JP5364838B1 - キャリア付銅箔 - Google Patents

キャリア付銅箔 Download PDF

Info

Publication number
JP5364838B1
JP5364838B1 JP2012263820A JP2012263820A JP5364838B1 JP 5364838 B1 JP5364838 B1 JP 5364838B1 JP 2012263820 A JP2012263820 A JP 2012263820A JP 2012263820 A JP2012263820 A JP 2012263820A JP 5364838 B1 JP5364838 B1 JP 5364838B1
Authority
JP
Japan
Prior art keywords
layer
carrier
copper foil
copper
intermediate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012263820A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014108559A (ja
Inventor
友太 永浦
和彦 坂口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2012263820A priority Critical patent/JP5364838B1/ja
Priority to PCT/JP2013/082282 priority patent/WO2014084384A1/ja
Priority to KR1020157017543A priority patent/KR101793799B1/ko
Priority to CN201380062756.2A priority patent/CN104822524B/zh
Priority to TW102143966A priority patent/TWI503058B/zh
Application granted granted Critical
Publication of JP5364838B1 publication Critical patent/JP5364838B1/ja
Publication of JP2014108559A publication Critical patent/JP2014108559A/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/38—Chromatising
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/04—Electrolytic coating other than with metals with inorganic materials
    • C25D9/08—Electrolytic coating other than with metals with inorganic materials by cathodic processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2012263820A 2012-11-30 2012-11-30 キャリア付銅箔 Active JP5364838B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012263820A JP5364838B1 (ja) 2012-11-30 2012-11-30 キャリア付銅箔
PCT/JP2013/082282 WO2014084384A1 (ja) 2012-11-30 2013-11-29 キャリア付銅箔
KR1020157017543A KR101793799B1 (ko) 2012-11-30 2013-11-29 캐리어 부착 동박
CN201380062756.2A CN104822524B (zh) 2012-11-30 2013-11-29 附载体铜箔
TW102143966A TWI503058B (zh) 2012-11-30 2013-11-29 Attached copper foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012263820A JP5364838B1 (ja) 2012-11-30 2012-11-30 キャリア付銅箔

Publications (2)

Publication Number Publication Date
JP5364838B1 true JP5364838B1 (ja) 2013-12-11
JP2014108559A JP2014108559A (ja) 2014-06-12

Family

ID=49850383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012263820A Active JP5364838B1 (ja) 2012-11-30 2012-11-30 キャリア付銅箔

Country Status (5)

Country Link
JP (1) JP5364838B1 (zh)
KR (1) KR101793799B1 (zh)
CN (1) CN104822524B (zh)
TW (1) TWI503058B (zh)
WO (1) WO2014084384A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101833590B1 (ko) 2014-05-28 2018-02-28 제이엑스금속주식회사 표면 처리 동박, 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기, 표면 처리 동박의 제조 방법 및 프린트 배선판의 제조 방법

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5997080B2 (ja) * 2013-03-05 2016-09-21 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
WO2016098504A1 (ja) * 2014-12-20 2016-06-23 三菱樹脂株式会社 電子部材用封止フィルム
JP6640567B2 (ja) * 2015-01-16 2020-02-05 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法
JP6509608B2 (ja) * 2015-03-30 2019-05-08 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板、電子機器及びプリント配線板の製造方法
WO2018115408A1 (en) 2016-12-23 2018-06-28 Atotech Deutschland Gmbh Method of forming a solderable solder deposit on a contact pad

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59168691A (ja) * 1983-03-15 1984-09-22 松下電工株式会社 金属ベ−ス両面銅張積層板のスルホ−ル加工方法
WO2002024444A1 (fr) * 2000-09-22 2002-03-28 Circuit Foil Japan Co., Ltd. Feuille de cuivre pour carte de connexions ultrafine haute densite
JP2007007937A (ja) * 2005-06-29 2007-01-18 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板
JP2007186782A (ja) * 2005-12-15 2007-07-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔及びプリント配線基板
JP2008159869A (ja) * 2006-12-25 2008-07-10 Shinko Electric Ind Co Ltd 半導体パッケージ
JP2010006071A (ja) * 2009-08-21 2010-01-14 Furukawa Electric Co Ltd:The 表面処理銅箔、キャリア付き極薄銅箔、フレキシブル銅張積層板及びポリイミド系フレキシブルプリント配線板
WO2011001552A1 (ja) * 2009-06-30 2011-01-06 Jx日鉱日石金属株式会社 プリント配線板用銅箔
JP2011166018A (ja) * 2010-02-12 2011-08-25 Jx Nippon Mining & Metals Corp プリント配線板用銅箔

