JP5382257B1 - 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 - Google Patents
金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 Download PDFInfo
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- JP5382257B1 JP5382257B1 JP2013153920A JP2013153920A JP5382257B1 JP 5382257 B1 JP5382257 B1 JP 5382257B1 JP 2013153920 A JP2013153920 A JP 2013153920A JP 2013153920 A JP2013153920 A JP 2013153920A JP 5382257 B1 JP5382257 B1 JP 5382257B1
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- metal plate
- vapor deposition
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- deposition mask
- etched
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- 238000007740 vapor deposition Methods 0.000 title claims abstract description 273
- 239000002184 metal Substances 0.000 title claims abstract description 263
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 263
- 238000004519 manufacturing process Methods 0.000 title claims description 70
- 238000005530 etching Methods 0.000 claims abstract description 64
- 238000000034 method Methods 0.000 claims abstract description 59
- 238000000137 annealing Methods 0.000 claims abstract description 27
- 230000008569 process Effects 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 87
- 239000000758 substrate Substances 0.000 claims description 57
- 238000005096 rolling process Methods 0.000 claims description 30
- 229910001374 Invar Inorganic materials 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 239000011521 glass Substances 0.000 description 20
- 238000004804 winding Methods 0.000 description 18
- 238000000151 deposition Methods 0.000 description 17
- 230000008021 deposition Effects 0.000 description 16
- 238000005520 cutting process Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000003628 erosive effect Effects 0.000 description 5
- 230000008020 evaporation Effects 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 230000009290 primary effect Effects 0.000 description 3
- 230000009291 secondary effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000005019 vapor deposition process Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/22—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling plates, strips, bands or sheets of indefinite length
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/26—Methods of annealing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
- C23F1/04—Chemical milling
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013153920A JP5382257B1 (ja) | 2013-01-10 | 2013-07-24 | 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 |
CN201711267429.7A CN108048793B (zh) | 2013-01-10 | 2014-01-10 | 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法 |
CN201480003438.3A CN104838037B (zh) | 2013-01-10 | 2014-01-10 | 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法 |
KR1020177020095A KR102087056B1 (ko) | 2013-01-10 | 2014-01-10 | 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법 |
PCT/JP2014/050346 WO2014109394A1 (ja) | 2013-01-10 | 2014-01-10 | 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 |
CN201911326369.0A CN110938798A (zh) | 2013-01-10 | 2014-01-10 | 蒸镀掩模的制造方法 |
KR1020157009821A KR101761494B1 (ko) | 2013-01-10 | 2014-01-10 | 금속판, 금속판의 제조 방법, 및 금속판을 사용해서 증착 마스크를 제조하는 방법 |
CN201711267436.7A CN107858644A (zh) | 2013-01-10 | 2014-01-10 | 金属板、金属板的制造方法、和使用金属板制造蒸镀掩模的方法 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013002924 | 2013-01-10 | ||
JP2013002924 | 2013-01-10 | ||
JP2013153920A JP5382257B1 (ja) | 2013-01-10 | 2013-07-24 | 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5382257B1 true JP5382257B1 (ja) | 2014-01-08 |
JP2014148740A JP2014148740A (ja) | 2014-08-21 |
Family
ID=50036549
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013153920A Active JP5382257B1 (ja) | 2013-01-10 | 2013-07-24 | 金属板、金属板の製造方法、および金属板を用いて蒸着マスクを製造する方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5382257B1 (ko) |
KR (2) | KR102087056B1 (ko) |
CN (4) | CN104838037B (ko) |
WO (1) | WO2014109394A1 (ko) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5641462B1 (ja) * | 2014-05-13 | 2014-12-17 | 大日本印刷株式会社 | 金属板、金属板の製造方法、および金属板を用いてマスクを製造する方法 |
