JP5420640B2 - 複数基板の処理装置及びその方法 - Google Patents

複数基板の処理装置及びその方法 Download PDF

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Publication number
JP5420640B2
JP5420640B2 JP2011507379A JP2011507379A JP5420640B2 JP 5420640 B2 JP5420640 B2 JP 5420640B2 JP 2011507379 A JP2011507379 A JP 2011507379A JP 2011507379 A JP2011507379 A JP 2011507379A JP 5420640 B2 JP5420640 B2 JP 5420640B2
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Japan
Prior art keywords
substrate
cutting
station
unit
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2011507379A
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English (en)
Japanese (ja)
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JP2011520256A (ja
JP2011520256A5 (enExample
Inventor
ジュン・ジョンジェ
ジャン・ドクチュン
ハ・シャンフワン
リム・チョンチェン
ベク・スンホ
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Rokko Ventures Pte Ltd
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Rokko Ventures Pte Ltd
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Publication of JP2011520256A publication Critical patent/JP2011520256A/ja
Publication of JP2011520256A5 publication Critical patent/JP2011520256A5/ja
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Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H10P54/00—

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
JP2011507379A 2008-05-02 2009-05-04 複数基板の処理装置及びその方法 Expired - Fee Related JP5420640B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SG200803452-2A SG142402A1 (en) 2008-05-02 2008-05-02 Apparatus and method for multiple substrate processing
SG200803452-2 2008-05-02
PCT/SG2009/000158 WO2009134212A1 (en) 2008-05-02 2009-05-04 Apparatus and method for multiple substrate processing

Publications (3)

Publication Number Publication Date
JP2011520256A JP2011520256A (ja) 2011-07-14
JP2011520256A5 JP2011520256A5 (enExample) 2012-02-16
JP5420640B2 true JP5420640B2 (ja) 2014-02-19

Family

ID=41255265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011507379A Expired - Fee Related JP5420640B2 (ja) 2008-05-02 2009-05-04 複数基板の処理装置及びその方法

Country Status (6)

Country Link
US (1) US20110036339A1 (enExample)
JP (1) JP5420640B2 (enExample)
KR (1) KR20110013440A (enExample)
CN (1) CN102046344A (enExample)
SG (1) SG142402A1 (enExample)
WO (1) WO2009134212A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310765B1 (ko) * 2012-02-29 2013-09-25 주식회사 에스에프에이 가요성 기판 절단장치
KR200472836Y1 (ko) * 2012-07-06 2014-05-27 프로브 테크놀로지 코포레이션 절삭 유닛 및 그 응용설비
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0186201B1 (en) * 1984-12-27 1992-12-30 Disco Abrasive Systems, Ltd. Semiconductor wafer dicing machine
US7267037B2 (en) * 2001-05-05 2007-09-11 David Walter Smith Bidirectional singulation saw and method
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
JP2003124155A (ja) * 2001-10-12 2003-04-25 Disco Abrasive Syst Ltd 切削装置
JP3765265B2 (ja) * 2001-11-28 2006-04-12 株式会社東京精密 ダイシング装置
JP4201564B2 (ja) * 2001-12-03 2008-12-24 日東電工株式会社 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
KR100497506B1 (ko) * 2003-04-08 2005-07-01 한미반도체 주식회사 반도체 스트립 소잉장치 및 이를 구비한 반도체 패키지의싱귤레이션 장치
JP4315788B2 (ja) * 2003-11-26 2009-08-19 アピックヤマダ株式会社 半導体装置の製造方法及び製造装置
JP2005347421A (ja) * 2004-06-01 2005-12-15 Apic Yamada Corp 半導体装置の製造方法及び装置

Also Published As

Publication number Publication date
JP2011520256A (ja) 2011-07-14
CN102046344A (zh) 2011-05-04
KR20110013440A (ko) 2011-02-09
SG142402A1 (en) 2009-11-26
US20110036339A1 (en) 2011-02-17
WO2009134212A1 (en) 2009-11-05

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