KR101602001B1 - 구조화된 연마 용품, 그 제조 방법, 및 웨이퍼 평탄화에서의 사용 - Google Patents

구조화된 연마 용품, 그 제조 방법, 및 웨이퍼 평탄화에서의 사용 Download PDF

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KR101602001B1
KR101602001B1 KR1020117006536A KR20117006536A KR101602001B1 KR 101602001 B1 KR101602001 B1 KR 101602001B1 KR 1020117006536 A KR1020117006536 A KR 1020117006536A KR 20117006536 A KR20117006536 A KR 20117006536A KR 101602001 B1 KR101602001 B1 KR 101602001B1
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Prior art keywords
abrasive
meth
acrylate
delete delete
wafer
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Expired - Fee Related
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Korean (ko)
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KR20110055686A (ko
Inventor
윌리엄 디 조셉
줄리 와이 첸
지미 알 주니어 바란
존 제이 개글리아디
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00Grinding, lapping or polishing of wafers, substrates or parts of devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245Pads with fixed abrasives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/205Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020117006536A 2008-08-28 2009-07-30 구조화된 연마 용품, 그 제조 방법, 및 웨이퍼 평탄화에서의 사용 Expired - Fee Related KR101602001B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9252108P 2008-08-28 2008-08-28
US61/092,521 2008-08-28

Publications (2)

Publication Number Publication Date
KR20110055686A KR20110055686A (ko) 2011-05-25
KR101602001B1 true KR101602001B1 (ko) 2016-03-17

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KR1020117006536A Expired - Fee Related KR101602001B1 (ko) 2008-08-28 2009-07-30 구조화된 연마 용품, 그 제조 방법, 및 웨이퍼 평탄화에서의 사용

Country Status (7)

Country Link
US (1) US8251774B2 (enExample)
EP (1) EP2327088B1 (enExample)
JP (1) JP5351967B2 (enExample)
KR (1) KR101602001B1 (enExample)
CN (1) CN102138203B (enExample)
TW (1) TWI429735B (enExample)
WO (1) WO2010025003A2 (enExample)

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TWI634200B (zh) 2015-03-31 2018-09-01 聖高拜磨料有限公司 固定磨料物品及其形成方法
EP3307483B1 (en) 2015-06-11 2020-06-17 Saint-Gobain Ceramics&Plastics, Inc. Abrasive article including shaped abrasive particles
KR102313436B1 (ko) 2016-05-10 2021-10-19 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 연마 입자들 및 그 형성 방법
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KR20180072243A (ko) * 2016-12-21 2018-06-29 엠.씨.케이 (주) 연마체 수지 조성물 및 이에 의해 제조된 패드
US10759024B2 (en) 2017-01-31 2020-09-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
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CN112055737B (zh) 2018-03-01 2022-04-12 3M创新有限公司 具有成型磨料颗粒的成型硅质磨料团聚物、磨料制品及相关方法
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Also Published As

Publication number Publication date
WO2010025003A3 (en) 2010-04-22
JP2012501252A (ja) 2012-01-19
US8251774B2 (en) 2012-08-28
US20100056024A1 (en) 2010-03-04
KR20110055686A (ko) 2011-05-25
EP2327088B1 (en) 2019-01-09
TWI429735B (zh) 2014-03-11
TW201012908A (en) 2010-04-01
CN102138203B (zh) 2015-02-04
EP2327088A4 (en) 2017-06-14
EP2327088A2 (en) 2011-06-01
JP5351967B2 (ja) 2013-11-27
WO2010025003A2 (en) 2010-03-04
CN102138203A (zh) 2011-07-27

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