JP5417323B2 - 感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板 - Google Patents
感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板 Download PDFInfo
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- JP5417323B2 JP5417323B2 JP2010511044A JP2010511044A JP5417323B2 JP 5417323 B2 JP5417323 B2 JP 5417323B2 JP 2010511044 A JP2010511044 A JP 2010511044A JP 2010511044 A JP2010511044 A JP 2010511044A JP 5417323 B2 JP5417323 B2 JP 5417323B2
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- polyimide precursor
- photosensitive
- bis
- group
- film
- Prior art date
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- 239000002253 acid Substances 0.000 claims description 37
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- 125000000962 organic group Chemical group 0.000 claims description 24
- 125000004432 carbon atom Chemical group C* 0.000 claims description 23
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- 239000003795 chemical substances by application Substances 0.000 claims description 15
- 239000003112 inhibitor Substances 0.000 claims description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 11
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Classifications
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
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- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
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- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Engineering & Computer Science (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010511044A JP5417323B2 (ja) | 2008-05-09 | 2009-04-24 | 感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008124016 | 2008-05-09 | ||
JP2008124016 | 2008-05-09 | ||
JP2010511044A JP5417323B2 (ja) | 2008-05-09 | 2009-04-24 | 感光性ポリイミド前駆体組成物、感光性ドライフィルム及びフレキシブルプリント配線基板 |
PCT/JP2009/058159 WO2009136557A1 (fr) | 2008-05-09 | 2009-04-24 | Précurseur de polyimide, composition de précurseur de polyimide photosensible, film sec photosensible et carte de circuits imprimés flexible utilisant ces matières |
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CN102597061B (zh) * | 2009-11-16 | 2014-06-04 | 旭化成电子材料株式会社 | 聚酰亚胺前体和包含该聚酰亚胺前体的感光性树脂组合物 |
WO2011135887A1 (fr) * | 2010-04-28 | 2011-11-03 | 旭化成イーマテリアルズ株式会社 | Composition de résine photosensible |
JP5691657B2 (ja) * | 2011-03-04 | 2015-04-01 | 日油株式会社 | 感光性樹脂組成物およびその用途 |
WO2012133826A1 (fr) * | 2011-03-31 | 2012-10-04 | 日産化学工業株式会社 | Agent d'alignement de cristaux liquides et film d'alignement de cristaux liquides utilisant ledit agent |
JP5751025B2 (ja) * | 2011-05-31 | 2015-07-22 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜、半導体装置、および表示体装置 |
JP5748638B2 (ja) * | 2011-11-04 | 2015-07-15 | 旭化成イーマテリアルズ株式会社 | ポリイミド前駆体又はポリイミド及び感光性樹脂組成物 |
TWI486335B (zh) * | 2011-12-29 | 2015-06-01 | Eternal Materials Co Ltd | 鹼產生劑 |
JP5884551B2 (ja) * | 2012-02-27 | 2016-03-15 | 日油株式会社 | 感光性樹脂組成物およびその用途 |
JP6343989B2 (ja) * | 2013-03-21 | 2018-06-20 | 東洋紡株式会社 | 透明ポリエステルイミド樹脂フィルム、並びにこれに用いる樹脂および樹脂組成物 |
TWI671343B (zh) * | 2014-06-27 | 2019-09-11 | 日商富士軟片股份有限公司 | 熱硬化性樹脂組成物、硬化膜、硬化膜的製造方法以及半導體裝置 |
JP2016080803A (ja) * | 2014-10-14 | 2016-05-16 | 太陽インキ製造株式会社 | ドライフィルムおよびフレキシブルプリント配線板 |
JP6824389B2 (ja) * | 2017-03-29 | 2021-02-03 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法および半導体デバイス |
JP6968196B2 (ja) * | 2017-11-28 | 2021-11-17 | 旭化成株式会社 | ネガ型感光性樹脂組成物及びその製造方法、並びに硬化レリーフパターンの製造方法 |
JP6810677B2 (ja) | 2017-12-05 | 2021-01-06 | 信越化学工業株式会社 | 新規テトラカルボン酸二無水物、ポリイミド樹脂及びその製造方法、感光性樹脂組成物、パターン形成方法及び硬化被膜形成方法、層間絶縁膜、表面保護膜、電子部品 |
JP6958332B2 (ja) * | 2017-12-20 | 2021-11-02 | Hdマイクロシステムズ株式会社 | 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 |
CN110857332B (zh) * | 2018-08-22 | 2022-10-21 | 臻鼎科技股份有限公司 | 高分子树脂、高分子树脂组合物及覆铜板 |
KR20220015327A (ko) | 2020-07-30 | 2022-02-08 | 주식회사 엘지화학 | 바인더 수지, 포지티브형 감광성 수지 조성물, 절연막 및 반도체 장치 |
WO2022039028A1 (fr) * | 2020-08-17 | 2022-02-24 | 東レ株式会社 | Composition de résine photosensible, produit durci, dispositif d'affichage, dispositif à semi-conducteur et procédé de production dudit produit durci |
CN116789590B (zh) * | 2023-06-25 | 2024-02-02 | 波米科技有限公司 | 一种含哌啶基团的二胺化合物及其制备方法和应用 |
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KR101308811B1 (ko) | 2013-09-13 |
KR20100125467A (ko) | 2010-11-30 |
TW201006867A (en) | 2010-02-16 |
WO2009136557A1 (fr) | 2009-11-12 |
JP5603977B2 (ja) | 2014-10-08 |
TWI384015B (zh) | 2013-02-01 |
JPWO2009136557A1 (ja) | 2011-09-08 |
CN102015835A (zh) | 2011-04-13 |
JP2013241607A (ja) | 2013-12-05 |
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