KR101602001B1 - 구조화된 연마 용품, 그 제조 방법, 및 웨이퍼 평탄화에서의 사용 - Google Patents

구조화된 연마 용품, 그 제조 방법, 및 웨이퍼 평탄화에서의 사용 Download PDF

Info

Publication number
KR101602001B1
KR101602001B1 KR1020117006536A KR20117006536A KR101602001B1 KR 101602001 B1 KR101602001 B1 KR 101602001B1 KR 1020117006536 A KR1020117006536 A KR 1020117006536A KR 20117006536 A KR20117006536 A KR 20117006536A KR 101602001 B1 KR101602001 B1 KR 101602001B1
Authority
KR
South Korea
Prior art keywords
abrasive
meth
acrylate
delete delete
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020117006536A
Other languages
English (en)
Korean (ko)
Other versions
KR20110055686A (ko
Inventor
윌리엄 디 조셉
줄리 와이 첸
지미 알 주니어 바란
존 제이 개글리아디
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20110055686A publication Critical patent/KR20110055686A/ko
Application granted granted Critical
Publication of KR101602001B1 publication Critical patent/KR101602001B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020117006536A 2008-08-28 2009-07-30 구조화된 연마 용품, 그 제조 방법, 및 웨이퍼 평탄화에서의 사용 Expired - Fee Related KR101602001B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9252108P 2008-08-28 2008-08-28
US61/092,521 2008-08-28

Publications (2)

Publication Number Publication Date
KR20110055686A KR20110055686A (ko) 2011-05-25
KR101602001B1 true KR101602001B1 (ko) 2016-03-17

Family

ID=41722203

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117006536A Expired - Fee Related KR101602001B1 (ko) 2008-08-28 2009-07-30 구조화된 연마 용품, 그 제조 방법, 및 웨이퍼 평탄화에서의 사용

Country Status (7)