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4612978B2 (ja) * 2001-09-20 2011-01-12 日本電解株式会社 複合銅箔及びその製造方法
CN1984527B (zh) * 2005-12-15 2010-12-01 古河电气工业株式会社 带载体的极薄铜箔及印刷电路基板
WO2009154066A1 (ja) * 2008-06-17 2009-12-23 日鉱金属株式会社 印刷回路基板用銅箔及び印刷回路基板用銅張積層板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59168691A (ja) * 1983-03-15 1984-09-22 松下電工株式会社 金属ベ−ス両面銅張積層板のスルホ−ル加工方法
WO2002024444A1 (fr) * 2000-09-22 2002-03-28 Circuit Foil Japan Co., Ltd. Feuille de cuivre pour carte de connexions ultrafine haute densite
JP2007007937A (ja) * 2005-06-29 2007-01-18 Furukawa Circuit Foil Kk キャリア付き極薄銅箔、ポリイミド系フレキシブル銅張積層板、及びポリイミド系フレキシブルプリント配線板
JP2007186782A (ja) * 2005-12-15 2007-07-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔及びプリント配線基板
JP2008159869A (ja) * 2006-12-25 2008-07-10 Shinko Electric Ind Co Ltd 半導体パッケージ
WO2011001552A1 (ja) * 2009-06-30 2011-01-06 Jx日鉱日石金属株式会社 プリント配線板用銅箔
JP2010006071A (ja) * 2009-08-21 2010-01-14 Furukawa Electric Co Ltd:The 表面処理銅箔、キャリア付き極薄銅箔、フレキシブル銅張積層板及びポリイミド系フレキシブルプリント配線板
JP2011166018A (ja) * 2010-02-12 2011-08-25 Jx Nippon Mining & Metals Corp プリント配線板用銅箔

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101833590B1 (ko) 2014-05-28 2018-02-28 제이엑스금속주식회사 표면 처리 동박, 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기, 표면 처리 동박의 제조 방법 및 프린트 배선판의 제조 방법

Also Published As

Publication number Publication date
KR20150090239A (ko) 2015-08-05
KR101793799B1 (ko) 2017-11-03
WO2014084384A1 (ja) 2014-06-05
CN104822524A (zh) 2015-08-05
TWI503058B (zh) 2015-10-01
JP2014108559A (ja) 2014-06-12
TW201433220A (zh) 2014-08-16
CN104822524B (zh) 2016-09-28

Similar Documents

Publication Publication Date Title
JP5373995B2 (ja) キャリア付銅箔
JP5156873B1 (ja) キャリア付銅箔
JP4934409B2 (ja) キャリア付き極薄銅箔及びプリント配線基板
JP5228130B1 (ja) キャリア付銅箔
JP5364838B1 (ja) キャリア付銅箔
JP2012102407A (ja) キャリア付き極薄銅箔及びプリント配線板
JP5922227B2 (ja) キャリア付銅箔、キャリア付銅箔の製造方法及びプリント配線板の製造方法
JP5481553B1 (ja) キャリア付銅箔
JP5997080B2 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP2014141061A (ja) キャリア付銅箔、及び、それを用いたプリント配線板、プリント回路板及び銅張積層板
JP5298252B1 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP6140480B2 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP5903446B2 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板の製造方法、プリント回路板の製造方法、銅張積層板の製造方法及び電子機器の製造方法
JP6140481B2 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP5247929B1 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板及びプリント回路板
JP5449596B1 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP5854872B2 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、積層体及びプリント配線板の製造方法
JP2014193591A (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP2013204065A (ja) キャリア付銅箔
JP6329727B2 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP6176948B2 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント回路板の製造方法、銅張積層板の製造方法、及び、プリント配線板の製造方法
JP6271134B2 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP2014172183A (ja) キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板、及びプリント配線板の製造方法
JP2014024315A (ja) キャリア付銅箔
JP6336142B2 (ja) キャリア付銅箔、キャリア付銅箔の製造方法、プリント回路板の製造方法、銅張積層板の製造方法、及び、プリント配線板の製造方法

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130709

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130909

R150 Certificate of patent or registration of utility model

Ref document number: 5364838

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250