homogenizing a collimated light beam
DE4220705C2 (de) * 1992-06-24 2003-03-13 Lambda Physik Ag Vorrichtung zum Aufteilen eines Lichtstrahles in homogene Teilstrahlen
US5609780A (en) * 1994-11-14 1997-03-11 International Business Machines, Corporation Laser system
JPH08247790A (ja) * 1995-03-10 1996-09-27 Sefuto Kenkyusho:Kk 位置検出装置
DE19520187C1 (de) 1995-06-01 1996-09-12 Microlas Lasersystem Gmbh Optik zum Herstellen einer scharfen Beleuchtungslinie aus einem Laserstrahl
US5880461A (en) * 1996-06-12 1999-03-09 The Regents Of The University Of California Low noise optical position sensor
JPH11283933A (ja) * 1998-01-29 1999-10-15 Toshiba Corp レ―ザ照射装置，非単結晶半導体膜の製造方法及び液晶表示装置の製造方法
JP2000202673A (ja) * 2000-01-01 2000-07-25 Semiconductor Energy Lab Co Ltd レ―ザ―照射装置
AU2002230592A1 (en) * 2000-10-27 2002-05-06 Molecular Devices Corporation Light detection device
US7061959B2 (en) * 2001-04-18 2006-06-13 Tcz Gmbh Laser thin film poly-silicon annealing system
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JP2003053578A (ja) * 2001-08-15 2003-02-26 Sumitomo Heavy Ind Ltd レーザビームのプロファイル調整方法及び装置
JP2003258349A (ja) * 2002-03-04 2003-09-12 Toshiba Corp レーザ加工方法、その装置および薄膜加工方法
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Also Published As

Publication number Publication date
US20090201955A1 (en) 2009-08-13
EP2245497B1 (en) 2016-12-14
KR20100114920A (ko) 2010-10-26
US8723073B2 (en) 2014-05-13
SG188785A1 (en) 2013-04-30
JP2011510820A (ja) 2011-04-07
TW201008061A (en) 2010-02-16
KR101606105B1 (ko) 2016-03-24
TWI481136B (zh) 2015-04-11
EP2245497A1 (en) 2010-11-03
WO2009097967A1 (en) 2009-08-13

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