KR20110013440A - 복수의 기판을 처리하는 장치 및 방법 - Google Patents

복수의 기판을 처리하는 장치 및 방법 Download PDF

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Publication number
KR20110013440A
KR20110013440A KR1020107027093A KR20107027093A KR20110013440A KR 20110013440 A KR20110013440 A KR 20110013440A KR 1020107027093 A KR1020107027093 A KR 1020107027093A KR 20107027093 A KR20107027093 A KR 20107027093A KR 20110013440 A KR20110013440 A KR 20110013440A
Authority
KR
South Korea
Prior art keywords
substrate
cutting
station
substrates
loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107027093A
Other languages
English (en)
Korean (ko)
Inventor
종재 정
덕천 장
창환 하
총첸 림
성호 백
Original Assignee
록코 벤처스 피티이 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 록코 벤처스 피티이 리미티드 filed Critical 록코 벤처스 피티이 리미티드
Publication of KR20110013440A publication Critical patent/KR20110013440A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H10P54/00—

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
KR1020107027093A 2008-05-02 2009-05-04 복수의 기판을 처리하는 장치 및 방법 Withdrawn KR20110013440A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG200803452-2A SG142402A1 (en) 2008-05-02 2008-05-02 Apparatus and method for multiple substrate processing
SG200803452-2 2008-05-02

Publications (1)

Publication Number Publication Date
KR20110013440A true KR20110013440A (ko) 2011-02-09

Family

ID=41255265

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107027093A Withdrawn KR20110013440A (ko) 2008-05-02 2009-05-04 복수의 기판을 처리하는 장치 및 방법

Country Status (6)

Country Link
US (1) US20110036339A1 (enExample)
JP (1) JP5420640B2 (enExample)
KR (1) KR20110013440A (enExample)
CN (1) CN102046344A (enExample)
SG (1) SG142402A1 (enExample)
WO (1) WO2009134212A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310765B1 (ko) * 2012-02-29 2013-09-25 주식회사 에스에프에이 가요성 기판 절단장치
KR200472836Y1 (ko) * 2012-07-06 2014-05-27 프로브 테크놀로지 코포레이션 절삭 유닛 및 그 응용설비

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0186201B1 (en) * 1984-12-27 1992-12-30 Disco Abrasive Systems, Ltd. Semiconductor wafer dicing machine
US7267037B2 (en) * 2001-05-05 2007-09-11 David Walter Smith Bidirectional singulation saw and method
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
JP2003124155A (ja) * 2001-10-12 2003-04-25 Disco Abrasive Syst Ltd 切削装置
JP3765265B2 (ja) * 2001-11-28 2006-04-12 株式会社東京精密 ダイシング装置
JP4201564B2 (ja) * 2001-12-03 2008-12-24 日東電工株式会社 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
KR100497506B1 (ko) * 2003-04-08 2005-07-01 한미반도체 주식회사 반도체 스트립 소잉장치 및 이를 구비한 반도체 패키지의싱귤레이션 장치
JP4315788B2 (ja) * 2003-11-26 2009-08-19 アピックヤマダ株式会社 半導体装置の製造方法及び製造装置
JP2005347421A (ja) * 2004-06-01 2005-12-15 Apic Yamada Corp 半導体装置の製造方法及び装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310765B1 (ko) * 2012-02-29 2013-09-25 주식회사 에스에프에이 가요성 기판 절단장치
KR200472836Y1 (ko) * 2012-07-06 2014-05-27 프로브 테크놀로지 코포레이션 절삭 유닛 및 그 응용설비

Also Published As

Publication number Publication date
JP2011520256A (ja) 2011-07-14
CN102046344A (zh) 2011-05-04
JP5420640B2 (ja) 2014-02-19
SG142402A1 (en) 2009-11-26
US20110036339A1 (en) 2011-02-17
WO2009134212A1 (en) 2009-11-05

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P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

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P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000