WO2022039028A1 - Composition de résine photosensible, produit durci, dispositif d'affichage, dispositif à semi-conducteur et procédé de production dudit produit durci - Google Patents
Composition de résine photosensible, produit durci, dispositif d'affichage, dispositif à semi-conducteur et procédé de production dudit produit durci Download PDFInfo
- Publication number
- WO2022039028A1 WO2022039028A1 PCT/JP2021/028917 JP2021028917W WO2022039028A1 WO 2022039028 A1 WO2022039028 A1 WO 2022039028A1 JP 2021028917 W JP2021028917 W JP 2021028917W WO 2022039028 A1 WO2022039028 A1 WO 2022039028A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- resin composition
- photosensitive resin
- cured product
- organic
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 102
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000004065 semiconductor Substances 0.000 title claims description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 93
- 239000011347 resin Substances 0.000 claims abstract description 90
- 229920005989 resin Polymers 0.000 claims abstract description 90
- 238000002834 transmittance Methods 0.000 claims abstract description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 28
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 27
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000005192 partition Methods 0.000 claims abstract description 5
- -1 naphthoquinone diazide sulfonic acid ester Chemical class 0.000 claims description 125
- 239000010410 layer Substances 0.000 claims description 93
- 239000002243 precursor Substances 0.000 claims description 30
- 125000004432 carbon atom Chemical group C* 0.000 claims description 29
- 229920001721 polyimide Polymers 0.000 claims description 27
- 229920001296 polysiloxane Polymers 0.000 claims description 26
- 239000004642 Polyimide Substances 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 22
- 229920002577 polybenzoxazole Polymers 0.000 claims description 21
- 125000000962 organic group Chemical group 0.000 claims description 17
- 238000013007 heat curing Methods 0.000 claims description 10
- 238000001723 curing Methods 0.000 claims description 9
- 125000005842 heteroatom Chemical group 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 8
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 239000002356 single layer Substances 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- 125000003454 indenyl group Chemical group C1(C=CC2=CC=CC=C12)* 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000005462 imide group Chemical group 0.000 claims 1
- 238000001029 thermal curing Methods 0.000 abstract description 3
- 239000000047 product Substances 0.000 description 95
- 239000010408 film Substances 0.000 description 89
- 238000000034 method Methods 0.000 description 53
- 239000000126 substance Substances 0.000 description 52
- 230000005540 biological transmission Effects 0.000 description 33
- 230000035945 sensitivity Effects 0.000 description 27
- 239000002253 acid Substances 0.000 description 24
- 238000010438 heat treatment Methods 0.000 description 22
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 21
- 239000000243 solution Substances 0.000 description 21
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 17
- 238000013461 design Methods 0.000 description 17
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 15
- 229920001187 thermosetting polymer Polymers 0.000 description 15
- 239000007864 aqueous solution Substances 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 14
- 239000003960 organic solvent Substances 0.000 description 14
- 238000003786 synthesis reaction Methods 0.000 description 14
- 239000002966 varnish Substances 0.000 description 13
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 12
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 12
- 150000003949 imides Chemical group 0.000 description 11
- 150000001282 organosilanes Chemical class 0.000 description 11
- 238000003860 storage Methods 0.000 description 11
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 10
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 10
- 125000004122 cyclic group Chemical group 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 10
- 230000001965 increasing effect Effects 0.000 description 10
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 229930192627 Naphthoquinone Natural products 0.000 description 9
- 238000004458 analytical method Methods 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 9
- 239000003431 cross linking reagent Substances 0.000 description 9
- 150000002791 naphthoquinones Chemical class 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 8
- 239000002585 base Substances 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 239000002244 precipitate Substances 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- 125000003342 alkenyl group Chemical group 0.000 description 7
- 125000000304 alkynyl group Chemical group 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 239000005011 phenolic resin Substances 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 150000004985 diamines Chemical class 0.000 description 6
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 6
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 6
- 230000007774 longterm Effects 0.000 description 6
- 238000004528 spin coating Methods 0.000 description 6
- 125000005409 triarylsulfonium group Chemical group 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 238000007363 ring formation reaction Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000013076 target substance Substances 0.000 description 5
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 150000001299 aldehydes Chemical class 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 239000012153 distilled water Substances 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 229940116333 ethyl lactate Drugs 0.000 description 4
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 239000010954 inorganic particle Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000005979 thermal decomposition reaction Methods 0.000 description 4
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 3
- OGRAOKJKVGDSFR-UHFFFAOYSA-N 6-Oxy-pseudocumol Natural products CC1=CC(C)=C(C)C(O)=C1 OGRAOKJKVGDSFR-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 125000005520 diaryliodonium group Chemical group 0.000 description 3
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 238000002329 infrared spectrum Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 125000002971 oxazolyl group Chemical group 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- GGAUUQHSCNMCAU-ZXZARUISSA-N (2s,3r)-butane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C[C@H](C(O)=O)[C@H](C(O)=O)CC(O)=O GGAUUQHSCNMCAU-ZXZARUISSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- SPEUIVXLLWOEMJ-UHFFFAOYSA-N 1,1-dimethoxyethane Chemical compound COC(C)OC SPEUIVXLLWOEMJ-UHFFFAOYSA-N 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical group C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- QWBBPBRQALCEIZ-UHFFFAOYSA-N 2,3-dimethylphenol Chemical compound CC1=CC=CC(O)=C1C QWBBPBRQALCEIZ-UHFFFAOYSA-N 0.000 description 2
- VXSCPERJHPWROZ-UHFFFAOYSA-N 2,4,5-trimethylphenol Chemical compound CC1=CC(C)=C(O)C=C1C VXSCPERJHPWROZ-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- FDQQNNZKEJIHMS-UHFFFAOYSA-N 3,4,5-trimethylphenol Chemical compound CC1=CC(O)=CC(C)=C1C FDQQNNZKEJIHMS-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- TYKLCAKICHXQNE-UHFFFAOYSA-N 3-[(2,3-dicarboxyphenyl)methyl]phthalic acid Chemical compound OC(=O)C1=CC=CC(CC=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O TYKLCAKICHXQNE-UHFFFAOYSA-N 0.000 description 2
- GPXCORHXFPYJEH-UHFFFAOYSA-N 3-[[3-aminopropyl(dimethyl)silyl]oxy-dimethylsilyl]propan-1-amine Chemical compound NCCC[Si](C)(C)O[Si](C)(C)CCCN GPXCORHXFPYJEH-UHFFFAOYSA-N 0.000 description 2
- ASHGTJPOSUFTGB-UHFFFAOYSA-N 3-methoxyphenol Chemical compound COC1=CC=CC(O)=C1 ASHGTJPOSUFTGB-UHFFFAOYSA-N 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- MBGGFXOXUIDRJD-UHFFFAOYSA-N 4-Butoxyphenol Chemical compound CCCCOC1=CC=C(O)C=C1 MBGGFXOXUIDRJD-UHFFFAOYSA-N 0.000 description 2
- IJJNNSUCZDJDLP-UHFFFAOYSA-N 4-[1-(3,4-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 IJJNNSUCZDJDLP-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 2
- YQUQWHNMBPIWGK-UHFFFAOYSA-N 4-isopropylphenol Chemical compound CC(C)C1=CC=C(O)C=C1 YQUQWHNMBPIWGK-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 102100033806 Alpha-protein kinase 3 Human genes 0.000 description 2
- 101710082399 Alpha-protein kinase 3 Proteins 0.000 description 2
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 229910008051 Si-OH Inorganic materials 0.000 description 2
- 229910006358 Si—OH Inorganic materials 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 description 2
- 239000003377 acid catalyst Substances 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 125000005037 alkyl phenyl group Chemical group 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000002738 chelating agent Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 150000005690 diesters Chemical class 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 2
- 238000003618 dip coating Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000010828 elution Methods 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 230000003301 hydrolyzing effect Effects 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000003456 ion exchange resin Substances 0.000 description 2
- 229920003303 ion-exchange polymer Polymers 0.000 description 2
- GJRQTCIYDGXPES-UHFFFAOYSA-N isobutyl acetate Chemical compound CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropyl acetate Chemical compound CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 125000003566 oxetanyl group Chemical group 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N para-benzoquinone Natural products O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 2
- JRDBISOHUUQXHE-UHFFFAOYSA-N pyridine-2,3,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)N=C1C(O)=O JRDBISOHUUQXHE-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 150000003628 tricarboxylic acids Chemical class 0.000 description 2
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- LWHOMMCIJIJIGV-UHFFFAOYSA-N (1,3-dioxobenzo[de]isoquinolin-2-yl) trifluoromethanesulfonate Chemical compound C1=CC(C(N(OS(=O)(=O)C(F)(F)F)C2=O)=O)=C3C2=CC=CC3=C1 LWHOMMCIJIJIGV-UHFFFAOYSA-N 0.000 description 1
- WVJRCSCNOMJNLP-UHFFFAOYSA-N (2-hydroxy-5-trimethoxysilylpentyl) 4-hydroxybenzoate Chemical compound CO[Si](OC)(OC)CCCC(O)COC(=O)C1=CC=C(O)C=C1 WVJRCSCNOMJNLP-UHFFFAOYSA-N 0.000 description 1
- ZGKWWOVOEOZQPP-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methoxymethoxy-dimethoxy-propylsilane Chemical compound C(C)C1(COC1)COCO[Si](OC)(OC)CCC ZGKWWOVOEOZQPP-UHFFFAOYSA-N 0.000 description 1
- RYNQKSJRFHJZTK-UHFFFAOYSA-N (3-methoxy-3-methylbutyl) acetate Chemical compound COC(C)(C)CCOC(C)=O RYNQKSJRFHJZTK-UHFFFAOYSA-N 0.000 description 1
- OWSKJORLRSWYGK-UHFFFAOYSA-N (3-methoxy-3-methylbutyl) propanoate Chemical compound CCC(=O)OCCC(C)(C)OC OWSKJORLRSWYGK-UHFFFAOYSA-N 0.000 description 1
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- GEWWCWZGHNIUBW-UHFFFAOYSA-N 1-(4-nitrophenyl)propan-2-one Chemical compound CC(=O)CC1=CC=C([N+]([O-])=O)C=C1 GEWWCWZGHNIUBW-UHFFFAOYSA-N 0.000 description 1
- PHPRWKJDGHSJMI-UHFFFAOYSA-N 1-adamantyl prop-2-enoate Chemical compound C1C(C2)CC3CC2CC1(OC(=O)C=C)C3 PHPRWKJDGHSJMI-UHFFFAOYSA-N 0.000 description 1
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- MQCPOLNSJCWPGT-UHFFFAOYSA-N 2,2'-Bisphenol F Chemical compound OC1=CC=CC=C1CC1=CC=CC=C1O MQCPOLNSJCWPGT-UHFFFAOYSA-N 0.000 description 1
- XRUGBBIQLIVCSI-UHFFFAOYSA-N 2,3,4-trimethylphenol Chemical compound CC1=CC=C(O)C(C)=C1C XRUGBBIQLIVCSI-UHFFFAOYSA-N 0.000 description 1
- UMPSXRYVXUPCOS-UHFFFAOYSA-N 2,3-dichlorophenol Chemical compound OC1=CC=CC(Cl)=C1Cl UMPSXRYVXUPCOS-UHFFFAOYSA-N 0.000 description 1
- RLEWTHFVGOXXTN-UHFFFAOYSA-N 2,3-diethylphenol Chemical compound CCC1=CC=CC(O)=C1CC RLEWTHFVGOXXTN-UHFFFAOYSA-N 0.000 description 1
- KUFFULVDNCHOFZ-UHFFFAOYSA-N 2,4-xylenol Chemical compound CC1=CC=C(O)C(C)=C1 KUFFULVDNCHOFZ-UHFFFAOYSA-N 0.000 description 1
- AQFCDVGUEQOTAC-UHFFFAOYSA-N 2,5-diethylphenol Chemical compound CCC1=CC=C(CC)C(O)=C1 AQFCDVGUEQOTAC-UHFFFAOYSA-N 0.000 description 1
- KUMMBDBTERQYCG-UHFFFAOYSA-N 2,6-bis(hydroxymethyl)-4-methylphenol Chemical compound CC1=CC(CO)=C(O)C(CO)=C1 KUMMBDBTERQYCG-UHFFFAOYSA-N 0.000 description 1
- VRMKFAFIVOVETG-UHFFFAOYSA-N 2,6-bis(methoxymethyl)-4-methylphenol Chemical compound COCC1=CC(C)=CC(COC)=C1O VRMKFAFIVOVETG-UHFFFAOYSA-N 0.000 description 1
- WMDZKDKPYCNCDZ-UHFFFAOYSA-N 2-(2-butoxypropoxy)propan-1-ol Chemical compound CCCCOC(C)COC(C)CO WMDZKDKPYCNCDZ-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- BJINVQNEBGOMCR-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethyl acetate Chemical compound COCCOCCOC(C)=O BJINVQNEBGOMCR-UHFFFAOYSA-N 0.000 description 1
