JP5355702B2 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP5355702B2 JP5355702B2 JP2011531698A JP2011531698A JP5355702B2 JP 5355702 B2 JP5355702 B2 JP 5355702B2 JP 2011531698 A JP2011531698 A JP 2011531698A JP 2011531698 A JP2011531698 A JP 2011531698A JP 5355702 B2 JP5355702 B2 JP 5355702B2
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 19
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 229910000765 intermetallic Inorganic materials 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 30
- SCCCLDWUZODEKG-UHFFFAOYSA-N germanide Chemical compound [GeH3-] SCCCLDWUZODEKG-UHFFFAOYSA-N 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 229910052732 germanium Inorganic materials 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000009751 slip forming Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 73
- 229910006137 NiGe Inorganic materials 0.000 description 48
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 35
- 230000003071 parasitic effect Effects 0.000 description 32
- 239000012535 impurity Substances 0.000 description 25
- 238000005468 ion implantation Methods 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 13
- 230000004913 activation Effects 0.000 description 12
- 238000000137 annealing Methods 0.000 description 12
- 238000002513 implantation Methods 0.000 description 11
- 229910052785 arsenic Inorganic materials 0.000 description 10
- 229910052698 phosphorus Inorganic materials 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 229910021332 silicide Inorganic materials 0.000 description 9
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 9
- 230000004888 barrier function Effects 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 7
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 6
- 230000002159 abnormal effect Effects 0.000 description 6
- 150000002291 germanium compounds Chemical class 0.000 description 6
- 125000001475 halogen functional group Chemical group 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000005280 amorphization Methods 0.000 description 4
- 229910052787 antimony Inorganic materials 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229910005883 NiSi Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910005793 GeO 2 Inorganic materials 0.000 description 1
- 229920006385 Geon Polymers 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41791—Source or drain electrodes for field effect devices for transistors with a horizontal current flow in a vertical sidewall, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66787—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel
- H01L29/66795—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a gate at the side of the channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Description
本実施形態では、SOI(Silicon On Insulator)基板を用いた[不純物後注入 Tri-gate MOSFET]の例を示す。SOI基板のSOI層膜厚は、例えば50nmとする。
本実施形態では、SOI基板を用いた[不純物先注入 Tri-gate MOSFET]の例を示す。なお、素子構造は、前記図1に示すものと同様であるので、ここでは製造工程についてのみ説明する。
本実施形態では、SOI基板を用いた[不純物後注入 Ge channel Tri-gate MOSFET]の例を示す。SOI基板のSOI層膜厚は例えば50nmとする。
本実施形態では、SOI基板を用いた[不純物先注入 Ge channel Tri-gate MOSFET]の例を示す。素子構造は、前記図14に示すものと同様であるので、ここでは製造工程について説明する。
図19は、本発明の第5の実施形態に係わるプレーナ型のMOSトランジスタの概略構造を示す断面図である。図中の51はSOIのSi基板(支持基板)、52はSOIの埋め込み絶縁膜、53はSOIのSi層、54はゲート絶縁膜、55はゲート電極、56はゲート側壁絶縁膜、57はNiGe層、58は素子分離絶縁膜を示している。
なお、本発明は上述した各実施形態に限定されるものではない。第1〜第4の実施形態では Tri-gate MOSFET を例に取り説明したが、FIN-FET に適用することも可能である。例えば、図20(a)〜(d)に示すように、Siのフィンを形成するためのマスク層21をフィン形成後も残しておく。このようにすれば、Siフィンの両側面のみにゲート絶縁膜14を介してゲート電極15が形成されるので、FIN-FET となる。また、図21(a)〜(d)に示すように、S/D部のみマスク層21を除去しても良い。この場合も、Siフィンの両側面のみにゲート絶縁膜14を介してゲート電極15が形成されるので、FIN-FET となる。
12,52…埋め込み絶縁膜
13,53…Si層
14,54…ゲート絶縁膜
15,55…ゲート電極
16,56…ゲート側壁絶縁膜
17,57…NiGe層
21…マスク層
22,33…Ge層
58…素子分離絶縁膜
Claims (6)
- Si層の一部でありソース/ドレイン領域に挟まれるチャネル領域上に、ゲート絶縁膜を介してゲート電極を形成する工程と、
前記ソース/ドレイン領域上にGeを主成分とする膜を成長する工程と、
前記Geを主成分とする膜を金属と反応させることにより、深さ方向の接合位置が前記Geを主成分とする膜の成長界面と同一である金属間化合物膜を形成する工程と、
を含むことを特徴とするMOS型半導体装置の製造方法。 - 前記Ge膜を主成分とする膜を、前記ゲート電極を形成した後に前記ソース/ドレイン領域上に選択的に形成することを特徴とする請求項1記載の半導体装置の製造方法。
- 前記Ge膜を主成分とする膜を、前記ゲート電極を形成する前に前記ソース/ドレイン領域及び前記チャネル領域上に形成することを特徴とする請求項1記載の半導体装置の製造方法。
