JP5416460B2 - 薄膜トランジスタおよび薄膜トランジスタの作製方法 - Google Patents

薄膜トランジスタおよび薄膜トランジスタの作製方法 Download PDF

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Publication number
JP5416460B2
JP5416460B2 JP2009097672A JP2009097672A JP5416460B2 JP 5416460 B2 JP5416460 B2 JP 5416460B2 JP 2009097672 A JP2009097672 A JP 2009097672A JP 2009097672 A JP2009097672 A JP 2009097672A JP 5416460 B2 JP5416460 B2 JP 5416460B2
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Prior art keywords
semiconductor layer
semiconductor
layer
film
thin film
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JP2009097672A
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Japanese (ja)
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JP2009278075A (ja
JP2009278075A5 (enExample
Inventor
舜平 山崎
勇司 恵木
慎也 笹川
求 倉田
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2009097672A priority Critical patent/JP5416460B2/ja
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Publication of JP2009278075A5 publication Critical patent/JP2009278075A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0231—Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes

Landscapes

  • Thin Film Transistor (AREA)
JP2009097672A 2008-04-18 2009-04-14 薄膜トランジスタおよび薄膜トランジスタの作製方法 Expired - Fee Related JP5416460B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009097672A JP5416460B2 (ja) 2008-04-18 2009-04-14 薄膜トランジスタおよび薄膜トランジスタの作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008109629 2008-04-18
JP2008109629 2008-04-18
JP2009097672A JP5416460B2 (ja) 2008-04-18 2009-04-14 薄膜トランジスタおよび薄膜トランジスタの作製方法

Publications (3)

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JP2009278075A JP2009278075A (ja) 2009-11-26
JP2009278075A5 JP2009278075A5 (enExample) 2012-05-17
JP5416460B2 true JP5416460B2 (ja) 2014-02-12

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Country Status (2)

Country Link
US (1) US8525170B2 (enExample)
JP (1) JP5416460B2 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5436017B2 (ja) * 2008-04-25 2014-03-05 株式会社半導体エネルギー研究所 半導体装置
US7998801B2 (en) * 2008-04-25 2011-08-16 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film transistor having altered semiconductor layer
US8049215B2 (en) * 2008-04-25 2011-11-01 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor
JP5377061B2 (ja) * 2008-05-09 2013-12-25 株式会社半導体エネルギー研究所 光電変換装置
WO2009157574A1 (en) * 2008-06-27 2009-12-30 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor
WO2009157573A1 (en) * 2008-06-27 2009-12-30 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor, semiconductor device and electronic device
JP5498762B2 (ja) * 2008-11-17 2014-05-21 株式会社半導体エネルギー研究所 薄膜トランジスタの作製方法
WO2010103906A1 (en) * 2009-03-09 2010-09-16 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor
US8344378B2 (en) 2009-06-26 2013-01-01 Semiconductor Energy Laboratory Co., Ltd. Thin film transistor and method for manufacturing the same
WO2011065243A1 (en) 2009-11-28 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5602450B2 (ja) * 2010-02-12 2014-10-08 三菱電機株式会社 薄膜トランジスタ、その製造方法、及び表示装置
US20130026462A1 (en) * 2010-03-04 2013-01-31 Sharp Kabushiki Kaisha Method for manufacturing thin film transistor and thin film transistor manufactured by the same, and active matrix substrate
TWI538218B (zh) 2010-09-14 2016-06-11 半導體能源研究所股份有限公司 薄膜電晶體
US8338240B2 (en) 2010-10-01 2012-12-25 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing transistor
US8816425B2 (en) * 2010-11-30 2014-08-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP5547111B2 (ja) * 2011-02-15 2014-07-09 株式会社東芝 不揮発性抵抗変化素子および不揮発性抵抗変化素子の製造方法
JP5827045B2 (ja) * 2011-06-29 2015-12-02 株式会社ジャパンディスプレイ 半導体装置の製造方法
TWI549243B (zh) * 2013-03-07 2016-09-11 精材科技股份有限公司 半導體結構及其製造方法
US9450079B2 (en) 2014-04-09 2016-09-20 International Business Machines Corporation FinFET having highly doped source and drain regions
US11862668B2 (en) * 2021-07-02 2024-01-02 Micron Technology, Inc. Single-crystal transistors for memory devices