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 description 1
- AHNLTPNNRFETEC-UHFFFAOYSA-N 2-(3-trimethoxysilylpropyl)butanedioic acid Chemical compound CO[Si](OC)(OC)CCCC(C(O)=O)CC(O)=O AHNLTPNNRFETEC-UHFFFAOYSA-N 0.000 description 1
- GOLSFPMYASLXJC-UHFFFAOYSA-N 2-(dimethylamino)ethyl acetate Chemical compound CN(C)CCOC(C)=O GOLSFPMYASLXJC-UHFFFAOYSA-N 0.000 description 1
- LKMJVFRMDSNFRT-UHFFFAOYSA-N 2-(methoxymethyl)oxirane Chemical compound COCC1CO1 LKMJVFRMDSNFRT-UHFFFAOYSA-N 0.000 description 1
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical compound CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 1
- XZXYQEHISUMZAT-UHFFFAOYSA-N 2-[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenol Chemical compound CC1=CC=C(O)C(CC=2C(=CC=C(C)C=2)O)=C1 XZXYQEHISUMZAT-UHFFFAOYSA-N 0.000 description 1
- FOLUJWPWRXHMLF-UHFFFAOYSA-N 2-[2-(2-carboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]benzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=CC=C1C(O)=O FOLUJWPWRXHMLF-UHFFFAOYSA-N 0.000 description 1
- RRUFLWHHNNUUCS-UHFFFAOYSA-N 2-[9-(cyanomethyl)fluoren-9-yl]acetonitrile Chemical compound C1=CC=C2C(CC#N)(CC#N)C3=CC=CC=C3C2=C1 RRUFLWHHNNUUCS-UHFFFAOYSA-N 0.000 description 1
- CHSVVAWYRBLWTK-UHFFFAOYSA-N 2-[[2-[1-[2-(oxiran-2-ylmethoxy)phenyl]-9h-fluoren-2-yl]phenoxy]methyl]oxirane Chemical compound C1OC1COC1=CC=CC=C1C1=CC=C(C2=CC=CC=C2C2)C2=C1C1=CC=CC=C1OCC1CO1 CHSVVAWYRBLWTK-UHFFFAOYSA-N 0.000 description 1
- BXVXPASMKWYBFD-UHFFFAOYSA-N 2-[[2-hydroxy-3-(hydroxymethyl)-5-methylphenyl]methyl]-6-(hydroxymethyl)-4-methylphenol Chemical compound CC1=CC(CO)=C(O)C(CC=2C(=C(CO)C=C(C)C=2)O)=C1 BXVXPASMKWYBFD-UHFFFAOYSA-N 0.000 description 1
- QLIBJPGWWSHWBF-UHFFFAOYSA-N 2-aminoethyl methacrylate Chemical compound CC(=C)C(=O)OCCN QLIBJPGWWSHWBF-UHFFFAOYSA-N 0.000 description 1
- QSKPIOLLBIHNAC-UHFFFAOYSA-N 2-chloro-acetaldehyde Chemical compound ClCC=O QSKPIOLLBIHNAC-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- DNCLEPRFPJLBTQ-UHFFFAOYSA-N 2-cyclohexyl-4-[1-(3-cyclohexyl-4-hydroxyphenyl)cyclohexyl]phenol Chemical compound OC1=CC=C(C2(CCCCC2)C=2C=C(C(O)=CC=2)C2CCCCC2)C=C1C1CCCCC1 DNCLEPRFPJLBTQ-UHFFFAOYSA-N 0.000 description 1
- WKVWOPDUENJKAR-UHFFFAOYSA-N 2-cyclohexyl-4-[2-(3-cyclohexyl-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C(C2CCCCC2)=CC=1C(C)(C)C(C=1)=CC=C(O)C=1C1CCCCC1 WKVWOPDUENJKAR-UHFFFAOYSA-N 0.000 description 1
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- ZTMADXFOCUXMJE-UHFFFAOYSA-N 2-methylbenzene-1,3-diol Chemical compound CC1=C(O)C=CC=C1O ZTMADXFOCUXMJE-UHFFFAOYSA-N 0.000 description 1
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 1
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 236TMPh Natural products CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 1
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 1
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- ZADOWCXTUZWAKL-UHFFFAOYSA-N 3-(3-trimethoxysilylpropyl)oxolane-2,5-dione Chemical compound CO[Si](OC)(OC)CCCC1CC(=O)OC1=O ZADOWCXTUZWAKL-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- FGWQCROGAHMWSU-UHFFFAOYSA-N 3-[(4-aminophenyl)methyl]aniline Chemical compound C1=CC(N)=CC=C1CC1=CC=CC(N)=C1 FGWQCROGAHMWSU-UHFFFAOYSA-N 0.000 description 1
- UCFMKTNJZCYBBJ-UHFFFAOYSA-N 3-[1-(2,3-dicarboxyphenyl)ethyl]phthalic acid Chemical compound C=1C=CC(C(O)=O)=C(C(O)=O)C=1C(C)C1=CC=CC(C(O)=O)=C1C(O)=O UCFMKTNJZCYBBJ-UHFFFAOYSA-N 0.000 description 1
- DFSUKONUQMHUKQ-UHFFFAOYSA-N 3-[2-(2,3-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phthalic acid Chemical compound OC(=O)C1=CC=CC(C(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)(C(F)(F)F)C(F)(F)F)=C1C(O)=O DFSUKONUQMHUKQ-UHFFFAOYSA-N 0.000 description 1
- YREZIWUCYDRMPK-UHFFFAOYSA-N 3-[9-(3-aminopropyl)fluoren-9-yl]propan-1-amine Chemical compound C1=CC=C2C(CCCN)(CCCN)C3=CC=CC=C3C2=C1 YREZIWUCYDRMPK-UHFFFAOYSA-N 0.000 description 1
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- KTFJPMPXSYUEIP-UHFFFAOYSA-N 3-benzoylphthalic acid Chemical compound OC(=O)C1=CC=CC(C(=O)C=2C=CC=CC=2)=C1C(O)=O KTFJPMPXSYUEIP-UHFFFAOYSA-N 0.000 description 1
- SKKHNUKNMQLBTJ-UHFFFAOYSA-N 3-bicyclo[2.2.1]heptanyl 2-methylprop-2-enoate Chemical compound C1CC2C(OC(=O)C(=C)C)CC1C2 SKKHNUKNMQLBTJ-UHFFFAOYSA-N 0.000 description 1
- HORNXRXVQWOLPJ-UHFFFAOYSA-N 3-chlorophenol Chemical compound OC1=CC=CC(Cl)=C1 HORNXRXVQWOLPJ-UHFFFAOYSA-N 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- WHNPOQXWAMXPTA-UHFFFAOYSA-N 3-methylbut-2-enamide Chemical compound CC(C)=CC(N)=O WHNPOQXWAMXPTA-UHFFFAOYSA-N 0.000 description 1
- NXTNASSYJUXJDV-UHFFFAOYSA-N 3-nitrobenzoyl chloride Chemical compound [O-][N+](=O)C1=CC=CC(C(Cl)=O)=C1 NXTNASSYJUXJDV-UHFFFAOYSA-N 0.000 description 1
- HSSYVKMJJLDTKZ-UHFFFAOYSA-N 3-phenylphthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C=CC=CC=2)=C1C(O)=O HSSYVKMJJLDTKZ-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 1
- UYFSNTFLFWUGGL-UHFFFAOYSA-N 4-(1-trimethoxysilylethyl)phenol Chemical compound CO[Si](OC)(OC)C(C)C1=CC=C(O)C=C1 UYFSNTFLFWUGGL-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- AIVVXPSKEVWKMY-UHFFFAOYSA-N 4-(3,4-dicarboxyphenoxy)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 AIVVXPSKEVWKMY-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- JTWYIRAWVVAUBZ-UHFFFAOYSA-N 4-(4-amino-2,3-dimethylphenyl)-2,3-dimethylaniline Chemical group C1=C(N)C(C)=C(C)C(C=2C(=C(C)C(N)=CC=2)C)=C1 JTWYIRAWVVAUBZ-UHFFFAOYSA-N 0.000 description 1
- GPQSJXRIHLUAKX-UHFFFAOYSA-N 4-(4-amino-2-ethylphenyl)-3-ethylaniline Chemical group CCC1=CC(N)=CC=C1C1=CC=C(N)C=C1CC GPQSJXRIHLUAKX-UHFFFAOYSA-N 0.000 description 1
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical group CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 1
- OUOAFMZIPXCUBR-UHFFFAOYSA-N 4-(4-amino-3,4-dimethylcyclohexa-2,5-dien-1-ylidene)-1,2-dimethylcyclohexa-2,5-dien-1-amine Chemical group C1=CC(N)(C)C(C)=CC1=C1C=C(C)C(C)(N)C=C1 OUOAFMZIPXCUBR-UHFFFAOYSA-N 0.000 description 1
- VLZIZQRHZJOXDM-UHFFFAOYSA-N 4-(4-amino-3-ethylphenyl)-2-ethylaniline Chemical group C1=C(N)C(CC)=CC(C=2C=C(CC)C(N)=CC=2)=C1 VLZIZQRHZJOXDM-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- IWXCYYWDGDDPAC-UHFFFAOYSA-N 4-[(3,4-dicarboxyphenyl)methyl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1CC1=CC=C(C(O)=O)C(C(O)=O)=C1 IWXCYYWDGDDPAC-UHFFFAOYSA-N 0.000 description 1
- BRPSWMCDEYMRPE-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxyphenyl)ethyl]phenol Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=C(O)C=C1 BRPSWMCDEYMRPE-UHFFFAOYSA-N 0.000 description 1
- APXJLYIVOFARRM-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(C(O)=O)C(C(O)=O)=C1 APXJLYIVOFARRM-UHFFFAOYSA-N 0.000 description 1
- GEYAGBVEAJGCFB-UHFFFAOYSA-N 4-[2-(3,4-dicarboxyphenyl)propan-2-yl]phthalic acid Chemical compound C=1C=C(C(O)=O)C(C(O)=O)=CC=1C(C)(C)C1=CC=C(C(O)=O)C(C(O)=O)=C1 GEYAGBVEAJGCFB-UHFFFAOYSA-N 0.000 description 1
- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 description 1
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 description 1
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 1
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical group C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 description 1
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 1
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 description 1
- WFCQTAXSWSWIHS-UHFFFAOYSA-N 4-[bis(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 WFCQTAXSWSWIHS-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 1
- MNVMYTVDDOXZLS-UHFFFAOYSA-N 4-methoxyguaiacol Natural products COC1=CC=C(O)C(OC)=C1 MNVMYTVDDOXZLS-UHFFFAOYSA-N 0.000 description 1
- FNYDIAAMUCQQDE-UHFFFAOYSA-N 4-methylbenzene-1,3-diol Chemical compound CC1=CC=C(O)C=C1O FNYDIAAMUCQQDE-UHFFFAOYSA-N 0.000 description 1
- JSBBGWWJLQNXNQ-UHFFFAOYSA-N 4-phenylbenzene-1,2,3-tricarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC=C1 JSBBGWWJLQNXNQ-UHFFFAOYSA-N 0.000 description 1
- SHDBJOYDLRRTRA-UHFFFAOYSA-N 4-tert-butyl-2,6-bis(methoxymethyl)phenol Chemical compound COCC1=CC(C(C)(C)C)=CC(COC)=C1O SHDBJOYDLRRTRA-UHFFFAOYSA-N 0.000 description 1
- HLRIPFBLDKQDJL-UHFFFAOYSA-N 4-trimethoxysilylphenol Chemical compound CO[Si](OC)(OC)C1=CC=C(O)C=C1 HLRIPFBLDKQDJL-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-N Acetoacetic acid Natural products CC(=O)CC(O)=O WDJHALXBUFZDSR-UHFFFAOYSA-N 0.000 description 1
- GIXXQTYGFOHYPT-UHFFFAOYSA-N Bisphenol P Chemical compound C=1C=C(C(C)(C)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 GIXXQTYGFOHYPT-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- HCHDYJCQAHZANX-UHFFFAOYSA-N C(=O)(O)C=1C=C(C=CC1C(=O)O)C1(C2=CC=CC=C2C=2C=CC=C(C12)C(=O)O)C1=CC(=C(C=C1)C(=O)O)C(=O)O Chemical compound C(=O)(O)C=1C=C(C=CC1C(=O)O)C1(C2=CC=CC=C2C=2C=CC=C(C12)C(=O)O)C1=CC(=C(C=C1)C(=O)O)C(=O)O HCHDYJCQAHZANX-UHFFFAOYSA-N 0.000 description 1
- DVEHYHFBRYRCJC-UHFFFAOYSA-N C(=O)(O)C=1C=C(OC2=CC=C(C=C2)C2(C3=CC=CC=C3C=3C=CC=C(C2=3)C(=O)O)C2=CC=C(C=C2)OC2=CC(=C(C=C2)C(=O)O)C(=O)O)C=CC=1C(=O)O Chemical compound C(=O)(O)C=1C=C(OC2=CC=C(C=C2)C2(C3=CC=CC=C3C=3C=CC=C(C2=3)C(=O)O)C2=CC=C(C=C2)OC2=CC(=C(C=C2)C(=O)O)C(=O)O)C=CC=1C(=O)O DVEHYHFBRYRCJC-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- VIZORQUEIQEFRT-UHFFFAOYSA-N Diethyl adipate Chemical compound CCOC(=O)CCCCC(=O)OCC VIZORQUEIQEFRT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000005526 G1 to G0 transition Effects 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- ZSXGLVDWWRXATF-UHFFFAOYSA-N N,N-dimethylformamide dimethyl acetal Chemical compound COC(OC)N(C)C ZSXGLVDWWRXATF-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical class CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- JOFSEHHMYPDWFR-UHFFFAOYSA-N [3-(acetyloxymethyl)-2-hydroxy-5-methylphenyl]methyl acetate Chemical compound CC(=O)OCC1=CC(C)=CC(COC(C)=O)=C1O JOFSEHHMYPDWFR-UHFFFAOYSA-N 0.000 description 1
- RQVFGTYFBUVGOP-UHFFFAOYSA-N [acetyloxy(dimethyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(C)OC(C)=O RQVFGTYFBUVGOP-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000004849 alkoxymethyl group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000004103 aminoalkyl group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000008346 aqueous phase Substances 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- FDQSRULYDNDXQB-UHFFFAOYSA-N benzene-1,3-dicarbonyl chloride Chemical compound ClC(=O)C1=CC=CC(C(Cl)=O)=C1 FDQSRULYDNDXQB-UHFFFAOYSA-N 0.000 description 1
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 1
- 229940092714 benzenesulfonic acid Drugs 0.000 description 1
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- QDHFHIQKOVNCNC-UHFFFAOYSA-N butane-1-sulfonic acid Chemical compound CCCCS(O)(=O)=O QDHFHIQKOVNCNC-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000480 butynyl group Chemical group [*]C#CC([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000013256 coordination polymer Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 125000004966 cyanoalkyl group Chemical group 0.000 description 1
- 125000006165 cyclic alkyl group Chemical group 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- WOSVXXBNNCUXMT-UHFFFAOYSA-N cyclopentane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1CC(C(O)=O)C(C(O)=O)C1C(O)=O WOSVXXBNNCUXMT-UHFFFAOYSA-N 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 125000003493 decenyl group Chemical group [H]C([*])=C([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- WOWBFOBYOAGEEA-UHFFFAOYSA-N diafenthiuron Chemical compound CC(C)C1=C(NC(=S)NC(C)(C)C)C(C(C)C)=CC(OC=2C=CC=CC=2)=C1 WOWBFOBYOAGEEA-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- SGXNQRUIKNITME-UHFFFAOYSA-N diethoxy(dinaphthalen-1-yl)silane Chemical compound C1=CC=C2C([Si](OCC)(C=3C4=CC=CC=C4C=CC=3)OCC)=CC=CC2=C1 SGXNQRUIKNITME-UHFFFAOYSA-N 0.000 description 1
- GAURFLBIDLSLQU-UHFFFAOYSA-N diethoxy(methyl)silicon Chemical compound CCO[Si](C)OCC GAURFLBIDLSLQU-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- IJKVHSBPTUYDLN-UHFFFAOYSA-N dihydroxy(oxo)silane Chemical compound O[Si](O)=O IJKVHSBPTUYDLN-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- WBHGKPLIBNATGB-UHFFFAOYSA-N dimethoxy(dinaphthalen-1-yl)silane Chemical compound C1=CC=C2C([Si](OC)(C=3C4=CC=CC=C4C=CC=3)OC)=CC=CC2=C1 WBHGKPLIBNATGB-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- CCIVGXIOQKPBKL-UHFFFAOYSA-M ethanesulfonate Chemical compound CCS([O-])(=O)=O CCIVGXIOQKPBKL-UHFFFAOYSA-M 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- HHBOIIOOTUCYQD-UHFFFAOYSA-N ethoxy-dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(C)CCCOCC1CO1 HHBOIIOOTUCYQD-UHFFFAOYSA-N 0.000 description 1
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 150000002220 fluorenes Chemical class 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000005980 hexynyl group Chemical group 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000752 ionisation method Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- UKVIEHSSVKSQBA-UHFFFAOYSA-N methane;palladium Chemical compound C.[Pd] UKVIEHSSVKSQBA-UHFFFAOYSA-N 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- FBNXYLDLGARYKQ-UHFFFAOYSA-N methoxy-dimethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(C)CCCOCC1CO1 FBNXYLDLGARYKQ-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- CLZGJKHEVKJLLS-UHFFFAOYSA-N n,n-diheptylheptan-1-amine Chemical compound CCCCCCCN(CCCCCCC)CCCCCCC CLZGJKHEVKJLLS-UHFFFAOYSA-N 0.000 description 1
