TWI429735B - 結構化研磨物件、其製造方法及於晶圓平坦化中之用途 - Google Patents

結構化研磨物件、其製造方法及於晶圓平坦化中之用途 Download PDF

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Publication number
TWI429735B
TWI429735B TW098126988A TW98126988A TWI429735B TW I429735 B TWI429735 B TW I429735B TW 098126988 A TW098126988 A TW 098126988A TW 98126988 A TW98126988 A TW 98126988A TW I429735 B TWI429735 B TW I429735B
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TW
Taiwan
Prior art keywords
abrasive
acrylate
meth
abrasive article
structured
Prior art date
Application number
TW098126988A
Other languages
English (en)
Chinese (zh)
Other versions
TW201012908A (en
Inventor
威廉 戴爾 喬瑟夫
吉米 瑞 二世 拜倫
茱莉 優 奎恩
約翰 詹姆士 蓋葛莉亞迪
Original Assignee
３Ｍ新設資產公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by ３Ｍ新設資產公司 filed Critical ３Ｍ新設資產公司
Publication of TW201012908A publication Critical patent/TW201012908A/zh
Application granted granted Critical
Publication of TWI429735B publication Critical patent/TWI429735B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW098126988A 2008-08-28 2009-08-11 結構化研磨物件、其製造方法及於晶圓平坦化中之用途 TWI429735B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9252108P 2008-08-28 2008-08-28

Publications (2)

Publication Number Publication Date
TW201012908A TW201012908A (en) 2010-04-01
TWI429735B true TWI429735B (zh) 2014-03-11

Family

ID=41722203

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098126988A TWI429735B (zh) 2008-08-28 2009-08-11 結構化研磨物件、其製造方法及於晶圓平坦化中之用途

Country Status (7)

Country Link
US (1) US8251774B2 (enExample)
EP (1) EP2327088B1 (enExample)
JP (1) JP5351967B2 (enExample)
KR (1) KR101602001B1 (enExample)
CN (1) CN102138203B (enExample)
TW (1) TWI429735B (enExample)
WO (1) WO2010025003A2 (enExample)

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Also Published As

Publication number Publication date
WO2010025003A3 (en) 2010-04-22
JP2012501252A (ja) 2012-01-19
US8251774B2 (en) 2012-08-28
US20100056024A1 (en) 2010-03-04
KR20110055686A (ko) 2011-05-25
EP2327088B1 (en) 2019-01-09
TW201012908A (en) 2010-04-01
CN102138203B (zh) 2015-02-04
EP2327088A4 (en) 2017-06-14
EP2327088A2 (en) 2011-06-01
JP5351967B2 (ja) 2013-11-27
KR101602001B1 (ko) 2016-03-17
WO2010025003A2 (en) 2010-03-04
CN102138203A (zh) 2011-07-27

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