Country Link
US (1) US8251774B2 (enExample)
EP (1) EP2327088B1 (enExample)
JP (1) JP5351967B2 (enExample)
KR (1) KR101602001B1 (enExample)
CN (1) CN102138203B (enExample)
TW (1) TWI429735B (enExample)
WO (1) WO2010025003A2 (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9073179B2 (en) 2010-11-01 2015-07-07 3M Innovative Properties Company Laser method for making shaped ceramic abrasive particles, shaped ceramic abrasive particles, and abrasive articles
WO2013003830A2 (en) 2011-06-30 2013-01-03 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles including abrasive particles of silicon nitride
WO2013049239A1 (en) 2011-09-26 2013-04-04 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles including abrasive particulate materials, coated abrasives using the abrasive particulate materials and methods of forming
CN102492233A (zh) * 2011-12-05 2012-06-13 张莉娟 复合磨粒、其制备方法及用途
EP2797716B1 (en) 2011-12-30 2021-02-17 Saint-Gobain Ceramics & Plastics, Inc. Composite shaped abrasive particles and method of forming same
EP2797715A4 (en) 2011-12-30 2016-04-20 Saint Gobain Ceramics SHAPED ABRASIVE PARTICLE AND METHOD OF FORMING THE SAME
WO2013106602A1 (en) 2012-01-10 2013-07-18 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particles having particular shapes and methods of forming such particles
CA3056658C (en) 2012-01-10 2023-07-04 Doruk O. Yener Abrasive particles having complex shapes and methods of forming same
CN102604543B (zh) * 2012-04-11 2014-02-19 宣城晶瑞新材料有限公司 一种抛光液用高稳定纳米二氧化铈水性浆料制备方法
CN104540639B (zh) 2012-05-23 2019-01-29 圣戈本陶瓷及塑料股份有限公司 成形磨粒及其形成方法
US10106714B2 (en) 2012-06-29 2018-10-23 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particles having particular shapes and methods of forming such particles
EP2897767A4 (en) * 2012-09-21 2016-07-27 3M Innovative Properties Co INTEGRATION OF ADDITIONS IN FIXED SLOPES FOR IMPROVED CMP PERFORMANCE
EP4566756A3 (en) 2012-10-15 2025-11-26 Saint-Gobain Abrasives, Inc. Abrasive particles having particular shapes and methods of forming such particles
US9074119B2 (en) 2012-12-31 2015-07-07 Saint-Gobain Ceramics & Plastics, Inc. Particulate materials and methods of forming same
CA2907372C (en) 2013-03-29 2017-12-12 Saint-Gobain Abrasives, Inc. Abrasive particles having particular shapes and methods of forming such particles
JP2016530109A (ja) 2013-06-07 2016-09-29 スリーエム イノベイティブ プロパティズ カンパニー 基材のくぼみ、研磨ホイール、及びカバーを形成する方法
TW201502263A (zh) 2013-06-28 2015-01-16 Saint Gobain Ceramics 包含成形研磨粒子之研磨物品
CA3114978A1 (en) 2013-09-30 2015-04-02 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particles and methods of forming same
USD742195S1 (en) * 2013-12-16 2015-11-03 3M Innovation Properties Company Sanding article with pattern
USD742196S1 (en) * 2013-12-16 2015-11-03 3M Innovative Properties Company Sanding article with pattern
US9566689B2 (en) 2013-12-31 2017-02-14 Saint-Gobain Abrasives, Inc. Abrasive article including shaped abrasive particles
US9771507B2 (en) 2014-01-31 2017-09-26 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle including dopant material and method of forming same
MX394721B (es) 2014-04-14 2025-03-24 Saint Gobain Ceramics Articulo abrasivo que incluye particulas abrasivas conformadas.
CA3123554A1 (en) 2014-04-14 2015-10-22 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
CA2925923A1 (en) * 2014-05-01 2015-11-05 3M Innovative Properties Company Flexible abrasive article and method of using the same
WO2015184355A1 (en) 2014-05-30 2015-12-03 Saint-Gobain Abrasives, Inc. Method of using an abrasive article including shaped abrasive particles
JP6718868B2 (ja) * 2014-10-21 2020-07-08 スリーエム イノベイティブ プロパティズ カンパニー 研磨プリフォーム、研磨物品を製造する方法、及び結合研磨物品
US9707529B2 (en) 2014-12-23 2017-07-18 Saint-Gobain Ceramics & Plastics, Inc. Composite shaped abrasive particles and method of forming same
US9914864B2 (en) 2014-12-23 2018-03-13 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particles and method of forming same
US9676981B2 (en) 2014-12-24 2017-06-13 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle fractions and method of forming same
TWI634200B (zh) 2015-03-31 2018-09-01 聖高拜磨料有限公司 固定磨料物品及其形成方法
US10196551B2 (en) 2015-03-31 2019-02-05 Saint-Gobain Abrasives, Inc. Fixed abrasive articles and methods of forming same
CA3118262C (en) 2015-06-11 2023-09-19 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
CN109415615A (zh) 2016-05-10 2019-03-01 圣戈本陶瓷及塑料股份有限公司 磨料颗粒及其形成方法
KR102313436B1 (ko) 2016-05-10 2021-10-19 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 연마 입자들 및 그 형성 방법
WO2018017695A1 (en) 2016-07-20 2018-01-25 3M Innovative Properties Company Shaped vitrified abrasive agglomerate, abrasive articles, and method of abrading
EP4349896A3 (en) 2016-09-29 2024-06-12 Saint-Gobain Abrasives, Inc. Fixed abrasive articles and methods of forming same
CN109890564B (zh) 2016-10-25 2022-04-29 3M创新有限公司 具有成形磨粒的成形玻璃化磨料团聚物、磨料制品和相关方法
KR20180072243A (ko) * 2016-12-21 2018-06-29 엠.씨.케이 (주) 연마체 수지 조성물 및 이에 의해 제조된 패드
US10563105B2 (en) 2017-01-31 2020-02-18 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
US10759024B2 (en) 2017-01-31 2020-09-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
US10865148B2 (en) 2017-06-21 2020-12-15 Saint-Gobain Ceramics & Plastics, Inc. Particulate materials and methods of forming same
CN112055737B (zh) 2018-03-01 2022-04-12 3M创新有限公司 具有成型磨料颗粒的成型硅质磨料团聚物、磨料制品及相关方法
US12129422B2 (en) 2019-12-27 2024-10-29 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles and methods of forming same
EP4081370A4 (en) 2019-12-27 2024-04-24 Saint-Gobain Ceramics & Plastics Inc. ABRASIVE ARTICLES AND THEIR FORMATION PROCESSES
CN119238386A (zh) 2019-12-27 2025-01-03 圣戈本陶瓷及塑料股份有限公司 磨料制品及其形成方法
JP2025500060A (ja) 2021-12-30 2025-01-07 サンーゴバン アブレイシブズ，インコーポレイティド 研磨物品及びそれを形成する方法
TW202421734A (zh) * 2022-08-09 2024-06-01 日商力森諾科股份有限公司 研磨液、研磨液套組及研磨方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003534137A (ja) 2000-04-28 2003-11-18 スリーエム イノベイティブ プロパティズ カンパニー 研磨物品およびガラスの研削方法
JP2005514217A (ja) 2001-12-28 2005-05-19 スリーエム イノベイティブ プロパティズ カンパニー 研磨製品の製造方法
US20060030156A1 (en) 2004-08-05 2006-02-09 Applied Materials, Inc. Abrasive conductive polishing article for electrochemical mechanical polishing
US20070066186A1 (en) 2005-09-22 2007-03-22 3M Innovative Properties Company Flexible abrasive article and methods of making and using the same