- DIAIBWNEUYXDNL-UHFFFAOYSA-N n,n-dihexylhexan-1-amine Chemical compound CCCCCCN(CCCCCC)CCCCCC DIAIBWNEUYXDNL-UHFFFAOYSA-N 0.000 description 1
- MBHINSULENHCMF-UHFFFAOYSA-N n,n-dimethylpropanamide Chemical compound CCC(=O)N(C)C MBHINSULENHCMF-UHFFFAOYSA-N 0.000 description 1
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 description 1
- OOHAUGDGCWURIT-UHFFFAOYSA-N n,n-dipentylpentan-1-amine Chemical compound CCCCCN(CCCCC)CCCCC OOHAUGDGCWURIT-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- YNDRMAAWTXUJPV-UHFFFAOYSA-N n-cyclohexyl-2-methylidenecyclohexan-1-amine Chemical compound C=C1CCCCC1NC1CCCCC1 YNDRMAAWTXUJPV-UHFFFAOYSA-N 0.000 description 1
- MZYHMUONCNKCHE-UHFFFAOYSA-N naphthalene-1,2,3,4-tetracarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=C(C(O)=O)C(C(O)=O)=C21 MZYHMUONCNKCHE-UHFFFAOYSA-N 0.000 description 1
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical group [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- GOGZBMRXLADNEV-UHFFFAOYSA-N naphthalene-2,6-diamine Chemical compound C1=C(N)C=CC2=CC(N)=CC=C21 GOGZBMRXLADNEV-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000005187 nonenyl group Chemical group C(=CCCCCCCC)* 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000005981 pentynyl group Chemical group 0.000 description 1
- FVDOBFPYBSDRKH-UHFFFAOYSA-N perylene-3,4,9,10-tetracarboxylic acid Chemical compound C=12C3=CC=C(C(O)=O)C2=C(C(O)=O)C=CC=1C1=CC=C(C(O)=O)C2=C1C3=CC=C2C(=O)O FVDOBFPYBSDRKH-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- LYKRPDCJKSXAHS-UHFFFAOYSA-N phenyl-(2,3,4,5-tetrahydroxyphenyl)methanone Chemical compound OC1=C(O)C(O)=CC(C(=O)C=2C=CC=CC=2)=C1O LYKRPDCJKSXAHS-UHFFFAOYSA-N 0.000 description 1
- NVQBAIMDGFLXBX-UHFFFAOYSA-N phosphoric acid;prop-1-ene Chemical compound CC=C.OP(O)(O)=O NVQBAIMDGFLXBX-UHFFFAOYSA-N 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N pigment red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- 239000003880 polar aprotic solvent Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- KCXFHTAICRTXLI-UHFFFAOYSA-N propane-1-sulfonic acid Chemical compound CCCS(O)(=O)=O KCXFHTAICRTXLI-UHFFFAOYSA-N 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002568 propynyl group Chemical group [*]C#CC([H])([H])[H] 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 150000003459 sulfonic acid esters Chemical group 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 1
- ADLSSRLDGACTEX-UHFFFAOYSA-N tetraphenyl silicate Chemical compound C=1C=CC=CC=1O[Si](OC=1C=CC=CC=1)(OC=1C=CC=CC=1)OC1=CC=CC=C1 ADLSSRLDGACTEX-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- YZVRVDPMGYFCGL-UHFFFAOYSA-N triacetyloxysilyl acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)OC(C)=O YZVRVDPMGYFCGL-UHFFFAOYSA-N 0.000 description 1
- ZQJYXISBATZORI-UHFFFAOYSA-N tributyl(ethoxy)silane Chemical compound CCCC[Si](CCCC)(CCCC)OCC ZQJYXISBATZORI-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- CIGLHMQJIHXLPV-UHFFFAOYSA-N triethoxy(3-methoxypropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCOC CIGLHMQJIHXLPV-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- ZJEYUFMTCHLQQI-UHFFFAOYSA-N triethoxy(naphthalen-1-yl)silane Chemical compound C1=CC=C2C([Si](OCC)(OCC)OCC)=CC=CC2=C1 ZJEYUFMTCHLQQI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- BOVWGKNFLVZRDU-UHFFFAOYSA-N triethoxy(trifluoromethyl)silane Chemical compound CCO[Si](OCC)(OCC)C(F)(F)F BOVWGKNFLVZRDU-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- ZSOVVFMGSCDMIF-UHFFFAOYSA-N trimethoxy(naphthalen-1-yl)silane Chemical compound C1=CC=C2C([Si](OC)(OC)OC)=CC=CC2=C1 ZSOVVFMGSCDMIF-UHFFFAOYSA-N 0.000 description 1
- ORVBHOQTQDOUIW-UHFFFAOYSA-N trimethoxy(trifluoromethyl)silane Chemical compound CO[Si](OC)(OC)C(F)(F)F ORVBHOQTQDOUIW-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
Definitions
- the present invention relates to a photosensitive resin composition, a cured product, a display device, a semiconductor device, and a method for producing a cured product.
- organic electroluminescence hereinafter referred to as organic EL
- display devices having a thin display such as smartphones, tablet PCs, and televisions.
- an organic EL display device has a drive circuit, a flattening layer, a first electrode, a pixel dividing layer, a light emitting layer, and a second electrode on a substrate, and is located between the first electrode and the second electrode facing each other. It emits light by applying a voltage.
- a photosensitive resin composition that can be patterned by ultraviolet irradiation is generally used.
- the positive photosensitive resin compositions that have been proposed so far are those obtained by mixing an alkali-soluble resin with a photosensitive component, naphthoquinonediazide sulfonic acid ester, and using a polyimide precursor as the resin (see, for example, Patent Document 1). ), Those using a polybenzoxazole precursor (see, for example, Patent Document 2).
- organic EL display devices are becoming stricter year by year, and the design / design of materials for flattening layers and pixel division layers, such as placing a camera directly under the display of a transmissive organic EL display or mobile terminal. From the viewpoint of diversification and further functionalization, transparency in the visible light region is required.
- the photosensitive resin composition of the present invention has the following constitution. That is, (A) Alkaline-soluble resin, (B) Photoacid generator and (C) Compound having a phenolic hydroxyl group having an octanol / water partition coefficient (LogP) of 4.6 to 20.0 (hereinafter referred to as component (C)).
- component (C) Compound having a phenolic hydroxyl group having an octanol / water partition coefficient (LogP) of 4.6 to 20.0.
- component (C) Compound having a phenolic hydroxyl group having an octanol / water partition coefficient (LogP) of 4.6 to 20.0
- component (C) Compound having a phenolic hydroxyl group having an octanol / water partition coefficient (LogP) of 4.6 to 20.0
- a photosensitive resin composition containing, and having a transmittance of 80% or more and 99% or less at 400 nm at a thickness of 1.5 ⁇
- the first aspect of the cured product of the present invention is a cured product obtained by curing the photosensitive resin composition of the present invention.
- the method for producing a cured product of the present invention includes a step of applying the photosensitive resin composition of the present invention to a substrate to form a resin film, a step of drying the resin film, a step of exposing the dried resin film, and exposure.
- This is a method for producing a cured product which comprises a step of developing a resin film and a step of heat-treating the developed resin film to obtain a cured product.
- a second aspect of the cured product of the present invention is a compound having a transmittance of 80% or more and 99% or less at 400 nm at a thickness of 1.5 ⁇ m, a yellow index of 0.1 or more and 7 or less, and an imide ring structure. It is a cured product containing a compound having an indene structure, a compound having a structure represented by the formula (2), and a compound having a structure represented by the formula (1).
- R 2 , R 3 and R 4 are monovalent organic groups having 1 to 30 carbon atoms which may independently contain a hydrogen atom or a hetero atom, respectively.
- Each R 1 is a monovalent organic group having 1 to 20 carbon atoms which may contain a hetero atom independently.
- the organic EL display device of the present invention is an organic EL display device provided with the cured product of the present invention.
- the semiconductor device of the present invention is a semiconductor device provided with the cured product of the present invention.
- the photosensitive resin composition of the present invention is excellent in visible light transmission after heat curing.
- the photosensitive resin composition of the present invention is (A) Alkaline-soluble resin, A photosensitive resin composition containing (B) a photoacid generator and (C) a compound having a phenolic hydroxyl group having an octanol / water partition coefficient (LogP) of 4.6 to 20.0, which is thermally cured.
- the transmittance at 400 nm at a thickness of 1.5 ⁇ m is 80% or more and 99% or less, and the yellow index is 0.1 or more and 7.0 or less.
- the photosensitive resin composition of the present invention is preferably used for the flattening layer and / or the pixel dividing layer of the organic EL display device. When used in such a layer, it becomes easy to improve the visible light transmittance of the organic EL display device.
- the photosensitive resin composition of the present invention is used for a mobile device provided with a camera and / or a sensor directly under the active area of the organic EL display device. Since the photosensitive resin composition is used for each of the above-mentioned layers, the visible light transmittance of the organic EL display device can be easily improved. Therefore, a mobile equipped with a camera and / or a sensor directly under the active area of the organic EL display device. It will be easier to use for the device. Therefore, it becomes easy to correspond to various designs / designs such as a transmissive organic EL display.
- the photosensitive resin composition of the present invention contains (A) an alkali-soluble resin.
- alkali-soluble means that a solution of a resin dissolved in ⁇ -butyrolactone is applied onto a silicon wafer and prebaked at 120 ° C. for 4 minutes to form a prebaked film having a thickness of 10 ⁇ m ⁇ 0.5 ⁇ m.
- the dissolution rate required from the decrease in film thickness when the prebake film is immersed in a 2.38 mass% tetramethylammonium hydroxide aqueous solution at 23 ⁇ 1 ° C. and then rinsed with pure water is 50 nm / min or more. To say.
- alkali-soluble resin examples include polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyaminoamide, acrylic resin, cardo resin, phenol resin, cyclic olefin polymer, and polysiloxane. Not limited to this.
- the alkali-soluble resin may contain two or more of these resins. Among these alkali-soluble resins, those having excellent heat resistance and a small amount of outgas at high temperatures are preferable. Specifically, one or more alkali-soluble resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, their copolymers and polysiloxane are preferable.
- the (A) alkali-soluble resin is a polyimide, a polyimide precursor, a polybenzoxazole, a polybenzoxazole precursor, and their co-weights, because they have excellent film physical properties such as bending resistance. It is more preferable to contain one or more kinds of alkali-soluble resins selected from the group consisting of coalescing. Further, from the viewpoint of visible light transmission, exposure sensitivity and chemical resistance, one or more alkali-soluble resins selected from the group consisting of polyimide precursors, polybenzoxazole precursors and copolymers thereof are particularly preferable.
- the alkali-soluble resin preferably has an acidic group in the structural unit of the resin and / or at the end of the main chain thereof. Having an acidic group makes it easier to obtain alkali solubility.
- the acidic group include a carboxyl group, a phenolic hydroxyl group, and a sulfonic acid group. Of these, carboxyl groups and phenolic hydroxyl groups are preferable in that they do not contain sulfur atoms.
- the alkali-soluble resin preferably has a fluorine atom.
- a fluorine atom By having a fluorine atom, it is possible to impart water repellency to the interface between the film and the base material when developing with an alkaline aqueous solution, and to suppress the penetration of the alkaline aqueous solution into the interface.
- the fluorine atom content in the alkali-soluble resin is preferably 5% by mass or more in (A) 100% by mass of the alkali-soluble resin from the viewpoint of the effect of preventing the alkaline aqueous solution from seeping into the interface, and 20 from the viewpoint of solubility in the alkaline aqueous solution. It is preferably mass% or less.
- the alkali-soluble resin can be synthesized by a known method.
- a method of reacting a tetracarboxylic acid dianhydride with a diamine compound at a low temperature a method of reacting a tetracarboxylic acid dianhydride with a diamine compound at a low temperature, and then N, N- Dimethylformamide
- a method of partially esterifying the amic acid structure with dimethylacetal or the like a method of obtaining a diester with a tetracarboxylic acid dianhydride and an alcohol, and then reacting with an amine in the presence of a condensing agent, a method of tetracarboxylic acid dianhydride.
