JP5385231B2 - 水系ストリッピング及び洗浄配合物、並びにその使用方法 - Google Patents
水系ストリッピング及び洗浄配合物、並びにその使用方法 Download PDFInfo
- Publication number
- JP5385231B2 JP5385231B2 JP2010194140A JP2010194140A JP5385231B2 JP 5385231 B2 JP5385231 B2 JP 5385231B2 JP 2010194140 A JP2010194140 A JP 2010194140A JP 2010194140 A JP2010194140 A JP 2010194140A JP 5385231 B2 JP5385231 B2 JP 5385231B2
- Authority
- JP
- Japan
- Prior art keywords
- hydroxyquinoline
- formulation
- hydroxylamine
- amino
- alkanolamine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/426—Stripping or agents therefor using liquids only containing organic halogen compounds; containing organic sulfonic acids or salts thereof; containing sulfoxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/06—Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/261—Alcohols; Phenols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
- C23G1/22—Light metals
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Emergency Medicine (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Detergent Compositions (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23826809P | 2009-08-31 | 2009-08-31 | |
| US61/238,268 | 2009-08-31 | ||
| US12/859,624 | 2010-08-19 | ||
| US12/859,624 US8518865B2 (en) | 2009-08-31 | 2010-08-19 | Water-rich stripping and cleaning formulation and method for using same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011080042A JP2011080042A (ja) | 2011-04-21 |
| JP2011080042A5 JP2011080042A5 (enExample) | 2012-05-24 |
| JP5385231B2 true JP5385231B2 (ja) | 2014-01-08 |
Family
ID=43066059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010194140A Expired - Fee Related JP5385231B2 (ja) | 2009-08-31 | 2010-08-31 | 水系ストリッピング及び洗浄配合物、並びにその使用方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8518865B2 (enExample) |
| EP (1) | EP2290046B1 (enExample) |
| JP (1) | JP5385231B2 (enExample) |
| KR (1) | KR101277129B1 (enExample) |
| CN (1) | CN102004399B (enExample) |
| TW (1) | TWI433930B (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7632796B2 (en) | 2005-10-28 | 2009-12-15 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and method for its use |
| US8263539B2 (en) | 2005-10-28 | 2012-09-11 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and methods for its use |
| US9329486B2 (en) | 2005-10-28 | 2016-05-03 | Dynaloy, Llc | Dynamic multi-purpose composition for the removal of photoresists and method for its use |
| US8889609B2 (en) | 2011-03-16 | 2014-11-18 | Air Products And Chemicals, Inc. | Cleaning formulations and method of using the cleaning formulations |
| CN103582695A (zh) * | 2011-05-20 | 2014-02-12 | 艺康美国股份有限公司 | 非腐蚀性炉具除脂剂浓缩物 |
| CN103182384B (zh) * | 2011-12-31 | 2015-07-08 | 中芯国际集成电路制造(上海)有限公司 | 一种对焊盘表面进行清洗的方法 |
| US9158202B2 (en) | 2012-11-21 | 2015-10-13 | Dynaloy, Llc | Process and composition for removing substances from substrates |
| JP6198384B2 (ja) | 2012-11-28 | 2017-09-20 | 富士フイルム株式会社 | 半導体基板のエッチング方法及び半導体素子の製造方法 |
| CN103308654B (zh) * | 2013-06-13 | 2016-08-10 | 深圳市华星光电技术有限公司 | 用于测试光阻剥离液中水分含量的方法 |
| US9562211B2 (en) | 2013-12-06 | 2017-02-07 | Fujifilm Electronic Materials U.S.A., Inc. | Cleaning formulation for removing residues on surfaces |
| US20150219996A1 (en) * | 2014-02-06 | 2015-08-06 | Dynaloy, Llc | Composition for removing substances from substrates |
| KR20160094640A (ko) | 2015-02-02 | 2016-08-10 | 동우 화인켐 주식회사 | 티타늄막 식각액 조성물 |
| CN106919011B (zh) * | 2015-12-25 | 2021-12-17 | 安集微电子科技(上海)股份有限公司 | 一种富含水的羟胺剥离清洗液 |
| KR101697336B1 (ko) | 2016-03-03 | 2017-01-17 | 주식회사 엘지화학 | 액정 배향막의 제조방법 |
| TWI608311B (zh) * | 2016-03-25 | 2017-12-11 | 達興材料股份有限公司 | 一種光阻脫除組成物及一種利用該光阻脫除組成物進行微影製程的電子元件的製造方法 |