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2868772B2 (ja) * 1988-09-20 1999-03-10 大日本印刷株式会社 研磨テープの製造方法
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
CA2170989A1 (en) * 1993-09-13 1995-03-23 Timothy L. Hoopman Abrasive article, method of manufacture of same, method of using same for finishing, and a production tool
BR9506932A (pt) 1994-02-22 1997-09-09 Minnesota Mining & Mfg Artigo abrasivo e processo para produzir o mesmo
US5551959A (en) * 1994-08-24 1996-09-03 Minnesota Mining And Manufacturing Company Abrasive article having a diamond-like coating layer and method for making same
US5645471A (en) 1995-08-11 1997-07-08 Minnesota Mining And Manufacturing Company Method of texturing a substrate using an abrasive article having multiple abrasive natures
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5624303A (en) 1996-01-22 1997-04-29 Micron Technology, Inc. Polishing pad and a method for making a polishing pad with covalently bonded particles
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6329058B1 (en) 1998-07-30 2001-12-11 3M Innovative Properties Company Nanosize metal oxide particles for producing transparent metal oxide colloids and ceramers
US6213845B1 (en) 1999-04-26 2001-04-10 Micron Technology, Inc. Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same
US6290572B1 (en) 2000-03-23 2001-09-18 Micron Technology, Inc. Devices and methods for in-situ control of mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6497957B1 (en) * 2000-10-04 2002-12-24 Eastman Kodak Company Antireflection article of manufacture
US20020072296A1 (en) 2000-11-29 2002-06-13 Muilenburg Michael J. Abrasive article having a window system for polishing wafers, and methods
CN100379522C (zh) 2000-12-01 2008-04-09 东洋橡膠工业株式会社 研磨垫及其制造方法和研磨垫用缓冲层
JP2002254316A (ja) * 2001-02-28 2002-09-10 Hitachi Maxell Ltd 研磨シ―ト
US6884723B2 (en) 2001-12-21 2005-04-26 Micron Technology, Inc. Methods for planarization of group VIII metal-containing surfaces using complexing agents
WO2003066282A2 (en) 2002-02-04 2003-08-14 Kla-Tencor Technologies Corp. Systems and methods for characterizing a polishing process
US7131889B1 (en) 2002-03-04 2006-11-07 Micron Technology, Inc. Method for planarizing microelectronic workpieces
US20040005769A1 (en) 2002-07-03 2004-01-08 Cabot Microelectronics Corp. Method and apparatus for endpoint detection
US20040127045A1 (en) 2002-09-12 2004-07-01 Gorantla Venkata R. K. Chemical mechanical planarization of wafers or films using fixed polishing pads and a nanoparticle composition
US7066801B2 (en) 2003-02-21 2006-06-27 Dow Global Technologies, Inc. Method of manufacturing a fixed abrasive material
US6910951B2 (en) 2003-02-24 2005-06-28 Dow Global Technologies, Inc. Materials and methods for chemical-mechanical planarization
US6918821B2 (en) 2003-11-12 2005-07-19 Dow Global Technologies, Inc. Materials and methods for low pressure chemical-mechanical planarization
US7591865B2 (en) * 2005-01-28 2009-09-22 Saint-Gobain Abrasives, Inc. Method of forming structured abrasive article
WO2006110517A1 (en) * 2005-04-08 2006-10-19 Saint-Gobain Abrasives, Inc. Abrasive article having reaction activated chromophore
US7344574B2 (en) * 2005-06-27 2008-03-18 3M Innovative Properties Company Coated abrasive article, and method of making and using the same
JP2007273910A (ja) * 2006-03-31 2007-10-18 Fujifilm Corp 研磨用組成液
KR100772034B1 (ko) * 2006-12-08 2007-10-31 주식회사 썬텍인더스트리 코팅된 3차원 연마재 구조물을 갖는 연마포지의 제조방법
US7497885B2 (en) * 2006-12-22 2009-03-03 3M Innovative Properties Company Abrasive articles with nanoparticulate fillers and method for making and using them
US8083820B2 (en) * 2006-12-22 2011-12-27 3M Innovative Properties Company Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same
EP2276820A4 (en) * 2008-04-18 2013-12-25 Saint Gobain Abrasives Inc HIGH POROSITY ABRASIVE ARTICLES AND METHODS OF MAKING THE SAME