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5091334A (en) 1980-03-03 1992-02-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JPS56122123A (en) 1980-03-03 1981-09-25 Shunpei Yamazaki Semiamorphous semiconductor
JPS5771126A (en) 1980-10-21 1982-05-01 Semiconductor Energy Lab Co Ltd Semiamorhous semiconductor
JPS5892217A (ja) 1981-11-28 1983-06-01 Semiconductor Energy Lab Co Ltd 半導体装置作製方法
JPS5972781A (ja) 1982-10-20 1984-04-24 Semiconductor Energy Lab Co Ltd 光電変換半導体装置
JPS6262073A (ja) 1985-09-11 1987-03-18 Ishikawajima Harima Heavy Ind Co Ltd ポペツト弁の温度制御装置
JPH0253941A (ja) 1988-08-17 1990-02-22 Tsudakoma Corp 織機の運転装置
JPH0644625B2 (ja) * 1988-12-31 1994-06-08 三星電子株式会社 アクティブマトリックス液晶表示素子用薄膜トランジスタ
US5221631A (en) 1989-02-17 1993-06-22 International Business Machines Corporation Method of fabricating a thin film transistor having a silicon carbide buffer layer
JP2839529B2 (ja) 1989-02-17 1998-12-16 株式会社東芝 薄膜トランジスタ
KR950013784B1 (ko) 1990-11-20 1995-11-16 가부시키가이샤 한도오따이 에네루기 겐큐쇼 반도체 전계효과 트랜지스터 및 그 제조방법과 박막트랜지스터
US5514879A (en) 1990-11-20 1996-05-07 Semiconductor Energy Laboratory Co., Ltd. Gate insulated field effect transistors and method of manufacturing the same
US7115902B1 (en) 1990-11-20 2006-10-03 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
JP2791422B2 (ja) 1990-12-25 1998-08-27 株式会社 半導体エネルギー研究所 電気光学装置およびその作製方法
US5849601A (en) 1990-12-25 1998-12-15 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
US7098479B1 (en) 1990-12-25 2006-08-29 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
JPH04266019A (ja) 1991-02-20 1992-09-22 Canon Inc 成膜方法
JP3255942B2 (ja) 1991-06-19 2002-02-12 株式会社半導体エネルギー研究所 逆スタガ薄膜トランジスタの作製方法
JPH05129608A (ja) 1991-10-31 1993-05-25 Sharp Corp 半導体装置
EP0535979A3 (en) 1991-10-02 1993-07-21 Sharp Kabushiki Kaisha A thin film transistor and a method for producing the same
US6835523B1 (en) 1993-05-09 2004-12-28 Semiconductor Energy Laboratory Co., Ltd. Apparatus for fabricating coating and method of fabricating the coating
JPH06326312A (ja) 1993-05-14 1994-11-25 Toshiba Corp アクティブマトリクス型表示装置
US5932302A (en) 1993-07-20 1999-08-03 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating with ultrasonic vibration a carbon coating
JPH07131030A (ja) 1993-11-05 1995-05-19 Sony Corp 表示用薄膜半導体装置及びその製造方法
TW303526B (enExample) 1994-12-27 1997-04-21 Matsushita Electric Industrial Co Ltd
US5677236A (en) 1995-02-24 1997-10-14 Mitsui Toatsu Chemicals, Inc. Process for forming a thin microcrystalline silicon semiconductor film
US5920772A (en) 1997-06-27 1999-07-06 Industrial Technology Research Institute Method of fabricating a hybrid polysilicon/amorphous silicon TFT
JP2000277439A (ja) 1999-03-25 2000-10-06 Kanegafuchi Chem Ind Co Ltd 結晶質シリコン系薄膜のプラズマｃｖｄ方法およびシリコン系薄膜光電変換装置の製造方法
JP2001007024A (ja) 1999-06-18 2001-01-12 Sanyo Electric Co Ltd 多結晶シリコン膜の形成方法
JP2001053283A (ja) 1999-08-12 2001-02-23 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
JP2001102587A (ja) * 1999-09-28 2001-04-13 Toshiba Corp 薄膜トランジスタおよびその製造方法ならびに半導体薄膜の製造方法
GB0017471D0 (en) * 2000-07-18 2000-08-30 Koninkl Philips Electronics Nv Thin film transistors and their manufacture
KR100436181B1 (ko) 2002-04-16 2004-06-12 엘지.필립스 엘시디 주식회사 액정표시장치용 어레이기판 제조방법
JP2004014958A (ja) 2002-06-11 2004-01-15 Fuji Electric Holdings Co Ltd 薄膜多結晶太陽電池とその製造方法
CN100552893C (zh) 2003-03-26 2009-10-21 株式会社半导体能源研究所 半导体装置及其制造方法
JP4748954B2 (ja) 2003-07-14 2011-08-17 株式会社半導体エネルギー研究所 液晶表示装置
JP2005050905A (ja) 2003-07-30 2005-02-24 Sharp Corp シリコン薄膜太陽電池の製造方法
JP5159021B2 (ja) 2003-12-02 2013-03-06 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI372463B (en) 2003-12-02 2012-09-11 Semiconductor Energy Lab Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device
JP2005167051A (ja) 2003-12-04 2005-06-23 Sony Corp 薄膜トランジスタおよび薄膜トランジスタの製造方法
JP2005322845A (ja) * 2004-05-11 2005-11-17 Sekisui Chem Co Ltd 半導体デバイスと、その製造装置、および製造方法
JP2008124392A (ja) 2006-11-15 2008-05-29 Sharp Corp 半導体装置、その製造方法及び表示装置

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US20100096637A1 (en) 2010-04-22
JP2009278075A (ja) 2009-11-26
US8525170B2 (en) 2013-09-03

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