- a diester can be obtained from the compound and an alcohol, and then the remaining dicarboxylic acid can be acid chlorided and synthesized by a method of reacting with an amine.
- polyimide for example, it can be obtained by dehydrating and ring-closing the polyimide precursor obtained by the above-mentioned method by heating in a solvent or by chemical treatment with an acid or a base.
- a polybenzoxazole precursor it can be obtained, for example, by subjecting a bisaminophenol compound and a dicarboxylic acid to a condensation reaction.
- a dehydration condensing agent for example, there is a method of reacting a dehydration condensing agent with an acid and adding a bisaminophenol compound to the reaction, or a method of dropping a solution of a dicarboxylic acid dichloride into a solution of a bisaminophenol compound to which a tertiary amine is added.
- the dehydration condensing agent include dicyclohexylcarbodiimide (DCC) and the like.
- pyridine and the like are mentioned as a tertiary amine.
- polybenzoxazole for example, it can be obtained by dehydrating and closing the ring of the polybenzoxazole precursor obtained by the above method by heating in a solvent or by chemical treatment with an acid or a base.
- Examples of the acid dianhydride used for polyimide, the polyimide precursor and its copolymer include pyromellitic acid dianhydride, 3,3', 4,4'-biphenyltetracarboxylic acid dianhydride, 2,3.
- Examples of the acid component used for polybenzoxazole, polybenzoxazole precursor and its copolymer include dicarboxylic acid, tricarboxylic acid, tetracarboxylic acid and the like.
- Examples of the dicarboxylic acid include terephthalic acid, isophthalic acid, diphenyl ether dicarboxylic acid, bis (carboxyphenyl) hexafluoropropane, biphenyldicarboxylic acid, benzophenone dicarboxylic acid, triphenyldicarboxylic acid and the like.
- Examples of the tricarboxylic acid include trimellitic acid, trimesic acid, diphenyl ether tricarboxylic acid, biphenyl tricarboxylic acid and the like.
- Examples of the tetracarboxylic acid include aromatic tetracarboxylic acid and aliphatic tetracarboxylic acid.
- aromatic tetracarboxylic acids are pyromellitic acid, 3,3', 4,4'-biphenyltetracarboxylic acid, 2,3,3', 4'-biphenyltetracarboxylic acid, 2,2', 3, 3'-biphenyltetracarboxylic acid, 3,3', 4,4'-benzophenone tetracarboxylic acid, 2,2', 3,3'-benzophenone tetracarboxylic acid, 2,2-bis (3,4-dicarboxy) Phenyl) hexafluoropropane, 2,2-bis (2,3-dicarboxyphenyl) hexafluoropropane, 1,1-bis (3,4-dicarboxyphenyl) ethane, 1,1-bis (2,3-bis) Dicarboxyphenyl) ethane, bis (3,4-dicarboxyphenyl) methane, bis (2,3-dicarboxy
- diamines include 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylmethane, and 1,4-bis (4-amino).
- Phenoxy) benzene benzidine, m-phenylenediamine, p-phenylenediamine, 1,5-naphthalenediamine, 2,6-naphthalenediamine, bis (4-aminophenoxy) biphenyl, bis ⁇ 4- (4-aminophenoxy) phenyl ⁇ Ether, 1,4-bis (4-aminophenoxy) benzene, 2,2'-dimethyl-4,4'-diaminobiphenyl, 2,2'-diethyl-4,4'-diaminobiphenyl, 3,3' -Dimethyl-4,4'-diaminobiphenyl, 3,3'-diethyl-4,4'-diaminobiphenyl, 2,2', 3,3'-tetramethyl-4,4'-diaminobiphenyl, 3,3 ', 4,4'-Tetramethyl-4,4'-diaminobiphenyl, 2,2'-di (trifluor
- R 5 and R 8 represent an oxygen atom, C (CF 3 ) 2 , or C (CH 3 ) 2 .
- R 6 , R 7 and R 9 to R 16 independently represent a hydrogen atom or a hydroxyl group, respectively.
- diamines can be used as diamines or as the corresponding diisocyanate compounds, trimethylsilylated diamines.
- end-capping agents include monoamines having acidic groups, acid anhydrides, acid chlorides, monocarboxylic acids and the like.
- the content of the terminal encapsulant is preferably 2 to 25 mol parts with respect to 100 mol parts in total of the acid and amine components constituting the resin.
- the acrylic resin one obtained by radically polymerizing (meth) acrylic acid and (meth) acrylic acid ester is preferable.
- the (meth) acrylic acid ester include methyl (meth) acrylic acid, ethyl (meth) acrylic acid, propyl (meth) acrylic acid, cyclopropyl (meth) acrylic acid, cyclopentyl (meth) acrylic acid, and (meth) acrylic acid.
- Aromatic vinyl compounds such as styrene, p-methylstyrene, o-methylstyrene, m-methylstyrene and ⁇ -methylstyrene may be copolymerized with the above (meth) acrylic acid and (meth) acrylic acid ester. ..
- an ethylenically unsaturated double bond group can be introduced by an addition reaction of an epoxy compound having an ethylenically unsaturated double bond group with (meth) acrylic acid.
- cardo resin examples include a resin having a cardo structure, that is, a skeleton structure in which two cyclic structures are bonded to a quaternary carbon atom constituting the cyclic structure.
- a common cardo structure is a fluorene ring with a benzene ring bonded to it.
- skeleton structure in which two cyclic structures are bonded to the quaternary carbon atom constituting the cyclic structure include a fluorene skeleton, a bisphenol fluorene skeleton, a bisaminophenylfluorene skeleton, a fluorene skeleton having an epoxy group, and an acrylic group.
- fluorene skeleton having a fluorene skeleton examples include a fluorene skeleton having a fluorene skeleton.
- the cardo resin is formed by polymerizing the skeleton having the cardo structure by the reaction between the functional groups bonded to it.
- the cardo resin has a structure (cardo structure) in which a main chain and a bulky side chain are connected by one element, and has a cyclic structure in a direction substantially perpendicular to the main chain.
- the monomer having a cardo structure examples include bis (glycidyloxyphenyl) fluorene type epoxy resin, 9,9-bis (4-hydroxyphenyl) fluorene, and 9,9-bis (4-hydroxy-3-methyl).
- Cardo-structure-containing bisphenols such as phenyl) fluorene, 9,9-bis (cyanoalkyl) fluorene such as 9,9-bis (cyanomethyl) fluorene, 9,9-bis (3-aminopropyl) fluorene, etc. Examples thereof include 9,9-bis (aminoalkyl) fluorenes.
- the cardo resin is a polymer obtained by polymerizing a monomer having a cardo structure, but may be a copolymer with other copolymerizable monomers.
- phenol resin examples include novolak phenol resin and resol phenol resin.
- Phenol resins can be obtained, for example, by polycondensing various phenols alone or a mixture thereof with an aldehyde such as formalin.
- phenols include phenol, p-cresol, m-cresol, o-cresol, 2,3-dimethylphenol, 2,4-dimethylphenol, 2,5-dimethylphenol, 2,6-dimethylphenol, 3, 4-Dimethylphenol, 3,5-dimethylphenol, 2,3,4-trimethylphenol, 2,3,5-trimethylphenol, 3,4,5-trimethylphenol, 2,4,5-trimethylphenol, methylenebisphenol , Methylenebis p-cresol, resorcin, catechol, 2-methylresorcin, 4-methylresorcin, o-chlorophenol, m-chlorophenol, p-chlorophenol, 2,3-dichlorophenol, m-methoxyphenol, p-methoxy Phenol, p-butoxyphenol, o-ethylphenol, m-ethylphenol, p-ethylphenol, 2,3-diethylphenol, 2,5-diethylphenol, p-isoprop
- aldehydes include paraformaldehyde, acetaldehyde, benzaldehyde, hydroxybenzaldehyde, and chloroacetaldehyde. These aldehydes can be used alone or as a mixture of multiple aldehydes.
- the weight average molecular weight of the phenol resin is preferably 2000 to 50,000, and more preferably 3000 to 30,000. By setting the weight average molecular weight to 50,000 or less, developability and sensitivity are likely to be improved. Further, when the value is 2000 or more, the pattern shape, resolution, developability, and heat resistance are likely to be improved.
- the weight average molecular weight of the phenol resin is measured by gel permeation chromatography and calculated in terms of polystyrene.
- polysiloxane examples include polysiloxanes obtained by hydrolyzing and dehydrating and condensing one or more kinds selected from tetrafunctional organosilanes, trifunctional organosilanes, bifunctional organosilanes and monofunctional organosilanes.
- tetrafunctional organosilane examples include tetramethoxysilane, tetraethoxysilane, tetraacetoxysilane, and tetraphenoxysilane.
- trifunctional organosilane examples include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane, and 3 -Methyloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, p-hydroxyphenyltrimethoxysilane, 1- (p-hydroxyphenyl) ethyltrimethoxysilane, 2- (P-Hydroxy
- bifunctional organosilane examples include dimethyldimethoxysilane, dimethyldiethoxysilane, dimethyldiacetoxysilane, din-butyldimethoxysilane, diphenyldimethoxysilane, (3-glycidoxypropyl) methyldimethoxysilane, and (3).
- -Glysidoxypropyl) methyldiethoxysilane, di (1-naphthyl) dimethoxysilane, di (1-naphthyl) diethoxysilane and the like can be mentioned.
- the monofunctional organosilane examples include trimethylmethoxysilane, tri-n-butylethoxysilane, (3-glycidoxypropyl) dimethylmethoxysilane, (3-glycidoxypropyl) dimethylethoxysilane and the like. Two or more of these organosilanes may be used. Further, a silicate compound such as methyl silicate 51 manufactured by Fuso Chemical Industry Co., Ltd. and M silicate 51 manufactured by Tama Chemical Industry Co., Ltd. may be copolymerized.
- the weight average molecular weight (Mw) of the polysiloxane is not particularly limited, but is preferably 1,000 or more in terms of polystyrene measured by GPC (gel permeation chromatography). When it is 1,000 or more, the coating film property is likely to be improved. On the other hand, from the viewpoint of solubility in a developing solution, the Mw of the polysiloxane is preferably 100,000 or less, and more preferably 50,000 or less.
- Polysiloxane can be synthesized, for example, by hydrolyzing and partially condensing a monomer such as organosilane.
- the partial condensation means not condensing all the Si-OH of the hydrolyzate, but leaving a part of Si-OH in the obtained polysiloxane.
- Common methods can be used for hydrolysis and partial condensation. For example, a method of adding a solvent, water, and a catalyst as needed to the organosilane mixture and heating and stirring at 50 to 150 ° C. for about 0.5 to 100 hours can be mentioned. During stirring, the hydrolysis by-product (alcohol such as methanol) and the condensation by-product (water) may be distilled off, if necessary.
- the catalyst is not particularly limited, but an acid catalyst and a base catalyst are preferably used.
- the acid catalyst include hydrochloric acid, nitric acid, sulfuric acid, hydrofluoric acid, phosphoric acid, acetic acid, trifluoroacetic acid, formic acid, polyvalent carboxylic acid or its anhydride, ion exchange resin and the like.
- the base catalyst include triethylamine, tripropylamine, tributylamine, tripentylamine, trihexylamine, triheptylamine, trioctylamine, diethylamine, triethanolamine, diethanolamine, sodium hydroxide, potassium hydroxide and amino. Examples thereof include alkoxysilane having a group and an ion exchange resin.
- the total content of the components (A) to (C) is preferably 50% by mass or more in 100% by mass of the total amount of the photosensitive resin composition excluding the organic solvent, and 80 from the viewpoint of visible light transmission and exposure sensitivity. It is more preferably 90% by mass or more, further preferably 90% by mass or more, and particularly preferably 95% by mass or more. The upper limit of the total content is not particularly limited, but is 100% by mass.
- the total content of the components (A) to (D) is preferably 50% by mass or more, and visible light transmission and exposure. From the viewpoint of sensitivity, it is more preferably 80% by mass or more, further preferably 90% by mass or more, and particularly preferably 95% by mass or more.
- the upper limit of the total content is not particularly limited, but is 100% by mass.
- the photosensitive resin composition of the present invention contains (B) a photoacid generator.
- the (B) photoacid generator may be simply referred to as the (B) component.
- the (B) photoacid generator has a function of generating an acid by irradiation with light and increasing the solubility of the irradiated portion of the light in an alkaline aqueous solution.
- the photoacid generator (B) include naphthoquinone diazide sulfonic acid ester, diaryliodonium salt, triarylsulfonium salt, oxime sulfonate compound, naphthaleneimide compound and the like.
- (B) Light because a positive photosensitive resin precursor composition that is efficiently sensitive to i-line (365 nm), h-line (405 nm), and g-line (436 nm) of a mercury lamp, which is a general ultraviolet ray, can be obtained. It is preferable that the acid generator contains a naphthoquinone diazide sulfonic acid ester.
- the (B) photoacid generator is one or more selected from the group consisting of a naphthoquinone diazide sulfonic acid ester, a diaryliodonium salt, a triarylsulfonium salt, an oxime sulfonate compound, and a naphthaleneimide compound. It is more preferable to contain and.
- the photoacid generating material By having a structure in which the photoacid generating material is applied, the dissolution rate of the unexposed portion when developing with an alkaline aqueous solution is reduced, and the difference in solubility between the exposed portion and the unexposed portion is increased, so that the photosensitivity is highly efficient.
- the unexposed portion is thermally decomposed by a thermosetting treatment to generate an acid, and the temperature is as low as 250 ° C. or lower. Even in curing, the cross-linking reaction of the cross-linking agent proceeds sufficiently, and the chemical resistance of the cured film can be dramatically improved.
- the component (A) contains one or more kinds of alkali-soluble resins selected from the group consisting of a polyimide precursor, a polybenzoxazole precursor and a copolymer thereof, the imide ring and the oxazole ring thereof. Since cyclization is promoted, the cyclization reaction proceeds sufficiently even in low temperature curing, and the chemical resistance of the cured film is improved.
- an oxime sulfonate compound is preferable because it easily causes efficient thermal decomposition at a low temperature of 250 ° C. or lower.
