MY158622A - 2-benzyl-4-(2,4-dichlorophenyl)-5-methylimidazole compound - Google Patents

2-benzyl-4-(2,4-dichlorophenyl)-5-methylimidazole compound

Info

Publication number
MY158622A
MY158622A MYPI2011000845A MYPI20110845A MY158622A MY 158622 A MY158622 A MY 158622A MY PI2011000845 A MYPI2011000845 A MY PI2011000845A MY PI20110845 A MYPI20110845 A MY PI20110845A MY 158622 A MY158622 A MY 158622A
Authority
MY
Malaysia
Prior art keywords
compound
benzyl
dichlorophenyl
methylimidazole
methylimidazole compound
Prior art date
Application number
MYPI2011000845A
Inventor
Murai Takayuki
Miyazaki Masayuki
Hirao Hirohiko
Original Assignee
Shikoku Chem
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shikoku Chem filed Critical Shikoku Chem
Publication of MY158622A publication Critical patent/MY158622A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/14—Nitrogen-containing compounds
    • C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/64—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with substituted hydrocarbon radicals attached to ring carbon atoms, e.g. histidine
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Anti-Oxidant Or Stabilizer Compositions (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)

Abstract

AN OBJECT IS TO PROVIDE A 2-BENZYL-4-(2,4- DICHIOROPHENYL)-5-METHYLIMIDAZOLE COMPOUND USEFUL AS AN ANTIOXIDANT FOR COPPER SURFACE, A CURING AGENT FOR EPOXY RESINS, OR AN INTERMEDIATE FOR MEDICAMENTS AND AGRICULTURAL CHEMICALS. A 2-BENZYL--4- (2,4-DICHLOROPHENYL)-5-METHYLIMIDAZOLE COMPOUND REPRESENTED BY THE FORMULA (I).THE COMPOUND CAN BE SYNTHESIZED BY REACTING A 2-HALOGENATED 2?,4?- DICHLOROPROPIOPHENONE COMPOUND WITH AN ARYLACETAMIDINE COMPOUND UNDER HEATING IN THE PRESENCE OF A DEHYDROHALOGENATING AGENT IN AN ORGANIC SOLVENT WHEREIN X1 AND X2 ARE THE SAME OR DIFFERENT AND REPRESENT A HYDROGEN ATOM, A CHLORINE ATOM, OR A BROMINE ATOM.
MYPI2011000845A 2008-10-06 2009-09-29 2-benzyl-4-(2,4-dichlorophenyl)-5-methylimidazole compound MY158622A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008259661 2008-10-06
JP2009138853 2009-06-10

Publications (1)

Publication Number Publication Date
MY158622A true MY158622A (en) 2016-10-31

Family

ID=41323529

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011000845A MY158622A (en) 2008-10-06 2009-09-29 2-benzyl-4-(2,4-dichlorophenyl)-5-methylimidazole compound

Country Status (6)

Country Link
JP (1) JP5368241B2 (en)
KR (1) KR101602985B1 (en)
CN (1) CN102171382B (en)
MY (1) MY158622A (en)
TW (1) TWI435870B (en)
WO (1) WO2010041614A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5260357B2 (en) * 2008-09-17 2013-08-14 四国化成工業株式会社 2- (2,4-dichlorobenzyl) -4-phenyl-5-alkylimidazole compound
JP5260367B2 (en) * 2008-09-26 2013-08-14 四国化成工業株式会社 2- (Chlorobenzyl) -4-phenylimidazole compound
CN115436507B (en) * 2022-08-18 2024-08-30 山东京博生物科技有限公司 Method for detecting content of 3, 4' -dichlorophenone acetone

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW270944B (en) * 1993-05-10 1996-02-21 Shikoku Kakoki Co Ltd
JP3277025B2 (en) * 1993-05-10 2002-04-22 四国化成工業株式会社 Copper and copper alloy surface treatment agent
JPH06329635A (en) * 1993-05-24 1994-11-29 Shikoku Chem Corp New imidazole compound
JP3311858B2 (en) * 1994-03-08 2002-08-05 四国化成工業株式会社 Copper and copper alloy surface treatment agent
AR024077A1 (en) * 1999-05-25 2002-09-04 Smithkline Beecham Corp ANTIBACTERIAL COMPOUNDS
FR2825926A1 (en) * 2001-06-14 2002-12-20 Sod Conseils Rech Applic Use of new and known imidazole derivatives as sodium channel modulators used for treating e.g. pain, epilepsy, cardiac rhythm disorders, neurodegeneration, depression, irritable bowel syndrome, and diabetic retinopathies
CN1761773B (en) * 2003-03-19 2010-05-05 四国化成工业株式会社 Novel imidazole compound and usage thereof
WO2005080346A1 (en) * 2004-02-12 2005-09-01 Transtech Pharma, Inc. Substituted azole derivatives, compositions, and methods of use

Also Published As

Publication number Publication date
WO2010041614A1 (en) 2010-04-15
JP5368241B2 (en) 2013-12-18
KR101602985B1 (en) 2016-03-11
TW201014828A (en) 2010-04-16
JP2011016785A (en) 2011-01-27
CN102171382B (en) 2013-08-14
CN102171382A (en) 2011-08-31
TWI435870B (en) 2014-05-01
KR20110073498A (en) 2011-06-29

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