JP5351967B2 - 構造化研磨物品、その製造方法、及びウエハの平坦化における使用 - Google Patents

構造化研磨物品、その製造方法、及びウエハの平坦化における使用 Download PDF

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Publication number
JP5351967B2
JP5351967B2 JP2011525047A JP2011525047A JP5351967B2 JP 5351967 B2 JP5351967 B2 JP 5351967B2 JP 2011525047 A JP2011525047 A JP 2011525047A JP 2011525047 A JP2011525047 A JP 2011525047A JP 5351967 B2 JP5351967 B2 JP 5351967B2
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Japan
Prior art keywords
abrasive
meth
acrylate
wafer
particles
Prior art date
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Expired - Fee Related
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JP2011525047A
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English (en)
Japanese (ja)
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JP2012501252A (ja
JP2012501252A5 (enExample
Inventor
ウィリアム， ディー． ジョゼフ，
ジュリー， ワイ． チエン，
ジミー， アール．， ジュニア バラン，
ジョン， ジェイ． ギャグリアーディ，
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2012501252A5 publication Critical patent/JP2012501252A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2011525047A 2008-08-28 2009-07-30 構造化研磨物品、その製造方法、及びウエハの平坦化における使用 Expired - Fee Related JP5351967B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9252108P 2008-08-28 2008-08-28
US61/092,521 2008-08-28
PCT/US2009/052188 WO2010025003A2 (en) 2008-08-28 2009-07-30 Structured abrasive article, method of making the same, and use in wafer planarization

Publications (3)

Publication Number Publication Date
JP2012501252A JP2012501252A (ja) 2012-01-19
JP2012501252A5 JP2012501252A5 (enExample) 2012-07-05
JP5351967B2 true JP5351967B2 (ja) 2013-11-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011525047A Expired - Fee Related JP5351967B2 (ja) 2008-08-28 2009-07-30 構造化研磨物品、その製造方法、及びウエハの平坦化における使用

Country Status (7)

Country Link
US (1) US8251774B2 (enExample)
EP (1) EP2327088B1 (enExample)
JP (1) JP5351967B2 (enExample)
KR (1) KR101602001B1 (enExample)
CN (1) CN102138203B (enExample)
TW (1) TWI429735B (enExample)
WO (1) WO2010025003A2 (enExample)

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CN104540639B (zh) 2012-05-23 2019-01-29 圣戈本陶瓷及塑料股份有限公司 成形磨粒及其形成方法
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US9707529B2 (en) 2014-12-23 2017-07-18 Saint-Gobain Ceramics & Plastics, Inc. Composite shaped abrasive particles and method of forming same
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KR102313436B1 (ko) 2016-05-10 2021-10-19 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 연마 입자들 및 그 형성 방법
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KR20180072243A (ko) * 2016-12-21 2018-06-29 엠.씨.케이 (주) 연마체 수지 조성물 및 이에 의해 제조된 패드
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Also Published As

Publication number Publication date
EP2327088A4 (en) 2017-06-14
US20100056024A1 (en) 2010-03-04
TWI429735B (zh) 2014-03-11
TW201012908A (en) 2010-04-01
CN102138203B (zh) 2015-02-04
KR101602001B1 (ko) 2016-03-17
EP2327088B1 (en) 2019-01-09
US8251774B2 (en) 2012-08-28
WO2010025003A3 (en) 2010-04-22
EP2327088A2 (en) 2011-06-01
WO2010025003A2 (en) 2010-03-04
KR20110055686A (ko) 2011-05-25
JP2012501252A (ja) 2012-01-19
CN102138203A (zh) 2011-07-27

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