- the (B) photoacid generator contains a naphthoquinone diazide sulfonic acid ester.
- the naphthoquinone diazide sulfonic acid ester is preferably a compound in which a sulfonic acid of naphthoquinone diazide is bonded to a compound having a phenolic hydroxyl group by an ester.
- Compounds having a phenolic hydroxyl group include Bis-Z, BisP-EZ, TekP-4HBPA, TrisP-HAP, TrisP-PA, TrisP-SA, TrisOCR-PA, BisOCHP-Z, BisP-MZ, BisP-PZ, and BisP.
- the naphthoquinone diazide sulfonic acid ester can be synthesized, for example, by an esterification reaction between a compound having a phenolic hydroxyl group and a quinone diazido sulfonic acid compound.
- Examples of the quinonediazide sulfonic acid compound include, but are not limited to, naphthoquinonediazide-4-sulfonic acid and naphthoquinonediazide-5-sulfonic acid.
- the photosensitive resin composition further improves resolution, sensitivity, and residual film ratio by containing the above-mentioned compound having a phenolic hydroxyl group and a naphthoquinone diazide sulfonic acid ester obtained by an esterification reaction with a quinone diazido sulfonic acid compound. do.
- the naphthoquinone diazidosulfonic acid-4-ester compound has absorption in the i-line region of a mercury lamp and is suitable for i-line exposure. Further, the naphthoquinone diazide-5-sulfonic acid ester compound has absorption extending to the g-line region of a mercury lamp and is suitable for g-line exposure.
- the photosensitive resin composition of the present invention can contain both a naphthoquinone diazide-4-sulfonic acid ester compound and a naphthoquinone diazido-5-sulfonic acid ester compound.
- It can also contain a naphthoquinone diazide sulfonic acid ester having both a naphthoquinone diazide-4-sulfonyl group and a naphthoquinone diazide-5-sulfonyl group in the same molecule. Further, both a naphthoquinone diazide-4-sulfonic acid ester compound and a naphthoquinone diazide-5-sulfonic acid ester compound can be contained.
- diaryliodonium salt triarylsulfonium salt, oxime sulfonate compound, and naphthaleneimide compound are shown below, but the present invention is not limited thereto.
- diallyl iodonium salt examples include SP-130 and SP-140 (trade name, manufactured by ADEKA CORPORATION).
- examples of the triarylsulfonium salt include WPAG-567 (trade name, manufactured by Fuji Film Wako Pure Chemical Industries, Ltd.), SP-056 (trade name, manufactured by ADEKA Corporation), SI-200, SI-210, SI-220. (Product name, manufactured by Sanshin Chemical Industries, Ltd.) and the like.
- the oxime sulfonate compound examples include PAG121, PAG103 (trade name, manufactured by BASF Japan Ltd.), PA-480, PA-411, PA-528 (trade name, manufactured by Heleus Co., Ltd.), PAI-01, PAI-.
- PAI-106 PAI-1001, PAI-1002, PAI-1003, PAI-1004 (Midori Kagaku) and the like can be mentioned.
- the naphthaleneimide compound include SP-082, SP-601, SP-606, SP-607, SP-612 (trade name, manufactured by ADEKA CORPORATION), NIT, MIN, ILP-110, ILP-110N, and ILP-. 118, ILP-113, PA-223, PA-298 (trade name, manufactured by Heleus Co., Ltd.), NAI-105, NAI-106, NAI-109 (trade name, manufactured by Midori Chemical Co., Ltd.), etc. Be done.
- the content of the component (B) is preferably 3 parts by mass or more and 50 parts by mass or less with respect to 100 parts by mass of the total amount of the (A) alkali-soluble resin. When it is 3 parts by mass or more, the exposure sensitivity is improved, and when it is 50 parts by mass or less, the visible light transmission is further improved.
- the content of the component (B) is more preferably 5 parts by mass or more and 40 parts by mass or less, further preferably 7 parts by mass or more and 40 parts by mass or less, and 10 parts by mass or more and 35 parts by mass or less. Is particularly preferable.
- the total content of these salts or compounds is 100 parts by mass of the total amount of the alkali-soluble resin (A).
- 0.01 part by mass or more is preferable, and 0.1 part by mass or more is more preferable.
- the total content of these salts or compounds is preferably 5 parts by mass or less, more preferably 3 parts by mass or less, and more preferably 2 parts by mass or less.
- the photosensitive resin composition of the present invention contains (C) a compound having a phenolic hydroxyl group having a LogP of 4.6 to 20.0 (hereinafter, may be referred to as a component (C)).
- the photosensitive resin composition obtained by containing the component (C) hardly dissolves in an alkaline developer before exposure, and easily dissolves in an alkaline developer when exposed, so that film loss due to development is small. And, development becomes easy in a short time. Therefore, the sensitivity is likely to be improved.
- the molecular weight of the component (C) is preferably in the range of 90 to 2000. It is preferably 200 to 1500, and more preferably 300 to 1200.
- the polarity of the component (C) affects the visible light transmittance of the cured film of the photosensitive resin composition.
- the higher the polarity of the component (C) contained in the photosensitive resin composition the lower the visible light transparency when the cured product is formed, and the lower the polarity of the component (C), thereby lowering the polarity of the cured product. Visible light transmission can be improved.
- LogP octanol / water partition coefficient
- LogPow octanol / water partition coefficient
- LogP is a physical property value related to the compatibility of the target substance with water, and the larger this value is, the lower the polarity is.
- LogP is represented by the common logarithm of the concentration ratio of each phase of the target substance, targeting the case where the target substance is in an equilibrium state in a two-phase system of water and octanol (1-octanol).
- LogP can be obtained from the structure of the compound by using the calculation function of commercially available software such as "ChemDraw” (PerkinElmer Informatics, Inc.). In the examples and comparative examples described later, the values obtained by using the built-in "Chemical properties window" in the product name "ChemDraw ver. 19.1.0.8" (manufactured by PerkinElmer Informatics, Inc.) are adopted. did.
- the LogP value of the component (C) is 4.6 to 20.0. If the LogP value of the component (C) is less than 4.6, the visible light transmittance of the cured product tends to decrease. On the other hand, when the LogP value exceeds 20.0, the solubility in a solvent is lowered and the exposure sensitivity is lowered.
- the LogP of the component (C) is preferably 5.5 or more, more preferably 6.0 or more, further preferably 7.0 or more, and particularly preferably 8.0 or more, from the viewpoint of improving visible light transmission.
- the upper limit of LogP is preferably 15.0 or less, more preferably 13.0 or less, and particularly preferably 12.0 or less, from the viewpoint of balancing solubility and exposure sensitivity. Further, from the viewpoint of further reducing the yellow index, the LogP of the component (C) is preferably 8.0 to 15.0.
- the content of the component (C) is preferably 5 parts by mass or more and 40 parts by mass or less with respect to 100 parts by mass of the total amount of the (A) alkali-soluble resin.
- the content is low, the sensitivity may be lowered, while when the content is high, the visible light transmittance after thermosetting may be lowered. Therefore, it is more preferably 10 parts by mass or more and 35 parts by mass or less. From the viewpoint of the balance between sensitivity and visible light transmission after heat curing, it is more preferably 15 parts by mass or more and 30 parts by mass or less.
- component (C) having a LogP value in the range of 4.6 to 20.0 is shown below, but it has a phenolic hydroxyl group and has a LogP value in the range of 4.6 to 20.0. However, it is not limited to these.
- the component (C) When the number of phenolic hydroxyl groups in the component (C) increases, the LogP value tends to decrease, and when the number of substituents and aromatic rings increases, the LogP value tends to increase. Above all, it is preferable that the component (C) has a cyclohexane ring structure because it is effective in improving the LogP value, the solubility of the component (C) in a solvent is unlikely to decrease, and the coloration in thermosetting is small. From the viewpoint of efficiently improving the LogP value and reducing coloration in thermosetting, it is more preferable that the component (C) contains a compound containing two or more cyclohexane ring structures in the molecule.
- the structure having a hydrogen atom at the benzyl position does not contain hydrogen at the benzyl position because coloring is likely to occur during thermal curing, especially during curing in an oxygen atmosphere.
- the component (C) is the compound represented by the formula (3) and the compound represented by the formula (4) in the photosensitive resin composition of the present invention. It is preferable to contain one or more kinds selected from the group consisting of.
- R 17 is an independent methyl group or a group represented by formula (5), and at least one R 17 is a group represented by formula (5).
- c is an integer of 1 to 4. * Indicates the binding position.
- R18 is a divalent organic group having 1 to 10 carbon atoms.
- a and b are independently integers of 0 to 4, and a + b is 1 or more.
- the divalent organic group having 1 to 10 carbon atoms is preferably an alkyl group, an aryl group, or a group having a cyclohexane ring structure.
- the divalent organic group having 1 to 10 carbon atoms is a divalent organic group having 1 to 10 carbon atoms. It is particularly preferable that the group has a cyclohexane ring structure.
- the compound having a phenolic hydroxyl group may be contained in combination of two or more.
- the LogP average value of the compound having a phenolic hydroxyl group is preferably in the range of 4.6 to 20.0.
- the lower limit of the LogP average value is preferably 5.5 or more, more preferably 6.0 or more, further preferably 7.0 or more, and particularly preferably 8.0 or more, from the viewpoint of enhancing visible light transmission.
- the upper limit of the LogP average value is preferably 15.0 or less, more preferably 13.0 or less, and particularly preferably 12.0 or less, from the viewpoint of balancing solubility and exposure sensitivity.
- the LogP average value is a value obtained by multiplying the LogP value of each compound having a phenolic hydroxyl group contained in the photosensitive resin composition by the mass ratio of each phenol compound to the entire phenol compound. It is the value calculated for each phenol compound and the sum of the values.
- the photosensitive resin composition of the present invention has a transmittance of 80% or more and 99% or less at 400 nm at a thickness of 1.5 ⁇ m after heat curing, and a yellow index of 0.1 or more and 7.0 or less. Since the transmittance and the yellow index are in the above ranges, when the cured product of the photosensitive resin composition is applied to an organic EL display device, the visible light transmittance of the organic EL display device is likely to be improved, and thus organic. It will be easier to use for mobile devices equipped with a camera and / or sensor directly under the active area of the EL display device. In addition, it is possible to easily support various designs / designs such as a transmissive organic EL display.
- a resin film described below containing a component (C) having a large LogP and a component (D) described below may be used.
- Examples thereof include a method of lowering the maximum heating temperature in the step of heat-treating to obtain a cured product.
- the photosensitive resin composition of the present invention preferably contains the compound represented by the formula (D) (1) (hereinafter, may be referred to as the component (D)).
- Each R 1 is a monovalent organic group having 1 to 20 carbon atoms which may contain a hetero atom independently.
- the monovalent organic group preferably has 1 to 15 carbon atoms, more preferably 1 to 10 carbon atoms, and particularly preferably 1 to 7 carbon atoms in terms of visible light transmission. Further, from the viewpoint of improving the transparency of visible light, it is preferable that the monovalent organic group having 1 to 20 carbon atoms has a hydroxyl group and an acrylic group. On the other hand, from the viewpoint of increasing heat resistance, chemical resistance and hardness, it is preferable that the monovalent organic group having 1 to 20 carbon atoms has an epoxy group and an oxetanyl group.
- the content of the component (D) is preferably 5 parts by mass or more and 70 parts by mass or less with respect to 100 parts by mass of the total amount of the (A) alkali-soluble resin.
- the content of the component (D) is more preferably 15 parts by mass or more and 65 parts by mass or less, and further preferably 25 parts by mass or more and 60 parts by mass or less.
- the component (D) may be contained in combination of two or more. Examples of the component (D) are shown by the following chemical formulas, but the components are not limited thereto.
- the compound represented by the formula (1) is a compound (DA) in which at least two of R1 in the formula (1) are monovalent groups containing an epoxy group (D).
- D an epoxy group
- it may be simply referred to as a component (D-a) or (D-a))
- / or at least two of R1 in the formula (D-b) (1) have an acrylic group and / or a hydroxyl group.
- It is preferable to contain a compound which is a monovalent group to be contained hereinafter, may be simply referred to as (Db) or (Db) component).
- the compound represented by the formula (1) contains the component (Da), in addition to further improving the transparency, a cross-linking reaction occurs during thermosetting, and the heat resistance of the film after thermosetting. Chemical resistance and hardness can be increased, the amount of outgas from the cured product can be reduced, and the long-term reliability of the organic EL display device can be improved.
- the compound represented by the formula (1) contains the component (Db), in addition to further improving the transparency, the exposure sensitivity is likely to be improved, and the storage stability of the photosensitive resin composition is likely to be improved. Can be kept high.
- the mass ratio (D-a) / (D-b) shall be 1/9 to 9/1. Is preferable, more preferably 1/9 to 8/2, and particularly preferably 2/8 to 7/3.
- the compound represented by the above formula (D) (1) is a monovalent group in which at least two of R1 in the formula (DA) (1) contain an epoxy group.
- (Db) contains a compound in which at least two of R1 in the formula (1) are a monovalent group containing an acrylic group and / or a hydroxyl group, and the mass ratio thereof (D-a). ) / (Db) is preferably 1/9 to 9/1.
- the photosensitive resin composition of the present invention contains the component (C) and the compound represented by the formula (D) at the same time, so that the visible light transmittance can be more easily improved.
- the total content (Cm + Dm) is 20 parts by mass or more and 110 parts by mass or less, and the content ratio (Dm / Cm) is 1/9 to 9 /. It is preferably 1.
- the total content (Cm + Dm) is more preferably 25 parts by mass or more and 100 parts by mass or less, and particularly preferably 40 parts by mass or more and 90 parts by mass or less.
- the content ratio (Dm / Cm) is more preferably 3/7 to 9/1, and particularly preferably 5/5 to 8/2.
- the photosensitive resin composition of the present invention can contain a heat-crosslinking agent as long as the visible light transmittance of the cured product is not impaired.
- the heat-crosslinking agent refers to a compound having at least two thermoreactive functional groups in the molecule. Examples of the thermoreactive functional group include an alkoxymethyl group, a methylol group, an epoxy group, an oxetanyl group and the like.
