JP5417128B2 - リードフレーム及びその製造方法、及び半導体装置 - Google Patents

リードフレーム及びその製造方法、及び半導体装置 Download PDF

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JP5417128B2
JP5417128B2 JP2009263194A JP2009263194A JP5417128B2 JP 5417128 B2 JP5417128 B2 JP 5417128B2 JP 2009263194 A JP2009263194 A JP 2009263194A JP 2009263194 A JP2009263194 A JP 2009263194A JP 5417128 B2 JP5417128 B2 JP 5417128B2
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lead frame
film
plating
plating film
semiconductor chip
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JP2010153825A (ja
JP2010153825A5 (enExample
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和光 関
宗昭 呉
明美 野▲崎▼
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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JP5947107B2 (ja) * 2012-05-23 2016-07-06 ルネサスエレクトロニクス株式会社 半導体装置
JP6007611B2 (ja) * 2012-06-20 2016-10-12 大日本印刷株式会社 Ｌｅｄ用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法
KR101451028B1 (ko) 2013-08-22 2014-10-15 (주)옵토니카 Ｌｅｄ 리드 프레임 제조방법
JP6187201B2 (ja) 2013-11-29 2017-08-30 日亜化学工業株式会社 発光装置用反射膜、並びに、それを備えるリードフレーム、配線基板、ワイヤ、及び発光装置
JP6176224B2 (ja) * 2013-12-25 2017-08-09 日亜化学工業株式会社 半導体素子及びそれを備える半導体装置、並びに半導体素子の製造方法
JP6398541B2 (ja) * 2014-09-29 2018-10-03 日亜化学工業株式会社 リードフレーム及び発光装置
JP6510900B2 (ja) * 2014-09-30 2019-05-08 イサハヤ電子株式会社 半導体装置用接合材及びその製造方法
JP6624930B2 (ja) 2015-12-26 2019-12-25 日亜化学工業株式会社 発光素子及びその製造方法
JP6683003B2 (ja) 2016-05-11 2020-04-15 日亜化学工業株式会社 半導体素子、半導体装置及び半導体素子の製造方法
CN107369667A (zh) * 2016-05-13 2017-11-21 松下电器产业株式会社 信号传送装置
JP6720747B2 (ja) 2016-07-19 2020-07-08 日亜化学工業株式会社 半導体装置、基台及びそれらの製造方法
JP6187659B2 (ja) * 2016-09-09 2017-08-30 大日本印刷株式会社 Ｌｅｄ用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法
US10312186B2 (en) * 2017-10-31 2019-06-04 Amkor Technology Inc. Heat sink attached to an electronic component in a packaged device
JP7271337B2 (ja) * 2019-06-27 2023-05-11 新光電気工業株式会社 電子部品装置及び電子部品装置の製造方法

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