JP5368241B2 - ２−ベンジル−４−（２，４−ジクロロフェニル）−５−メチルイミダゾール化合物 - Google Patents

２−ベンジル−４−（２，４−ジクロロフェニル）−５−メチルイミダゾール化合物 Download PDF

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Publication number
JP5368241B2
JP5368241B2 JP2009230515A JP2009230515A JP5368241B2 JP 5368241 B2 JP5368241 B2 JP 5368241B2 JP 2009230515 A JP2009230515 A JP 2009230515A JP 2009230515 A JP2009230515 A JP 2009230515A JP 5368241 B2 JP5368241 B2 JP 5368241B2
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JP
Japan
Prior art keywords
dichlorophenyl
methylimidazole
hydrochloride
compound
acetamidine hydrochloride
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JP2009230515A
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English (en)
Japanese (ja)
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JP2011016785A (ja
Inventor
孝行 村井
真幸 宮崎
浩彦 平尾
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Shikoku Chemicals Corp
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Shikoku Chemicals Corp
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Publication date
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Priority to JP2009230515A priority Critical patent/JP5368241B2/ja
Publication of JP2011016785A publication Critical patent/JP2011016785A/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/64—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with substituted hydrocarbon radicals attached to ring carbon atoms, e.g. histidine
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Anti-Oxidant Or Stabilizer Compositions (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
JP2009230515A 2008-10-06 2009-10-02 ２−ベンジル−４−（２，４−ジクロロフェニル）−５−メチルイミダゾール化合物 Active JP5368241B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009230515A JP5368241B2 (ja) 2008-10-06 2009-10-02 ２−ベンジル−４−（２，４−ジクロロフェニル）−５−メチルイミダゾール化合物

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2008259661 2008-10-06
JP2008259661 2008-10-06
JP2009138853 2009-06-10
JP2009138853 2009-06-10
JP2009230515A JP5368241B2 (ja) 2008-10-06 2009-10-02 ２−ベンジル−４−（２，４−ジクロロフェニル）−５−メチルイミダゾール化合物

Publications (2)

Publication Number Publication Date
JP2011016785A JP2011016785A (ja) 2011-01-27
JP5368241B2 true JP5368241B2 (ja) 2013-12-18

Family

ID=41323529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009230515A Active JP5368241B2 (ja) 2008-10-06 2009-10-02 ２−ベンジル−４−（２，４−ジクロロフェニル）−５−メチルイミダゾール化合物

Country Status (6)

Country Link
JP (1) JP5368241B2 (ko)
KR (1) KR101602985B1 (ko)
CN (1) CN102171382B (ko)
MY (1) MY158622A (ko)
TW (1) TWI435870B (ko)
WO (1) WO2010041614A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5260357B2 (ja) * 2008-09-17 2013-08-14 四国化成工業株式会社 ２−（２，４−ジクロロベンジル）−４−フェニル−５−アルキルイミダゾール化合物
JP5260367B2 (ja) * 2008-09-26 2013-08-14 四国化成工業株式会社 ２−（クロロベンジル）−４−フェニルイミダゾール化合物
CN115436507B (zh) * 2022-08-18 2024-08-30 山东京博生物科技有限公司 一种3，4ˊ-二氯苯丙酮含量的检测方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW270944B (ko) * 1993-05-10 1996-02-21 Shikoku Kakoki Co Ltd
JP3277025B2 (ja) * 1993-05-10 2002-04-22 四国化成工業株式会社 銅及び銅合金の表面処理剤
JPH06329635A (ja) * 1993-05-24 1994-11-29 Shikoku Chem Corp 新規イミダゾール化合物
JP3311858B2 (ja) * 1994-03-08 2002-08-05 四国化成工業株式会社 銅及び銅合金の表面処理剤
AR024077A1 (es) * 1999-05-25 2002-09-04 Smithkline Beecham Corp Compuestos antibacterianos
FR2825926A1 (fr) * 2001-06-14 2002-12-20 Sod Conseils Rech Applic Derives d'imidazoles modulant les canaux sodiques
DE602004028223D1 (de) * 2003-03-19 2010-09-02 Shikoku Chem Lötverfahren unter verwendung einer imidazolverbindung
NZ548208A (en) * 2004-02-12 2010-09-30 Transtech Pharma Inc Substituted azole derivatives, compositions, and methods of use

Also Published As

Publication number Publication date
TW201014828A (en) 2010-04-16
MY158622A (en) 2016-10-31
KR20110073498A (ko) 2011-06-29
CN102171382A (zh) 2011-08-31
KR101602985B1 (ko) 2016-03-11
WO2010041614A1 (en) 2010-04-15
TWI435870B (zh) 2014-05-01
CN102171382B (zh) 2013-08-14
JP2011016785A (ja) 2011-01-27

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