- the resin of the component (A) or other additive components can be cross-linked to improve the heat resistance, chemical resistance and hardness of the film after heat curing, and further, outgas from the cured product. The amount can be reduced and the long-term reliability of the organic EL display device can be improved.
- the thermal cross-linking agent may be contained in combination of two or more types.
- the content of the thermal cross-linking agent is preferably 1% by mass or more and 30% by mass or less in 100% by mass of the total amount of the photosensitive resin composition excluding the organic solvent.
- the content of the thermal cross-linking agent is 1% by mass or more and 30% by mass or less, the chemical resistance and hardness of the film after firing or curing can be increased, and the amount of outgas from the cured product can be reduced.
- the long-term reliability of the organic EL display device can be enhanced, and the storage stability of the photosensitive resin composition is also excellent.
- the photosensitive resin composition of the present invention preferably contains an organic solvent. As a result, it can be made into a varnish state, and the coatability can be improved.
- organic solvents include polar aprotic solvents such as ⁇ -butyrolactone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, Ethers such as propylene glycol mono-n-propyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, tetrahydrofuran, dioxane, acetone , Methyl ethyl ketone, Diisobutyl ketone, Cyclohexanone, 2-Heptanone, 3-Heptanone, Diacetone alcohol and other ketones, ethylene glycol monomethyl ether acetate, ethylene glycol monomethyl
- the content of the organic solvent is not particularly limited, but is preferably 100 to 3000 parts by mass, and more preferably 150 to 2000 parts by mass with respect to 100 parts by mass of the total amount of the photosensitive resin composition excluding the organic solvent. preferable.
- the proportion of the organic solvent having a boiling point of 180 ° C. or higher in the total amount of the organic solvent is preferably 20% by mass or less, more preferably 10% by mass or less.
- the photosensitive resin composition of the present invention can contain an adhesion improver.
- adhesion improver include vinyltrimethoxysilane, vinyltriethoxysilane, epoxycyclohexylethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, and the like.
- silane coupling agents such as 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, titanium chelating agents, aluminum chelating agents, aromatic amine compounds and alkoxy groups. Examples thereof include a compound obtained by reacting a silicon compound. Two or more of these may be contained.
- adhesion improvers it is possible to improve the adhesion to a base material such as a silicon wafer, ITO, SiO2, or silicon nitride when developing a resin film.
- the content of the adhesion improver is preferably 0.1 to 10% by mass based on 100% by mass of the total amount of the photosensitive resin composition excluding the organic solvent.
- the photosensitive resin composition of the present invention may contain a surfactant, if necessary.
- a surfactant By containing a surfactant, the wettability with the substrate can be improved.
- Commercially available compounds can be used as the surfactant.
- silicone-based surfactants SH series, SD series, ST series of Toray Dow Corning Silicone, BYK series of Big Chemie Japan, KP series of Shinetsu Silicone, Disform series of Nippon Oil & Fats, Toshiba Silicone
- fluorine-based surfactants include the TSF series of Dainippon Ink Industry Co., Ltd., the "Megafuck (registered trademark)” series of Dainippon Ink Industry Co., Ltd., the Florard series of Sumitomo 3M Co., Ltd., and "Surflon (registered trademark)” of Asahi Glass Co., Ltd.
- the content of the surfactant is preferably 0.001 to 1% by mass in 100% by mass of the total amount of the photosensitive resin composition excluding the organic solvent.
- the photosensitive resin composition of the present invention may contain inorganic particles.
- the inorganic particles include, but are not limited to, silicon oxide, titanium oxide, barium titanate, alumina, and talc.
- the primary particle diameter of these inorganic particles is preferably 100 nm or less, more preferably 60 nm or less.
- the content of the inorganic particles is preferably 5 to 50% by mass in 100% by mass of the total amount of the photosensitive resin composition excluding the organic solvent.
- the photosensitive resin composition of the present invention may contain a thermoacid generator as long as it does not impair visible light transmission.
- the thermal acid generator generates an acid by heating to promote the crosslinking reaction of the thermal cross-linking agent, and when the resin of the component (A) has an unclosed ring imide ring structure or an oxazole ring structure, these It is possible to promote cyclization and further improve the mechanical properties of the cured film.
- the thermal decomposition start temperature of the thermal acid generator used in the present invention is preferably 50 ° C to 270 ° C, more preferably 250 ° C or lower. Further, no acid is generated during drying (pre-baking: about 70 to 140 ° C.) after applying the photosensitive resin composition of the present invention to the substrate, and final heating (cure: about) after patterning in subsequent exposure and development. It is preferable to select a substance that generates an acid at 100 to 400 ° C. because it can suppress a decrease in sensitivity during development.
- the acid generated from the thermal acid generator used in the present invention is preferably a strong acid, for example, aryl sulfonic acid such as p-toluene sulfonic acid and benzene sulfonic acid, methane sulfonic acid, ethane sulfonic acid, propane sulfonic acid and butane sulfonic acid.
- aryl sulfonic acid such as p-toluene sulfonic acid and benzene sulfonic acid
- methane sulfonic acid methane sulfonic acid
- ethane sulfonic acid propane sulfonic acid and butane sulfonic acid
- Alkyl sulfonic acid such as and haloalkyl sulfonic acid such as trifluoromethyl sulfonic acid are preferable.
- These can be used as acid protected compounds such as alkyl esters. Two or more of these may
- the content of the thermal acid generator used in the present invention is preferably 0.01% by mass or more, more preferably 0.1% by mass or more in 100% by mass of the total amount of the photosensitive resin composition excluding the organic solvent.
- the content is 0.01% by mass or more, the cross-linking reaction and the cyclization of the unclosed ring structure of the resin are promoted, so that the mechanical properties and chemical resistance of the cured film can be further improved.
- 5% by mass or less is preferable, 3% by mass or less is more preferable, and 2% by mass or less is more preferable.
- the method for producing the photosensitive resin composition of the present invention will be described.
- the components (A) to (C), the component (D) if necessary, and the other components are suspended in a solvent and stirred until dissolved. Can be manufactured with.
- the melting temperature is preferably 5 ° C. or higher and 60 ° C. or lower from the viewpoint of solubility and suppression of the reaction of the components.
- the stirring step is preferably performed in an atmosphere of an inert gas such as nitrogen.
- the photosensitive resin composition of the present invention is suitably used for a surface protective film of a semiconductor element, an interlayer insulating film, an insulating film of an organic EL element, a flattening film of a thin film transistor (TFT) substrate, and the like.
- TFT thin film transistor
- the first aspect of the cured product of the present invention is a cured product obtained by curing the photosensitive resin composition of the present invention.
- the transmittance at 400 nm at a thickness of 1.5 ⁇ m is 80% or more and 99% or less. From the viewpoint of design / design diversification such as arranging a camera directly under the display of a transmissive organic EL display or a mobile terminal, high visible light transmission is preferable, 85% or more is more preferable, and 90% or more is particularly preferable. ..
- the upper limit of the transmittance is not particularly limited, but may be, for example, 99%, 98%, or 97%.
- the yellow index at a thickness of 1.5 ⁇ m is 0.1 or more and 7.0 or less.
- the yellow index is preferably low, more preferably 5.0 or less, and particularly preferably 3.0 or less. ..
- the lower limit of the yellow index is not particularly limited, but may be, for example, 0.1, 0.2, or 0.3.
- the method for producing a cured product of the present invention includes a step of applying the photosensitive resin composition of the present invention to a substrate to form a resin film, a step of drying the resin film, a step of exposing the dried resin film, and exposure. It includes a step of developing a resin film and a step of heat-treating the developed resin film to obtain a cured product.
- the photosensitive resin composition can be applied to a substrate by, for example, a spin coating method, a slit coating method, a dip coating method, a spray coating method, a printing method, or the like to obtain a coating film of the photosensitive resin composition.
- the substrate to which the photosensitive resin composition is applied may be pretreated with the above-mentioned adhesion improving agent in advance.
- a solution in which the adhesion improver is dissolved in a solvent such as isopropanol, ethanol, methanol, water, tetrahydrofuran, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether, ethyl lactate, and diethyl adipate in an amount of 0.5 to 20% by mass is used.
- a method of treating the surface of the base material can be mentioned. Examples of the method for treating the surface of the base material include methods such as spin coating, slit die coating, bar coating, dip coating, spray coating, and steam treatment.
- a metal, glass, resin film, or the like that is preferable for supporting a display device or transporting a post-process can be appropriately selected. If it is a glass substrate, soda lime glass, non-alkali glass, or the like can be used. The thickness of the substrate may be sufficient to maintain the mechanical strength. As for the material of the glass, non-alkali glass is preferable because it is preferable that the amount of elution ions from the glass is small, but soda lime glass having a barrier coat such as SiO 2 can also be used.
- the resin film preferably contains a resin material selected from polyimide, polyamide, polybenzoxazole, polyamideimide, and poly (p-xylylene), and these resin materials may be contained alone.
- a plurality of species may be combined.
- a polyamic acid including a partially imidized polyamic acid
- a solution containing a soluble polyimide is applied to a support substrate and fired. It can also be formed with.
- the resin After coating, the resin is dried, and if necessary, dried under reduced pressure, and then heat-treated in the range of 50 ° C to 180 ° C for 1 minute to several hours using, for example, a hot plate, an oven, or infrared rays.
- a membrane can be obtained.
- the chemical beam can be irradiated through a mask having a desired pattern on the resin film.
- the chemical beam used for exposure include ultraviolet rays, visible rays, electron beams, and X-rays. Above all, it is preferable to use the i-line (365 nm), h-line (405 nm), and g-line (436 nm) of the mercury lamp.
- the exposed part can be removed using, for example, a developing solution.
- the developing solution includes tetramethylammonium hydroxide, diethanolamine, diethylaminoethanol, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, triethylamine, diethylamine, methylamine, dimethylamine, dimethylaminoethyl acetate, dimethylaminoethanol, and dimethyl.
- An aqueous solution of an alkaline compound such as aminoethylmethacrylate, cyclohexylamine, ethylenediamine and hexamethylenediamine is preferable.
- these alkaline aqueous solutions are mixed with polar solvents such as N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, dimethylsulfoxide, ⁇ -butyrolactone and dimethylacrylamide, methanol and ethanol.
- polar solvents such as N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, dimethylsulfoxide, ⁇ -butyrolactone and dimethylacrylamide, methanol and ethanol.
- Alcohols such as isopropanol, esters such as ethyl lactate and monomethyl ether acetate, and ketones such as cyclopentanone, cyclohexanone, isobutyl ketone and methyl isobutyl ketone, alone or in combination of several types. May be good.
- Examples of the developing method include methods such as spraying, paddle, dipping, and ultrasonic
- distilled water For example, alcohols such as ethanol and isopropyl alcohol, and esters such as ethyl lactate and propylene glycol monomethyl ether acetate may be added to distilled water for rinsing.
- alcohols such as ethanol and isopropyl alcohol
- esters such as ethyl lactate and propylene glycol monomethyl ether acetate may be added to distilled water for rinsing.
- the method for producing a cured product of the present invention there may be a step of irradiating the developed resin film with ultraviolet rays.
- the (B) photoacid generator is decomposed by irradiation with ultraviolet rays, and the degassing component can be efficiently removed in the heat treatment step described later.
- the component (B) is a naphthoquinone diazide sulfonic acid ester, it changes to an indene carboxylic acid compound.
- the inden carboxylic acid compound further promotes the removal of sulfur dioxide derived from the sulfonic acid ester structure from the film in the heat treatment step described later.
- the ultraviolet light is preferably light containing any one of the wavelengths of the i-line (365 nm), h-line (405 nm), and g-line (436 nm) of the mercury lamp.
- the irradiation amount of ultraviolet rays is preferably in the range of 50 to 10000 mJ / cm 2 .
- the (A) alkali-soluble resin contained in the photosensitive resin composition of the present invention contains a polyimide precursor, a polybenzoxazole precursor, or a copolymer thereof
- the imide ring and the oxazole ring are heat-treated. Therefore, heat resistance and chemical resistance can be improved, and when a heat-crosslinking agent is contained, the heat-crosslinking reaction can be promoted by heat treatment, and heat resistance and chemical resistance are improved. be able to.
- the temperature may be gradually raised and then maintained at the maximum heating temperature, or continuously raised and then maintained at the maximum heating temperature, or may be maintained at the maximum heating temperature from the beginning.
- the maximum heating temperature refers to the highest temperature among the temperatures experienced by the resin film due to heating, after confirming the temperature range in which the resin film experiences a cumulative total of 1 minute or more. From the viewpoint of visible light transmission of the cured film, it is preferable that the maximum heating temperature is low. On the other hand, from the viewpoint of improving heat resistance and chemical resistance, it is preferable that the maximum heating temperature is high. In consideration of the balance of these characteristics, the maximum heating temperature is preferably 200 ° C. to 350 ° C., more preferably 220 ° C.
- the holding time at the maximum heating temperature is not particularly limited, but is preferably 15 minutes or longer, more preferably 30 minutes or longer, and even more preferably 45 minutes or longer. Further, from the viewpoint of productivity, 180 minutes or less is preferable, 150 minutes or less is more preferable, and 120 minutes or less is further preferable.
- an organic EL display device for example, an organic EL display having a step of forming a flattening layer, a first electrode, a pixel division layer, an organic EL layer, and a second electrode on a substrate in this order.
- the method for manufacturing the apparatus is a step of applying the photosensitive resin composition of the present invention to a substrate to form a resin film, the resin.
- a method that is a method for producing a cured product which comprises a step of drying the film, a step of exposing the dried resin film, a step of developing the exposed resin film, and a step of heat-treating the developed resin film to obtain a cured product.
- a method for producing a cured product which comprises a step of drying the film, a step of exposing the dried resin film, a step of developing the exposed resin film, and a step of heat-treating the developed resin film to obtain a cured product.
- a second aspect of the cured product of the present invention is a compound having a transmittance of 80% or more and 99% or less at 400 nm at a thickness of 1.5 ⁇ m, a yellow index of 0.1 or more and 7 or less, and an imide ring structure. It contains a compound having an indene structure, a compound having a structure represented by the formula (2), and a compound having a structure represented by the formula (1).
- R 2 , R 3 and R 4 are monovalent organic groups having 1 to 30 carbon atoms which may independently contain a hydrogen atom or a hetero atom, respectively.
