JP5346054B2 - プリント配線板用銅箔及びそれを用いた積層板 - Google Patents

プリント配線板用銅箔及びそれを用いた積層板 Download PDF

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Publication number
JP5346054B2
JP5346054B2 JP2011060937A JP2011060937A JP5346054B2 JP 5346054 B2 JP5346054 B2 JP 5346054B2 JP 2011060937 A JP2011060937 A JP 2011060937A JP 2011060937 A JP2011060937 A JP 2011060937A JP 5346054 B2 JP5346054 B2 JP 5346054B2
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JP
Japan
Prior art keywords
copper foil
layer
copper
printed wiring
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011060937A
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English (en)
Japanese (ja)
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JP2012199291A (ja
Inventor
秀樹 古澤
幸一郎 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Priority to JP2011060937A priority Critical patent/JP5346054B2/ja
Priority to KR1020137027052A priority patent/KR101487124B1/ko
Priority to PCT/JP2012/055113 priority patent/WO2012128009A1/ja
Priority to CN201280013729.1A priority patent/CN103430635B/zh
Priority to TW101106923A priority patent/TWI419623B/zh
Publication of JP2012199291A publication Critical patent/JP2012199291A/ja
Application granted granted Critical
Publication of JP5346054B2 publication Critical patent/JP5346054B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/028—Including graded layers in composition or in physical properties, e.g. density, porosity, grain size
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP2011060937A 2011-03-18 2011-03-18 プリント配線板用銅箔及びそれを用いた積層板 Expired - Fee Related JP5346054B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011060937A JP5346054B2 (ja) 2011-03-18 2011-03-18 プリント配線板用銅箔及びそれを用いた積層板
KR1020137027052A KR101487124B1 (ko) 2011-03-18 2012-02-29 프린트 배선판용 구리박 및 그것을 사용한 적층체
PCT/JP2012/055113 WO2012128009A1 (ja) 2011-03-18 2012-02-29 プリント配線板用銅箔及びそれを用いた積層体
CN201280013729.1A CN103430635B (zh) 2011-03-18 2012-02-29 印刷布线板用铜箔及使用它的层叠体
TW101106923A TWI419623B (zh) 2011-03-18 2012-03-02 Printed wiring board with copper foil and the use of its laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011060937A JP5346054B2 (ja) 2011-03-18 2011-03-18 プリント配線板用銅箔及びそれを用いた積層板

Publications (2)

Publication Number Publication Date
JP2012199291A JP2012199291A (ja) 2012-10-18
JP5346054B2 true JP5346054B2 (ja) 2013-11-20

Family

ID=46879167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011060937A Expired - Fee Related JP5346054B2 (ja) 2011-03-18 2011-03-18 プリント配線板用銅箔及びそれを用いた積層板

Country Status (5)

Country Link
JP (1) JP5346054B2 (ko)
KR (1) KR101487124B1 (ko)
CN (1) CN103430635B (ko)
TW (1) TWI419623B (ko)
WO (1) WO2012128009A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10821223B2 (en) * 2005-11-10 2020-11-03 Iradimed Corporation Liquid infusion apparatus

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5887283B2 (ja) * 2013-01-04 2016-03-16 Ｊｘ金属株式会社 電磁波シールド用金属箔及び電磁波シールド材
JP5887287B2 (ja) * 2013-01-04 2016-03-16 Ｊｘ金属株式会社 電磁波シールド用金属箔及び電磁波シールド材
JP5887305B2 (ja) * 2013-07-04 2016-03-16 Ｊｘ金属株式会社 電磁波シールド用金属箔、電磁波シールド材、及びシールドケーブル
US10221487B2 (en) 2014-05-30 2019-03-05 Jx Nippon Mining & Metals Corporation Metal foil for electromagnetic shielding, electromagnetic shielding material and shielded cable
TWI593548B (zh) * 2015-01-09 2017-08-01 Jx Nippon Mining & Metals Corp Attached to the metal substrate
KR102427151B1 (ko) * 2015-08-31 2022-07-28 엘지디스플레이 주식회사 표시 장치
JP6854114B2 (ja) * 2016-01-04 2021-04-07 Ｊｘ金属株式会社 表面処理銅箔
IT202000010285A1 (it) * 2020-05-07 2021-11-07 Pietro Galliani S P A Dispositivo di protezione individuale

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0787270B2 (ja) * 1992-02-19 1995-09-20 日鉱グールド・フォイル株式会社 印刷回路用銅箔及びその製造方法
JP2003051673A (ja) * 2001-08-06 2003-02-21 Mitsui Mining & Smelting Co Ltd プリント配線板用銅箔及びそのプリント配線板用銅箔を用いた銅張積層板
JP4683640B2 (ja) * 2006-01-31 2011-05-18 Ｊｘ日鉱日石金属株式会社 プリント配線基板用銅箔及びそれを用いたプリント配線基板
JP4961023B2 (ja) * 2007-12-21 2012-06-27 Ｊｘ日鉱日石金属株式会社 プリント配線板用銅箔
KR101412795B1 (ko) * 2009-01-29 2014-06-27 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 전자 회로용 압연 동박 또는 전해 동박 및 이들을 사용한 전자 회로의 형성 방법
WO2010147059A1 (ja) * 2009-06-18 2010-12-23 Jx日鉱日石金属株式会社 電子回路及びその形成方法並びに電子回路形成用銅張積層板
KR101203436B1 (ko) * 2009-06-30 2012-11-21 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 프린트 배선판용 동박
JP4659140B2 (ja) * 2009-06-30 2011-03-30 Ｊｘ日鉱日石金属株式会社 プリント配線板用銅箔
US8358281B2 (en) 2009-12-15 2013-01-22 Apple Inc. Device, method, and graphical user interface for management and manipulation of user interface elements

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10821223B2 (en) * 2005-11-10 2020-11-03 Iradimed Corporation Liquid infusion apparatus

Also Published As

Publication number Publication date
KR101487124B1 (ko) 2015-01-28
CN103430635A (zh) 2013-12-04
TWI419623B (zh) 2013-12-11
TW201304627A (zh) 2013-01-16
CN103430635B (zh) 2016-06-29
WO2012128009A1 (ja) 2012-09-27
KR20130136534A (ko) 2013-12-12
JP2012199291A (ja) 2012-10-18

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