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003534137A (ja) 2000-04-28 2003-11-18 スリーエム イノベイティブ プロパティズ カンパニー 研磨物品およびガラスの研削方法
JP2005514217A (ja) 2001-12-28 2005-05-19 スリーエム イノベイティブ プロパティズ カンパニー 研磨製品の製造方法
US20060030156A1 (en) 2004-08-05 2006-02-09 Applied Materials, Inc. Abrasive conductive polishing article for electrochemical mechanical polishing
US20070066186A1 (en) 2005-09-22 2007-03-22 3M Innovative Properties Company Flexible abrasive article and methods of making and using the same

Also Published As

Publication number Publication date
EP2327088A4 (en) 2017-06-14
US20100056024A1 (en) 2010-03-04
TWI429735B (zh) 2014-03-11
TW201012908A (en) 2010-04-01
CN102138203B (zh) 2015-02-04
EP2327088B1 (en) 2019-01-09
US8251774B2 (en) 2012-08-28
WO2010025003A3 (en) 2010-04-22
EP2327088A2 (en) 2011-06-01
WO2010025003A2 (en) 2010-03-04
KR20110055686A (ko) 2011-05-25
JP2012501252A (ja) 2012-01-19
JP5351967B2 (ja) 2013-11-27
CN102138203A (zh) 2011-07-27

Similar Documents

Publication Publication Date Title
KR101602001B1 (ko) 구조화된 연마 용품, 그 제조 방법, 및 웨이퍼 평탄화에서의 사용
TWI532597B (zh) 具有用於化學機械平坦化之界面活性劑的固定式研磨墊
US8083820B2 (en) Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same
KR20150058302A (ko) 개선된 cmp 성능을 위한 고정 연마 웹으로의 첨가제의 혼입
KR100777846B1 (ko) 폴리싱 패드 및 그의 사용 방법
KR100491452B1 (ko) 웨이퍼 표면 개질용 플루오로화합물을 포함하는 연마 용품
US7497885B2 (en) Abrasive articles with nanoparticulate fillers and method for making and using them
KR101300874B1 (ko) 연마용품 및 공작물 표면의 개질 방법
TW202413468A (zh) 先進研磨墊配方

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20190129

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20200304

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20200304