- Each R 1 is a monovalent organic group having 1 to 20 carbon atoms which may contain a hetero atom independently.
- a preferred embodiment of R 1 is as described above.
- examples of the monovalent organic group having 1 to 30 carbon atoms which may contain the heteroatom include an alkyl group, an alkenyl group, an alkynyl group, an aryl group and the like.
- the alkyl group may be linear, branched or cyclic.
- the number of carbon atoms of the linear and branched alkyl groups is usually 1 to 30, preferably 1 to 20 from the viewpoint of maintaining high visible light transmission, and more preferably 1 to 10.
- the number of carbon atoms of the cyclic alkyl group is usually 3 to 30, preferably 3 to 20 from the viewpoint of maintaining high visible light transmittance, and more preferably 3 to 10.
- alkyl group examples include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, a hexyl group, a cyclohexyl group, a heptyl group and an octyl group.
- Nonyl group, decyl group and the like can be mentioned.
- the alkenyl group may be linear, branched or cyclic.
- the number of carbon atoms of the linear and branched alkenyl groups is usually 2 to 30, preferably 2 to 20 from the viewpoint of maintaining high visible light transmission, and more preferably 2 to 10.
- the number of carbon atoms of the cyclic alkenyl group is usually 3 to 30, preferably 3 to 20 from the viewpoint of maintaining high visible light transmittance, and more preferably 3 to 10.
- alkenyl group examples include an ethenyl group, a propenyl group, an isopropenyl group, a butenyl group, a butenyl group, a pentenyl group, a hexenyl group, a nonenyl group, a decenyl group and the like.
- the alkynyl group may be linear, branched or cyclic.
- the number of carbon atoms of the linear and branched alkynyl groups is usually 2 to 30, preferably 2 to 20 from the viewpoint of maintaining high visible light transmission, and more preferably 2 to 10.
- the number of carbon atoms of the cyclic alkynyl group is usually 3 to 30, preferably 3 to 20 from the viewpoint of maintaining high visible light transparency, and more preferably 3 to 10.
- Examples of the alkynyl group include an ethynyl group, a propynyl group, a butynyl group, a pentynyl group, a hexynyl group and the like.
- the aryl group is the remaining atomic group obtained by removing one hydrogen atom directly bonded to the carbon atom constituting the aromatic ring from the aromatic hydrocarbon, and comprises a hydroxy group, the alkyl group, the alkenyl group, and the alkynyl group. Including those having as a functional group.
- the number of carbon atoms of the aryl group is usually 6 to 30, preferably 6 to 20.
- Examples of the aryl group include a phenyl group, a hydroxyphenyl group, an alkylphenyl group, an alkylhydroxyphenyl group and the like.
- a hydroxyphenyl group or an alkyl hydroxyphenyl group is preferable from the viewpoint of balancing visible light transmission and heat resistance.
- alkylphenyl group examples include a methylphenyl group, an ethylphenyl group, a dimethylphenyl group, a propylphenyl group, a methylethylphenyl group, a propylphenyl group, an isopropylphenyl group, a butylphenyl group, an isobutylphenyl group, and a tert-butylphenyl group.
- alkyl hydroxyphenyl group examples include a methyl hydroxyphenyl group, an ethyl hydroxyphenyl group, a dimethyl hydroxyphenyl group, a propyl hydroxyphenyl group, a methyl ethyl hydroxyphenyl group, a propyl hydroxyphenyl group, an isopropyl hydroxyphenyl group, and a butyl hydroxyphenyl group.
- Examples thereof include isobutyl hydroxyphenyl group, tert-butyl hydroxyphenyl group, pentyl hydroxyphenyl group, hexyl hydroxyphenyl group, cyclohexyl hydroxyphenyl group, heptyl hydroxyphenyl group, octyl hydroxyphenyl group, nonyl hydroxyphenyl group, decyl hydroxyphenyl group and the like. ..
- R 2 , R 3 , and R 4 is an alkyl group, an alkenyl group, an alkynyl group, or an aryl group. More preferably, it contains both an alkyl group and a hydroxyphenyl group and / or an alkyl hydroxyphenyl group.
- the cured product has a compound having an imide ring structure, a compound having an indene structure, a compound having a structure represented by the formula (2), and a compound having a structure represented by the formula (1), so that the thickness is 1.5 ⁇ m. It becomes easy to obtain a cured product having a transmittance of 80% or more and 99% or less at 400 nm and a yellow index of 0.1 or more and 7.0 or less at a thickness of 1.5 ⁇ m.
- the second aspect of the cured product of the present invention is that the transmittance at 400 nm at a thickness of 1.5 ⁇ m is 80% or more and 99% or less. From the viewpoint of design / design diversification such as arranging a camera directly under the display of a transmissive organic EL display or a mobile terminal, it is preferable that the visible light transmission is high. Specifically, the visible light transmittance of the cured product is more preferably 85% or more, more preferably 88% or more, and particularly preferably 90% or more. The upper limit of the transmittance is not particularly limited, but may be, for example, 99%, 98%, or 97%.
- the second aspect of the cured product of the present invention is that the yellow index at a thickness of 1.5 ⁇ m is 7.0 or less. From the viewpoint of design / design diversification such as placing the camera directly under the transmissive organic EL display or the display of the mobile terminal, it is preferable that the yellow index of the cured product is low, specifically 5.0 or less. preferable.
- the yellow index of the cured product is particularly preferably 3.0 or less.
- the lower limit of the yellow index is not particularly limited, but may be, for example, 0.1, 0.2, or 0.3.
- the second aspect of the cured product of the present invention is represented by a compound having an imide ring structure, a compound having an indene structure, a compound having a structure represented by the formula (2), and a compound represented by the formula (1).
- a compound having such a structure it is possible to easily maintain high visible light transmission of the cured product.
- the compound contained in the second aspect of the cured product of the present invention will be described.
- the compound having an imide ring structure is derived from, for example, (A) a structure derived from a polyimide resin or a residue thereof, and the compound having an inden structure is derived from, for example, (B) a naphthoquinone diazide sulfonic acid ester contained as a photoacid generator.
- the compound having the structure or its residue, the structure represented by the formula (2) is, for example, the structure derived from the component (C) or its residue, and the compound having the structure represented by the formula (1) is, for example.
- (D) can be obtained as a structure derived from the compound represented by the formula (1) or a residue thereof.
- the cured product of the present invention can be used for organic EL display devices, semiconductor devices, multilayer wiring boards, and the like. More preferably, an insulating layer of an organic EL display device, a flattening layer of a substrate with a drive circuit of an organic EL display device, an interlayer insulating film between rewiring of a semiconductor device, a semiconductor passive film, a protective film of a semiconductor device, and a high height. It is used in applications such as interlayer insulating films for multi-layer wiring for density mounting, wiring protection insulating layers for circuit boards, on-chip microlenses for solid-state imaging devices, and flattening layers for various displays and solid-state imaging devices.
- the organic EL display device of the present invention comprises the cured product of the present invention.
- the organic EL display device of the present invention has at least a substrate, a first electrode, a second electrode, an organic EL layer, a flattening layer and a pixel dividing layer, and the cured product of the present invention is a flattening layer and / or a pixel dividing layer. It is preferable to include it in.
- a TFT thin film transistor
- a flattening layer is provided so as to cover the unevenness, and a display element is further provided on the flattening layer.
- the display element and the wiring are connected via a contact hole formed in the flattening layer. Since the cured product of the present invention has excellent visible light transmission, it is preferably used for a flattening layer and / or a pixel dividing layer. In particular, in recent years, the flexibility of organic EL display devices has become mainstream, and the substrate having the above-mentioned drive circuit may be an organic EL display device made of a resin film.
- the organic EL display device of the present invention is preferably used for a mobile device provided with a camera and / or a sensor directly under the active area of the organic EL display device. Since the organic EL display device of the present invention includes the cured product of the present invention, the visible light transmittance of the organic EL display device is improved, and visible light is efficiently passed through the active area of the organic EL display device. It can be suitably used for a mobile device having a camera and / or a sensor directly under the active area. In addition, it becomes easy to support various designs / designs such as a transmissive organic EL display.
- the flattening layer and the pixel dividing layer are each composed of a single layer or a plurality of layers, and at the laminated interface of the cured product of each layer forming the flattening layer and the pixel dividing layer.
- the difference in refractive index with respect to the wavelength of 550 nm between the cured products forming the laminated interface is 0.3 or less at all the laminated interfaces.
- the difference in refractive index is more preferably 0.2 or less, further preferably 0.1 or less, and particularly preferably 0.05 or less. Furthermore, it is most preferable that there is no difference in refractive index.
- the flattening layer and the pixel dividing layer have a multi-layer structure.
- the difference in refractive index between the cured products forming the laminated interface at the laminated interface of the cured product of each layer forming the flattening layer and the pixel dividing layer shall be within the above range.
- reflection at the interface is less likely to occur, so that the visible light transparency of the organic EL display device is more likely to be improved.
- a method such as arranging the types of resins contained in the curing forming the laminated interface can be mentioned, and most preferably, the cured product forming each layer is produced by using the same photosensitive resin composition. How to do it.
- the organic EL display device of the present invention can be provided with a cured product of a photosensitive resin composition containing polysiloxane.
- the cured product of the photosensitive resin composition containing polysiloxane is, for example, the photosensitive resin composition containing at least the polysiloxane and the photoacid generator (B) by the method described in the method for producing the cured product. It is a cured product obtained by curing.
- the flattening layer and the pixel dividing layer are each composed of a single layer or a plurality of layers, and the flattening layer contains the cured product.
- the pixel dividing layer contains a cured product of a photosensitive resin composition containing polysiloxane. Since a cured product of a photosensitive resin composition containing a polysiloxane generally tends to enhance visible light transmission, a cured product of the photosensitive resin composition containing the polysiloxane is provided as the pixel dividing layer. It is easy to improve the transparency of visible light of the organic EL display device.
- the organic EL display device is provided with the first preferred embodiment in which the flattening layer contains the cured product. It is easy to improve the transparency of the visible light of the EL display device, and it is possible to further increase the flexibility of the organic EL display device.
- a second preferred embodiment of the organic EL display device of the present invention is that the flattening layer and the pixel dividing layer are each composed of a single layer or a plurality of layers, and the flattening layer is photosensitive including polysiloxane.
- the cured product of the resin composition is contained, and the pixel dividing layer contains the cured product.
- the cured product of the photosensitive resin composition containing polysiloxane is generally located on the side of the TFT of the organic EL display device and the TFT, and tends to have a high performance of flattening the unevenness of the wiring connected to the TFT.
- the second preferred embodiment it is easy to improve the visible light transparency of the organic EL display device, and the TFT of the organic EL display device is located on the side of the TFT and is connected to the TFT. It is possible to improve the flatness of the unevenness of the wiring.
- a third preferred embodiment of the organic EL display device of the present invention is that the flattening layer and the pixel dividing layer are each composed of a single layer or a plurality of layers, and the flattening layer and the pixel dividing layer are the same.
- the flattening layer contains the cured product, the flexibility of the organic EL display device can be enhanced, and the TFT of the organic EL display device and the wiring located on the side of the TFT and connected to the TFT.
- the flatness of the unevenness of the surface can be appropriately increased.
- the semiconductor device of the present invention comprises the cured product of the present invention.
- the semiconductor device of the present invention preferably contains the cured product of the present invention in the insulating film and / or the protective film.
- Examples of the semiconductor device include a semiconductor device having a known structure. Since the cured product of the present invention has excellent visible light transmittance, it is preferably used for the above-mentioned insulating film and / or protective film.
- the developing film was subjected to a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Thermo System Co., Ltd.) under a nitrogen atmosphere (oxygen concentration: 100 ppm or less) to 250 ° C. at 5 ° C./min.
- a thermosetting step of raising the temperature and heat-treating at 250 ° C. for 1 hour was performed to prepare a cured product of varnish.
- the thickness of the cured product was about 1.5 ⁇ m.
- a thermosetting step was performed in which the temperature was raised to 230 ° C. at 5 ° C./min and heat-treated at 230 ° C. for 1 hour to prepare a cured product of varnish.
- the cured product of the varnish produced above was measured and evaluated at a wavelength of 300 nm to 800 nm using a spectrophotometer (“Double Beam Spectrophotometer U-2900” manufactured by Hitachi, Ltd.). From the measurement results, the transmittance at a wavelength of 400 nm was read and the visible light transmittance was evaluated. Unless otherwise specified, for each measurement result, the transmittance in the wavelength range of 400 nm to 800 nm is the lowest at 400 nm, and is higher than the transmittance at 400 nm in the region of 401 nm or more and less than 800 nm. Transmittance was obtained. The transmittance at 400 nm obtained was determined according to the following criteria. C or higher was rated as "pass” with good transmittance, and D or lower was rated as "fail".
- the pattern of the obtained developing film was observed with an FDP microscope MX61 (manufactured by Olympus Corporation) at a magnification of 20 times, and the minimum required exposure amount at which the opening diameter of the contact hole reached 10 ⁇ m was obtained, and this was determined by the exposure sensitivity. And said. C or higher was regarded as good exposure sensitivity and was regarded as "pass”, and D or lower was regarded as "fail".
- Chemical resistance evaluation ⁇ Preparation of cured product> A photosensitive resin composition (varnish) according to each of the examples and comparative examples described later was applied onto a 4-inch silicon wafer by a spin coating method, and a hot plate (DIGITAL HOT PLATE HP-18A) at 120 ° C. was applied to AS ONE Co., Ltd. ) Made) for 2 minutes. This membrane was developed with 2.38 mass% TMAH aqueous solution and rinsed with pure water.
- the developing film was subjected to a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Thermo System Co., Ltd.) under a nitrogen atmosphere (oxygen concentration: 100 ppm or less) to 250 ° C. at 5 ° C./min.
- a thermosetting step of raising the temperature and heat-treating at 250 ° C. for 1 hour was performed to prepare a cured product of varnish.
- the thickness of the cured product was about 2.0 ⁇ m.
- a thermosetting step was performed in which the temperature was raised to 230 ° C. at 5 ° C./min and heat-treated at 230 ° C. for 1 hour to prepare a cured product of varnish.
