CN102138203B - 结构化磨料制品、其制备方法、及其在晶片平面化中的用途 - Google Patents

结构化磨料制品、其制备方法、及其在晶片平面化中的用途 Download PDF

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Publication number
CN102138203B
CN102138203B CN200980134338.3A CN200980134338A CN102138203B CN 102138203 B CN102138203 B CN 102138203B CN 200980134338 A CN200980134338 A CN 200980134338A CN 102138203 B CN102138203 B CN 102138203B
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CN
China
Prior art keywords
abrasive
meth
acrylate
structured
translucent film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200980134338.3A
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English (en)
Chinese (zh)
Other versions
CN102138203A (zh
Inventor
威廉·D·约瑟夫
朱莉·Y·乾
小吉米·R·巴兰
约翰·J·加格里亚蒂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Publication date
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Publication of CN102138203A publication Critical patent/CN102138203A/zh
Application granted granted Critical
Publication of CN102138203B publication Critical patent/CN102138203B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
CN200980134338.3A 2008-08-28 2009-07-30 结构化磨料制品、其制备方法、及其在晶片平面化中的用途 Expired - Fee Related CN102138203B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US9252108P 2008-08-28 2008-08-28
US61/092,521 2008-08-28
PCT/US2009/052188 WO2010025003A2 (en) 2008-08-28 2009-07-30 Structured abrasive article, method of making the same, and use in wafer planarization

Publications (2)

Publication Number Publication Date
CN102138203A CN102138203A (zh) 2011-07-27
CN102138203B true CN102138203B (zh) 2015-02-04

Family

ID=41722203

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980134338.3A Expired - Fee Related CN102138203B (zh) 2008-08-28 2009-07-30 结构化磨料制品、其制备方法、及其在晶片平面化中的用途

Country Status (7)

Country Link
US (1) US8251774B2 (enExample)
EP (1) EP2327088B1 (enExample)
JP (1) JP5351967B2 (enExample)
KR (1) KR101602001B1 (enExample)
CN (1) CN102138203B (enExample)
TW (1) TWI429735B (enExample)
WO (1) WO2010025003A2 (enExample)

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CN104114327B (zh) 2011-12-30 2018-06-05 圣戈本陶瓷及塑料股份有限公司 复合成型研磨颗粒及其形成方法
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KR102006615B1 (ko) 2015-06-11 2019-08-02 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마 입자들을 포함하는 연마 물품
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CN109475998B (zh) 2016-07-20 2021-12-31 3M创新有限公司 成形玻璃化磨料团聚物、磨料制品和研磨方法
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CN109890564B (zh) 2016-10-25 2022-04-29 3M创新有限公司 具有成形磨粒的成形玻璃化磨料团聚物、磨料制品和相关方法
KR20180072243A (ko) * 2016-12-21 2018-06-29 엠.씨.케이 (주) 연마체 수지 조성물 및 이에 의해 제조된 패드
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Also Published As

Publication number Publication date
TWI429735B (zh) 2014-03-11
KR20110055686A (ko) 2011-05-25
WO2010025003A2 (en) 2010-03-04
US20100056024A1 (en) 2010-03-04
JP5351967B2 (ja) 2013-11-27
US8251774B2 (en) 2012-08-28
EP2327088A4 (en) 2017-06-14
KR101602001B1 (ko) 2016-03-17
JP2012501252A (ja) 2012-01-19
EP2327088B1 (en) 2019-01-09
WO2010025003A3 (en) 2010-04-22
CN102138203A (zh) 2011-07-27
EP2327088A2 (en) 2011-06-01
TW201012908A (en) 2010-04-01

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