- 前記Geを主成分とする膜と反応させる金属としてNiを用い、GeとNiとのジャーマナイド化反応を275℃〜325℃で行うことを特徴とする請求項1記載の半導体装置の製造方法。
- 面方位(100)又は(110)を有するSi層と、
前記Si層上の一部にゲート絶縁膜を介して形成されたゲート電極と、
前記ゲート電極下のチャネル領域を挟んで前記Si層に形成されたソース/ドレイン領域と、
前記ソース/ドレイン領域上に形成されたGeを主成分とする膜と金属との化合物からなり、深さ方向の前記ソース/ドレイン領域との接合位置が前記Geを主成分とする膜の成長界面と同一であり、前記ゲート電極側の端面と前記ゲート電極との距離が前記Si層から離れるほど長くなっている金属間化合物膜と、
を具備したことを特徴とする半導体装置。 - 前記Si層は、SOI基板又はバルクSi基板上にフィン状に形成され、前記Si層の少なくとも2側面に前記ゲート絶縁膜を介して前記ゲート電極が形成され、前記Si層は、前記ソース/ドレイン領域から前記チャネル領域まで一定幅で連続して形成されていることを特徴とする請求項5記載の半導体装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2009/066162 WO2011033623A1 (ja) | 2009-09-16 | 2009-09-16 | 半導体装置及びその製造方法 |
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JPWO2011033623A1 JPWO2011033623A1 (ja) | 2013-02-07 |
JP5355702B2 true JP5355702B2 (ja) | 2013-11-27 |
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US (1) | US8574993B2 (ja) |
JP (1) | JP5355702B2 (ja) |
KR (1) | KR101298378B1 (ja) |
CN (1) | CN102439702B (ja) |
WO (1) | WO2011033623A1 (ja) |
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KR102083493B1 (ko) | 2013-08-02 | 2020-03-02 | 삼성전자 주식회사 | 반도체 소자의 제조방법 |
US10153372B2 (en) * | 2014-03-27 | 2018-12-11 | Intel Corporation | High mobility strained channels for fin-based NMOS transistors |
CN106449417A (zh) * | 2016-12-14 | 2017-02-22 | 中国科学院上海微系统与信息技术研究所 | 一种圆片级制备硅纳米线阵列场效应管的方法及其结构 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000223703A (ja) * | 1999-01-29 | 2000-08-11 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2005167249A (ja) * | 2003-12-01 | 2005-06-23 | Samsung Electronics Co Ltd | 熱的安定性に優れるシリサイド膜の形成方法、その方法で形成されたシリサイド膜を備える半導体素子と半導体メモリ素子およびそれらの素子の製造方法 |
JP2007142036A (ja) * | 2005-11-16 | 2007-06-07 | Sony Corp | 半導体装置およびその製造方法 |
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JPS6360525A (ja) * | 1986-09-01 | 1988-03-16 | Hitachi Ltd | 半導体装置の製造方法 |
US6737716B1 (en) | 1999-01-29 | 2004-05-18 | Kabushiki Kaisha Toshiba | Semiconductor device and method of manufacturing the same |
JP3876307B2 (ja) * | 2002-05-02 | 2007-01-31 | 国立大学法人名古屋大学 | 素子電極用のニッケルシリコン系薄膜の作製方法、及び素子電極用の多層膜構造 |
JP2006100600A (ja) | 2004-09-29 | 2006-04-13 | Toshiba Corp | 半導体装置およびその製造方法 |
JP2006351581A (ja) * | 2005-06-13 | 2006-12-28 | Fujitsu Ltd | 半導体装置の製造方法 |
JP2007214481A (ja) | 2006-02-13 | 2007-08-23 | Toshiba Corp | 半導体装置 |
JP2008004776A (ja) | 2006-06-22 | 2008-01-10 | Toshiba Corp | 半導体装置およびその製造方法 |
US20080093631A1 (en) * | 2006-10-05 | 2008-04-24 | Chi Dong Z | Contact structure for semiconductor devices |
US8088665B2 (en) * | 2008-08-11 | 2012-01-03 | Intel Corporation | Method of forming self-aligned low resistance contact layer |
-
2009
- 2009-09-16 WO PCT/JP2009/066162 patent/WO2011033623A1/ja active Application Filing
- 2009-09-16 CN CN200980159391.9A patent/CN102439702B/zh active Active
- 2009-09-16 KR KR1020117027562A patent/KR101298378B1/ko active IP Right Grant
- 2009-09-16 JP JP2011531698A patent/JP5355702B2/ja active Active
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2012
- 2012-03-16 US US13/422,985 patent/US8574993B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000223703A (ja) * | 1999-01-29 | 2000-08-11 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2005167249A (ja) * | 2003-12-01 | 2005-06-23 | Samsung Electronics Co Ltd | 熱的安定性に優れるシリサイド膜の形成方法、その方法で形成されたシリサイド膜を備える半導体素子と半導体メモリ素子およびそれらの素子の製造方法 |
JP2007142036A (ja) * | 2005-11-16 | 2007-06-07 | Sony Corp | 半導体装置およびその製造方法 |
Non-Patent Citations (1)
Title |
---|
JPN6013026252; N.Lindert et al.: 'Quasi-planar FinFETs with selectively grown germanium raised source/drain' SOI Conference , 200110, pp.111 - 112, IEEE International * |
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Publication number | Publication date |
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KR101298378B1 (ko) | 2013-08-20 |
KR20120014162A (ko) | 2012-02-16 |
JPWO2011033623A1 (ja) | 2013-02-07 |
CN102439702B (zh) | 2014-11-12 |
US8574993B2 (en) | 2013-11-05 |
CN102439702A (zh) | 2012-05-02 |
US20120175705A1 (en) | 2012-07-12 |
WO2011033623A1 (ja) | 2011-03-24 |
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