- composition analysis of cured product Although a method for analyzing the components contained in the cured product is shown, it is not limited to the described method as long as it is a method capable of composition analysis.
- ⁇ Preparation of cured product for composition analysis> The photosensitive resin composition obtained in each Example and Comparative Example was coated on an 8-inch silicon wafer by a spin coating method using a coating and developing apparatus ACT-8 (manufactured by Tokyo Electron Limited), and at 120 ° C. Bake on a hot plate for 3 minutes. Then, it was developed with the 2.38 mass% TMAH aqueous solution using the ACT-8 developing apparatus, rinsed with distilled water, and then shaken off to dry.
- ACT-8 coating and developing apparatus
- the developing film was subjected to a high-temperature inert gas oven (INH-9CD-S; manufactured by Koyo Thermo System Co., Ltd.) under a nitrogen atmosphere (oxygen concentration: 100 ppm or less) to 250 ° C. at 5 ° C./min.
- a thermosetting step of raising the temperature and heat-treating at 250 ° C. for 1 hour was performed to prepare a cured product of varnish.
- the thickness of the cured film was about 3.0 ⁇ m.
- the temperature was raised to 320 ° C., the inlet temperature was 300 ° C., the column flow rate was 1.5 mL / min, the ionization method was the EI (electron ionization) method, the mass number range was m / z 10 to 800, and the scanning speed was 0.
- the analysis was performed at 5 sec / scan.
- Synthesis Example 1 Synthesis of hydroxyl group-containing diamine compound 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane (hereinafter referred to as BAHF) 18.3 g (0.05 mol), 100 mL of acetone, propylene oxide 17 It was dissolved in 0.4 g (0.3 mol) and cooled to ⁇ 15 ° C. A solution prepared by dissolving 20.4 g (0.11 mol) of 3-nitrobenzoyl chloride in 100 mL of acetone was added dropwise thereto. After completion of the dropping, the reaction was carried out at ⁇ 15 ° C. for 4 hours, and then the temperature was returned to room temperature. The precipitated white solid was filtered off and vacuum dried at 50 ° C.
- BAHF 2,2-bis (3-amino-4-hydroxyphenyl) hexafluoropropane
- Synthesis Example 2 Synthesis of polyimide precursor (A-1) 31.0 g (0.10 mol) of 3,3', 4,4'-diphenyl ether tetracarboxylic dianhydride (hereinafter referred to as ODPA) under a dry nitrogen stream. was dissolved in 500 g of NMP.
- ODPA 3,3', 4,4'-diphenyl ether tetracarboxylic dianhydride
- Synthesis Example 3 Synthesis of polyimide (A-2) Under a dry nitrogen stream, 29.3 g (0.08 mol) of BAHF, 1.24 g (0.005 mol) of 1,3-bis (3-aminopropyl) tetramethyldisiloxane. As an end-capping agent, 3.27 g (0.03 mol) of 3-aminophenol was dissolved in 150 g of NMP. To this, 31.0 g (0.1 mol) of ODPA was added together with 50 g of NMP, and the mixture was stirred at 20 ° C. for 1 hour and then at 50 ° C. for 4 hours. Then, 15 g of xylene was added, and the mixture was stirred at 150 ° C.
- Synthesis Example 4 Synthesis of polybenzoxazole precursor (A-3) Under a dry nitrogen air flow, 18.3 g (0.05 mol) of BAHF was dissolved in 50 g of NMP and 26.4 g (0.3 mol) of glycidylmethyl ether to prepare a solution. The temperature was cooled to ⁇ 15 ° C. Here, 7.4 g (0.025 mol) of diphenyl ether dicarboxylic acid dichloride (manufactured by Nippon Agricultural Chemicals Co., Ltd.) and 5.1 g (0.025 mol) of isophthalic acid chloride (manufactured by Tokyo Kasei Co., Ltd.) are added to ⁇ -butyrolactone (GBL).
- GBL ⁇ -butyrolactone
- Synthesis Example 5 Synthesis of polysiloxane (A-4) In a 500 ml three-necked flask, 44.86 g (0.200 mol) of p-styryltrimethoxysilane (St) and 39.66 g (0) of phenyltrimethoxysilane (Ph) were added.
- B-2 PAG-103 (trade name, manufactured by BASF Japan Ltd.)
- C-1 TekP-4HBPA (trade name, manufactured by Honshu Chemical Industry Co., Ltd.)
- C-2 1,1-bis (3-cyclohexyl-4-hydroxyphenyl) cyclohexane (manufactured by Tokyo Chemical Industry Co., Ltd.)
- C-3 2,2-bis (3-cyclohexyl-4-hydroxyphenyl) propane (manufactured by Tokyo Chemical Industry Co., Ltd.)
- C-4 TrisP-PA (trade name, manufactured by Honshu Chemical Industry Co., Ltd.)
- C-5 Bisphenol P (manufactured by Tokyo Chemical Industry Co., Ltd.)
- C-6 Bisphenol M (manufactured by Tokyo Chemical Industry Co., Ltd.)
- C-7 1,1,1-Tris (4-hydroxyphenyl) ethane (manufactured by Tokyo Chemical Industry Co., Ltd.)
- C-8 4,4', 4'-
- D-1 "Aronix (registered trademark)" M-923 (trade name, manufactured by Toagosei Co., Ltd.)
- D-2 A-9300 (trade name, manufactured by Shin Nakamura Chemical Industry Co., Ltd.)
- D-3 TEPIC-L (trade name, manufactured by Nissan Chemical Industries, Ltd.)
- D-4 TEPIC-VL (trade name, manufactured by Nissan Chemical Industries, Ltd.)
- E-1 HMOM-TPHAP (trade name, manufactured by Honshu Chemical Industry Co., Ltd.)
- E-2 "Techmore (registered trademark)” VG3101L (trade name, manufactured by Printec Co., Ltd.)
- Example 1 10.0 g of the polyimide precursor (A-1), 1.7 g of (B-1), 0.9 g of (C-7) and 1.5 g of (D-3) obtained in Synthesis Example 2 were added to 56.4 g of PGME. And ⁇ -butyrolactone (hereinafter referred to as GBL) in 14.1 g, and then filtered through a 0.2 ⁇ m polytetrafluoroethylene filter (manufactured by Sumitomo Electric Industries, Ltd.) to obtain a photosensitive resin composition A. rice field.
- GBL ⁇ -butyrolactone
- Example 27 The IR spectrum of the cured film of the photosensitive resin composition T was measured by the method described in ⁇ Composition analysis by FT-IR>. From the obtained IR spectra, peaks derived from the expansion and contraction vibration of the carbonyl group in the imide ring structure were obtained at 1775 to 1780 cm -1 and 1720 to 1725 cm -1 . In addition, peaks derived from the expansion and contraction vibration of the carbonyl group in the structure represented by the formula (1) were obtained at 1695 to 1705 cm -1 and 1430 to 1475 cm -1 .
- the thermally decomposed product of the cured film of the photosensitive resin composition T was analyzed by the method described in the above ⁇ Composition analysis by thermal decomposition GC / MS>.
- the structure obtained in the cured film is shown below, which is attributed to the peak (450 to 455 seconds) attributed to the inden represented by the formula (6) and the imide ring structure represented by the formula (7). Peaks (840 to 850 seconds) and peaks attributed to the structure represented by the formula (8) (1035-145 seconds) were obtained.
- the cured film of the photosensitive resin composition T contained an imide ring structure, an indene structure, a structure represented by the formula (2) and a structure represented by the formula (1). ..
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
Abstract
L'objet de la présente invention est de fournir une composition de résine photosensible qui présente une excellente transmittance de la lumière visible après avoir été thermiquement durcie. Afin d'atteindre l'objectif susmentionné, une composition de résine photosensible selon la présente invention présente la configuration suivante. Une composition de résine photosensible qui contient (A) une résine soluble dans les alcalis, (B) un matériau générateur de photoacide et (C) un composé ayant un groupe hydroxyle phénolique ayant un coefficient de partage octanol/eau (LogP) de 4,6 à 20,0 (ci-après appelé composant (C)). La transmittance à 400 nm avec une épaisseur de 1,5 µm après le durcissement thermique est de 80 % à 99 %, et l'indice de jaune est de 0,1 à 7,0.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202180043115.7A CN115698854A (zh) | 2020-08-17 | 2021-08-04 | 感光性树脂组合物、硬化物、显示装置、半导体装置及硬化物的制造方法 |
JP2021546305A JPWO2022039028A1 (fr) | 2020-08-17 | 2021-08-04 | |
KR1020227042069A KR20230051766A (ko) | 2020-08-17 | 2021-08-04 | 감광성 수지 조성물, 경화물, 표시 장치, 반도체 장치 및 경화물의 제조 방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020137261 | 2020-08-17 | ||
JP2020-137261 | 2020-08-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022039028A1 true WO2022039028A1 (fr) | 2022-02-24 |
Family
ID=80322677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2021/028917 WO2022039028A1 (fr) | 2020-08-17 | 2021-08-04 | Composition de résine photosensible, produit durci, dispositif d'affichage, dispositif à semi-conducteur et procédé de production dudit produit durci |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022039028A1 (fr) |
KR (1) | KR20230051766A (fr) |
CN (1) | CN115698854A (fr) |
TW (1) | TW202208516A (fr) |
WO (1) | WO2022039028A1 (fr) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009136557A1 (fr) * | 2008-05-09 | 2009-11-12 | 旭化成イーマテリアルズ株式会社 | Précurseur de polyimide, composition de précurseur de polyimide photosensible, film sec photosensible et carte de circuits imprimés flexible utilisant ces matières |
JP2012185291A (ja) * | 2011-03-04 | 2012-09-27 | Nof Corp | 感光性樹脂組成物およびその用途 |
JP2013174774A (ja) * | 2012-02-27 | 2013-09-05 | Nof Corp | 感光性樹脂組成物およびその用途 |
JP2014199312A (ja) * | 2013-03-29 | 2014-10-23 | 東京応化工業株式会社 | ポジ型レジスト組成物 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4982928B2 (ja) | 2000-06-28 | 2012-07-25 | 東レ株式会社 | 表示装置 |
JP4982927B2 (ja) | 2000-06-28 | 2012-07-25 | 東レ株式会社 | 表示装置 |
-
2021
- 2021-08-04 WO PCT/JP2021/028917 patent/WO2022039028A1/fr active Application Filing
- 2021-08-04 JP JP2021546305A patent/JPWO2022039028A1/ja active Pending
- 2021-08-04 KR KR1020227042069A patent/KR20230051766A/ko active Search and Examination
- 2021-08-04 CN CN202180043115.7A patent/CN115698854A/zh active Pending
- 2021-08-11 TW TW110129670A patent/TW202208516A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009136557A1 (fr) * | 2008-05-09 | 2009-11-12 | 旭化成イーマテリアルズ株式会社 | Précurseur de polyimide, composition de précurseur de polyimide photosensible, film sec photosensible et carte de circuits imprimés flexible utilisant ces matières |
JP2012185291A (ja) * | 2011-03-04 | 2012-09-27 | Nof Corp | 感光性樹脂組成物およびその用途 |
JP2013174774A (ja) * | 2012-02-27 | 2013-09-05 | Nof Corp | 感光性樹脂組成物およびその用途 |
JP2014199312A (ja) * | 2013-03-29 | 2014-10-23 | 東京応化工業株式会社 | ポジ型レジスト組成物 |
Also Published As
Publication number | Publication date |
---|---|
KR20230051766A (ko) | 2023-04-18 |
JPWO2022039028A1 (fr) | 2022-02-24 |
CN115698854A (zh) | 2023-02-03 |
TW202208516A (zh) | 2022-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6521030B2 (ja) | 感光性着色樹脂組成物 | |
JP4735778B1 (ja) | ポジ型感光性樹脂組成物 | |
JP6048257B2 (ja) | 耐熱性樹脂及びその前駆体組成物 | |
CN108604061B (zh) | 固化膜及正型感光性树脂组合物 | |
KR102542822B1 (ko) | 수지 조성물, 그의 경화 릴리프 패턴, 및 그것을 사용한 반도체 전자 부품 또는 반도체 장치의 제조 방법 | |
JP5381491B2 (ja) | 樹脂およびポジ型感光性樹脂組成物 | |
JP2010008851A (ja) | ポジ型感光性樹脂組成物 | |
JP2009258634A (ja) | ポジ型感光性樹脂組成物 | |
JP2012159601A (ja) | 感光性樹脂組成物 | |
WO2015137281A1 (fr) | Composition de résine photosensible | |
JP6102389B2 (ja) | 樹脂組成物 | |
JP5176600B2 (ja) | ポジ型感光性樹脂組成物 | |
WO2023171487A1 (fr) | Composition de résine photosensible, article durci, dispositif d'affichage et procédé de production de dispositif d'affichage | |
JP2014178400A (ja) | ポジ型感光性樹脂組成物 | |
WO2022181350A1 (fr) | Composition de résine photosensible, objet durci, produit stratifié, dispositif d'affichage et procédé de production de dispositif d'affichage | |
JP7521526B2 (ja) | 有機el表示装置、硬化物の製造方法および有機el表示装置の製造方法 | |
WO2022039028A1 (fr) | Composition de résine photosensible, produit durci, dispositif d'affichage, dispositif à semi-conducteur et procédé de production dudit produit durci | |
JP2010072143A (ja) | ポジ型感光性樹脂組成物 | |
WO2020059485A1 (fr) | Composition de résine photosensible, feuille de résine, film durci, dispositif d'affichage el organique, composant électronique à semi-conducteur, dispositif à semi-conducteur et procédé de production d'un dispositif d'affichage el organique | |
WO2022181351A1 (fr) | Corps multicouche, dispositif d'affichage et procédé de production de dispositif d'affichage | |
WO2023171284A1 (fr) | Composition de résine photosensible, article durci, procédé de fabrication d'article durci, dispositif d'affichage électroluminescent organique et dispositif d'affichage | |
JP2013164432A (ja) | ポジ型感光性樹脂組成物 | |
CN118679427A (zh) | 感光性树脂组合物、硬化物、硬化物的制造方法、有机el显示装置及显示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ENP | Entry into the national phase |
Ref document number: 2021546305 Country of ref document: JP Kind code of ref document: A |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21858175 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 21858175 Country of ref document: EP Kind code of ref document: A1 |