JP2015151579A (ja) * | 2014-02-14 | 2015-08-24 | 大日本印刷株式会社 | 蒸着マスク装置の製造方法、基板付蒸着マスクおよび積層体 |
KR101603200B1 (ko) * | 2015-04-24 | 2016-03-14 | 엘지이노텍 주식회사 | 금속기판 및 이를 이용한 증착용마스크 |
JP2018513918A (ja) * | 2015-04-24 | 2018-05-31 | エルジー イノテック カンパニー リミテッド | 金属基板およびこれを用いた蒸着用マスク |
US10233546B2 (en) | 2013-09-13 | 2019-03-19 | Dai Nippon Printing Co., Ltd. | Metal plate, method of manufacturing metal plate, and method of manufacturing mask by use of metal plate |
JP2019151936A (ja) * | 2019-06-11 | 2019-09-12 | 大日本印刷株式会社 | 蒸着マスク装置の製造方法、基板付蒸着マスクおよび積層体 |
US10570498B2 (en) | 2015-02-10 | 2020-02-25 | Dai Nippon Printing Co., Ltd. | Manufacturing method for deposition mask, metal plate used for producing deposition mask, and manufacturing method for said metal sheet |
CN113005399A (zh) * | 2021-02-23 | 2021-06-22 | 合肥鑫晟光电科技有限公司 | 掩膜板的制作方法及掩膜板 |
US11486031B2 (en) | 2013-10-15 | 2022-11-01 | Dai Nippon Printing Co., Ltd. | Metal plate |
Families Citing this family (15)
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CN110144547B (zh) * | 2016-04-14 | 2021-06-01 | 凸版印刷株式会社 | 蒸镀掩模用基材、蒸镀掩模用基材的制造方法及蒸镀掩模的制造方法 |
KR102624714B1 (ko) | 2016-09-12 | 2024-01-12 | 삼성디스플레이 주식회사 | 마스크 및 이를 포함하는 마스크 조립체의 제조방법 |
CN109689921A (zh) * | 2016-09-14 | 2019-04-26 | 夏普株式会社 | 掩模片、蒸镀掩模、显示面板的制造方法 |
EP3521482A4 (en) * | 2016-09-29 | 2020-08-12 | Dai Nippon Printing Co., Ltd. | VAPOR DEPOSIT MASK PACKAGING AND VAPOR DEPOSIT MASK PACKAGING PROCESS |
EP3524710B8 (en) * | 2016-10-07 | 2024-01-24 | Dai Nippon Printing Co., Ltd. | Method of manufacturing deposition mask, intermediate product to which deposition mask is allocated, and deposition mask |
US11220736B2 (en) * | 2016-11-18 | 2022-01-11 | Dai Nippon Printing Co., Ltd. | Deposition mask |
JP7121918B2 (ja) * | 2016-12-14 | 2022-08-19 | 大日本印刷株式会社 | 蒸着マスク装置及び蒸着マスク装置の製造方法 |
JP6851820B2 (ja) * | 2016-12-28 | 2021-03-31 | マクセルホールディングス株式会社 | 蒸着用マスク並びにその設置方法及び製造方法 |
KR102333411B1 (ko) * | 2017-01-10 | 2021-12-02 | 다이니폰 인사츠 가부시키가이샤 | 증착 마스크, 증착 마스크 장치의 제조 방법 및 증착 마스크의 제조 방법 |
CN110578119A (zh) * | 2018-06-08 | 2019-12-17 | 大日本印刷株式会社 | 金属板、卷绕体及其梱包方法和保管方法、梱包体、蒸镀掩模的制造方法 |
JP7137793B2 (ja) * | 2018-07-09 | 2022-09-15 | 大日本印刷株式会社 | 蒸着マスクの良否判定方法、蒸着マスクの製造方法、蒸着マスク装置の製造方法、蒸着マスクの選定方法および蒸着マスク |
KR20210049888A (ko) * | 2018-09-27 | 2021-05-06 | 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 | 메탈 마스크 재료 및 그의 제조 방법과 메탈 마스크 |
CN111254386A (zh) * | 2020-03-26 | 2020-06-09 | 昆山国显光电有限公司 | 掩膜条及掩膜板 |
WO2022092848A1 (ko) * | 2020-10-30 | 2022-05-05 | 에이피에스홀딩스 주식회사 | 증착 마스크 |
KR20220069397A (ko) * | 2020-11-20 | 2022-05-27 | 엘지이노텍 주식회사 | Oled 화소 증착을 위한 증착용 마스크 |
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JP2003100460A (ja) * | 2001-09-25 | 2003-04-04 | Seiko Epson Corp | マスク及びその製造方法、エレクトロルミネッセンス装置及びその製造方法並びに電子機器 |
JP2004039319A (ja) * | 2002-07-01 | 2004-02-05 | Hitachi Metals Ltd | メタルマスク |
JP2004185890A (ja) * | 2002-12-02 | 2004-07-02 | Hitachi Metals Ltd | メタルマスク |
JP2004362908A (ja) * | 2003-06-04 | 2004-12-24 | Hitachi Metals Ltd | メタルマスク及びメタルマスクの製造方法 |
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KR100429360B1 (ko) * | 1999-05-07 | 2004-04-29 | 마쯔시다덴기산교 가부시키가이샤 | 섀도우마스크 제조방법 |
JP2001131707A (ja) * | 1999-10-29 | 2001-05-15 | Dainippon Printing Co Ltd | カラーブラウン管用シャドウマスク |
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JP2003272839A (ja) * | 2002-03-14 | 2003-09-26 | Dainippon Printing Co Ltd | 蒸着処理用のマスキング部材の製造方法 |
KR100523430B1 (ko) * | 2002-08-23 | 2005-10-25 | 닛꼬 긴조꾸 가꼬 가부시키가이샤 | 에칭 후의 형상이 양호한 섀도우 마스크용 연강조 및철-니켈계 합금조 |
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WO2014109394A1 (ja) | 2014-07-17 |
KR102087056B9 (ko) | 2022-08-02 |
KR101761494B1 (ko) | 2017-07-25 |
CN108048793A (zh) | 2018-05-18 |
CN104838037B (zh) | 2017-11-21 |
JP2014148740A (ja) | 2014-08-21 |
CN110938798A (zh) | 2020-03-31 |
KR20150103655A (ko) | 2015-09-11 |
KR20170087533A (ko) | 2017-07-28 |
CN107858644A (zh) | 2018-03-30 |
KR102087056B1 (ko) | 2020-03-10 |
CN108048793B (zh) | 2020-11-03 |
CN104838037A (zh) | 2015-08-12 |
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