| US11035044B2 (en) * | 2017-01-23 | 2021-06-15 | Versum Materials Us, Llc | Etching solution for tungsten and GST films |
| WO2019108990A1 (en) | 2017-12-01 | 2019-06-06 | Ecolab Usa Inc. | Cleaning compositions and methods for removing baked on grease from fryers and other hot surfaces |
| IL301529B2 (en) | 2018-03-28 | 2024-11-01 | Fujifilm Electronic Mat Usa Inc | cleaning products |
| KR20210024187A (ko) | 2018-07-20 | 2021-03-04 | 엔테그리스, 아이엔씨. | 부식 억제제를 갖는 세정 조성물 |
| JP6858209B2 (ja) * | 2019-02-20 | 2021-04-14 | 東京応化工業株式会社 | リソグラフィー用洗浄液、及び基板の洗浄方法 |
| TWI719648B (zh) * | 2019-09-23 | 2021-02-21 | 達興材料股份有限公司 | 一種樹脂清洗劑 |
| US12298669B2 (en) | 2019-09-27 | 2025-05-13 | Versum Materials Us, Llc | Composition comprising three alkanolamines and a hydroxylamine for removing etch residues |
| EP4038173A4 (en) | 2019-09-30 | 2023-11-01 | Versum Materials US, LLC | PHOTO PAINT REMOVER |
| KR102334425B1 (ko) * | 2019-11-21 | 2021-12-01 | 엘티씨 (주) | 디스플레이 제조용 포토레지스트 박리액 조성물 |
| CN120695670A (zh) * | 2020-10-02 | 2025-09-26 | 恩特格里斯公司 | 用于从胺中去除金属物种的膜 |
| US12247185B2 (en) | 2020-11-25 | 2025-03-11 | Ecolab Usa Inc. | Multipurpose alkaline compositions and methods of use |
| US12460157B2 (en) | 2021-03-12 | 2025-11-04 | Ecolab Usa Inc. | Multipurpose acidic compositions and methods of use |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4428871A (en) | 1981-09-23 | 1984-01-31 | J. T. Baker Chemical Company | Stripping compositions and methods of stripping resists |
| US4395479A (en) | 1981-09-23 | 1983-07-26 | J. T. Baker Chemical Company | Stripping compositions and methods of stripping resists |
| US4401748A (en) | 1982-09-07 | 1983-08-30 | J. T. Baker Chemical Company | Stripping compositions and methods of stripping resists |
| US6110881A (en) | 1990-11-05 | 2000-08-29 | Ekc Technology, Inc. | Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials |
| US5981454A (en) | 1993-06-21 | 1999-11-09 | Ekc Technology, Inc. | Post clean treatment composition comprising an organic acid and hydroxylamine |
| US7205265B2 (en) | 1990-11-05 | 2007-04-17 | Ekc Technology, Inc. | Cleaning compositions and methods of use thereof |
| US5279771A (en) * | 1990-11-05 | 1994-01-18 | Ekc Technology, Inc. | Stripping compositions comprising hydroxylamine and alkanolamine |
| US5496491A (en) * | 1991-01-25 | 1996-03-05 | Ashland Oil Company | Organic stripping composition |
| US5556482A (en) * | 1991-01-25 | 1996-09-17 | Ashland, Inc. | Method of stripping photoresist with composition containing inhibitor |
| JP3048207B2 (ja) | 1992-07-09 | 2000-06-05 | イー.ケー.シー.テクノロジー.インコーポレイテッド | 還元及び酸化電位を有する求核アミン化合物を含む洗浄剤組成物およびこれを使用した基板の洗浄方法 |
| US5308745A (en) | 1992-11-06 | 1994-05-03 | J. T. Baker Inc. | Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins |
| US7144849B2 (en) | 1993-06-21 | 2006-12-05 | Ekc Technology, Inc. | Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials |
| US20040134873A1 (en) * | 1996-07-25 | 2004-07-15 | Li Yao | Abrasive-free chemical mechanical polishing composition and polishing process containing same |
| US6030932A (en) | 1996-09-06 | 2000-02-29 | Olin Microelectronic Chemicals | Cleaning composition and method for removing residues |
| US5798323A (en) * | 1997-05-05 | 1998-08-25 | Olin Microelectronic Chemicals, Inc. | Non-corrosive stripping and cleaning composition |
| JP3773227B2 (ja) | 1997-10-16 | 2006-05-10 | 東京応化工業株式会社 | レジスト用剥離液組成物およびこれを用いたレジスト剥離方法 |
| KR100610387B1 (ko) * | 1998-05-18 | 2006-08-09 | 말린크로트 베이커, 인코포레이티드 | 초소형 전자 기판 세정용 실리케이트 함유 알칼리성 조성물 |
