CN102138203B - 结构化磨料制品、其制备方法、及其在晶片平面化中的用途 - Google Patents

结构化磨料制品、其制备方法、及其在晶片平面化中的用途 Download PDF

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Publication number
CN102138203B
CN102138203B CN200980134338.3A CN200980134338A CN102138203B CN 102138203 B CN102138203 B CN 102138203B CN 200980134338 A CN200980134338 A CN 200980134338A CN 102138203 B CN102138203 B CN 102138203B
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CN
China
Prior art keywords
abrasive
meth
acrylate
structured
translucent film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN200980134338.3A
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English (en)
Chinese (zh)
Other versions
CN102138203A (zh
Inventor
威廉·D·约瑟夫
朱莉·Y·乾
小吉米·R·巴兰
约翰·J·加格里亚蒂
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN102138203A publication Critical patent/CN102138203A/zh
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Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
CN200980134338.3A 2008-08-28 2009-07-30 结构化磨料制品、其制备方法、及其在晶片平面化中的用途 Expired - Fee Related CN102138203B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9252108P 2008-08-28 2008-08-28
US61/092,521 2008-08-28
PCT/US2009/052188 WO2010025003A2 (en) 2008-08-28 2009-07-30 Structured abrasive article, method of making the same, and use in wafer planarization

Publications (2)

Publication Number Publication Date
CN102138203A CN102138203A (zh) 2011-07-27
CN102138203B true CN102138203B (zh) 2015-02-04

Family

ID=41722203

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980134338.3A Expired - Fee Related CN102138203B (zh) 2008-08-28 2009-07-30 结构化磨料制品、其制备方法、及其在晶片平面化中的用途

Country Status (7)

Country Link
US (1) US8251774B2 (enExample)
EP (1) EP2327088B1 (enExample)
JP (1) JP5351967B2 (enExample)
KR (1) KR101602001B1 (enExample)
CN (1) CN102138203B (enExample)
TW (1) TWI429735B (enExample)
WO (1) WO2010025003A2 (enExample)

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KR20140106713A (ko) 2011-12-30 2014-09-03 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마입자 및 이의 형성방법
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CN102604543B (zh) * 2012-04-11 2014-02-19 宣城晶瑞新材料有限公司 一种抛光液用高稳定纳米二氧化铈水性浆料制备方法
PL2852473T3 (pl) 2012-05-23 2021-06-28 Saint-Gobain Ceramics & Plastics Inc. Ukształtowane cząstki ścierne i sposoby ich formowania
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CN107636109A (zh) * 2015-03-31 2018-01-26 圣戈班磨料磨具有限公司 固定磨料制品和其形成方法
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Also Published As

Publication number Publication date
JP2012501252A (ja) 2012-01-19
KR101602001B1 (ko) 2016-03-17
WO2010025003A2 (en) 2010-03-04
TW201012908A (en) 2010-04-01
EP2327088A4 (en) 2017-06-14
TWI429735B (zh) 2014-03-11
EP2327088A2 (en) 2011-06-01
WO2010025003A3 (en) 2010-04-22
US20100056024A1 (en) 2010-03-04
KR20110055686A (ko) 2011-05-25
EP2327088B1 (en) 2019-01-09
JP5351967B2 (ja) 2013-11-27
US8251774B2 (en) 2012-08-28
CN102138203A (zh) 2011-07-27

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