| US6328943B1 (en) * | 1998-07-09 | 2001-12-11 | Betzdearborn Inc. | Inhibition of pyrophoric iron sulfide activity |
| JP2000056480A (ja) | 1998-08-10 | 2000-02-25 | Tokyo Ohka Kogyo Co Ltd | レジスト用剥離液組成物およびこれを用いたレジスト剥離方法 |
| JP2000199971A (ja) | 1999-01-07 | 2000-07-18 | Tokyo Ohka Kogyo Co Ltd | ホトレジスト用剥離液組成物およびこれを用いたホトレジスト剥離方法 |
| JP4224651B2 (ja) | 1999-02-25 | 2009-02-18 | 三菱瓦斯化学株式会社 | レジスト剥離剤およびそれを用いた半導体素子の製造方法 |
| US6475966B1 (en) | 2000-02-25 | 2002-11-05 | Shipley Company, L.L.C. | Plasma etching residue removal |
| US6599370B2 (en) | 2000-10-16 | 2003-07-29 | Mallinckrodt Inc. | Stabilized alkaline compositions for cleaning microelectronic substrates |
| MY131912A (en) * | 2001-07-09 | 2007-09-28 | Avantor Performance Mat Inc | Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility |
| MY143399A (en) | 2001-07-09 | 2011-05-13 | Avantor Performance Mat Inc | Microelectronic cleaning compositons containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning |
| US7393819B2 (en) * | 2002-07-08 | 2008-07-01 | Mallinckrodt Baker, Inc. | Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility |
| TWI315030B (en) * | 2003-06-26 | 2009-09-21 | Dongwoo Fine Chem Co Ltd | Photoresist stripper composition, and exfoliation method of a photoresist using it |
| US7671001B2 (en) * | 2003-10-29 | 2010-03-02 | Mallinckrodt Baker, Inc. | Alkaline, post plasma etch/ash residue removers and photoresist stripping compositions containing metal-halide corrosion inhibitors |
| US8338087B2 (en) | 2004-03-03 | 2012-12-25 | Advanced Technology Materials, Inc | Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate |
| KR20050110955A (ko) * | 2004-05-20 | 2005-11-24 | 금호석유화학 주식회사 | 포토레지스트용 스트리퍼 조성물 및 이를 포토레지스트박리에 사용하는 방법 |
| KR101088568B1 (ko) * | 2005-04-19 | 2011-12-05 | 아반토르 퍼포먼스 머티리얼스, 인크. | 갈바닉 부식을 억제하는 비수성 포토레지스트 스트립퍼 |
| US7727420B2 (en) * | 2005-05-17 | 2010-06-01 | Ppt Research | Corrosion inhibiting compositions |
| US7879782B2 (en) * | 2005-10-13 | 2011-02-01 | Air Products And Chemicals, Inc. | Aqueous cleaning composition and method for using same |
| US20070179072A1 (en) * | 2006-01-30 | 2007-08-02 | Rao Madhukar B | Cleaning formulations |
| US7879783B2 (en) * | 2007-01-11 | 2011-02-01 | Air Products And Chemicals, Inc. | Cleaning composition for semiconductor substrates |
| WO2009058288A1 (en) * | 2007-10-29 | 2009-05-07 | Ekc Technology, Inc. | Amidoxime compounds as chelating agents in semiconductor processes |
| CN101855334B (zh) * | 2007-11-13 | 2013-03-27 | 沙琛公司 | 高负电动势多面体倍半硅氧烷组合物及无损坏半导体湿式清洁方法 |
-
2010
- 2010-08-19 US US12/859,624 patent/US8518865B2/en active Active
- 2010-08-25 TW TW099128531A patent/TWI433930B/zh not_active IP Right Cessation
- 2010-08-27 EP EP10174406.8A patent/EP2290046B1/en not_active Not-in-force
- 2010-08-30 KR KR1020100084270A patent/KR101277129B1/ko not_active Expired - Fee Related
- 2010-08-31 CN CN201010269271.9A patent/CN102004399B/zh not_active Expired - Fee Related
- 2010-08-31 JP JP2010194140A patent/JP5385231B2/ja not_active Expired - Fee Related
-
2013
- 2013-07-08 US US13/936,656 patent/US9201308B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20110212866A1 (en) | 2011-09-01 |
| EP2290046A1 (en) | 2011-03-02 |
| EP2290046B1 (en) | 2017-04-12 |
| US9201308B2 (en) | 2015-12-01 |
| JP2011080042A (ja) | 2011-04-21 |
| TWI433930B (zh) | 2014-04-11 |
| CN102004399B (zh) | 2014-11-19 |
| KR20110025609A (ko) | 2011-03-10 |
| US8518865B2 (en) | 2013-08-27 |
| CN102004399A (zh) | 2011-04-06 |
| US20130296215A1 (en) | 2013-11-07 |
| TW201107466A (en) | 2011-03-01 |
| KR101277129B1 (ko) | 2013-06-20 |
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