JP5337341B2 - 電気的接続装置およびその組み立て方法 - Google Patents

電気的接続装置およびその組み立て方法 Download PDF

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Publication number
JP5337341B2
JP5337341B2 JP2006322825A JP2006322825A JP5337341B2 JP 5337341 B2 JP5337341 B2 JP 5337341B2 JP 2006322825 A JP2006322825 A JP 2006322825A JP 2006322825 A JP2006322825 A JP 2006322825A JP 5337341 B2 JP5337341 B2 JP 5337341B2
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Japan
Prior art keywords
probe
plate
plate member
guide holes
straight line
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Active
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JP2006322825A
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English (en)
Japanese (ja)
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JP2008139034A (ja
Inventor
義榮 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
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Micronics Japan Co Ltd
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Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Priority to JP2006322825A priority Critical patent/JP5337341B2/ja
Priority to TW096137663A priority patent/TW200829921A/zh
Priority to KR1020070106514A priority patent/KR100926535B1/ko
Publication of JP2008139034A publication Critical patent/JP2008139034A/ja
Application granted granted Critical
Publication of JP5337341B2 publication Critical patent/JP5337341B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2006322825A 2006-11-30 2006-11-30 電気的接続装置およびその組み立て方法 Active JP5337341B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006322825A JP5337341B2 (ja) 2006-11-30 2006-11-30 電気的接続装置およびその組み立て方法
TW096137663A TW200829921A (en) 2006-11-30 2007-10-08 Electric connection device and its assembling method
KR1020070106514A KR100926535B1 (ko) 2006-11-30 2007-10-23 전기적 접속 장치 및 그 조립 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006322825A JP5337341B2 (ja) 2006-11-30 2006-11-30 電気的接続装置およびその組み立て方法

Publications (2)

Publication Number Publication Date
JP2008139034A JP2008139034A (ja) 2008-06-19
JP5337341B2 true JP5337341B2 (ja) 2013-11-06

Family

ID=39600675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006322825A Active JP5337341B2 (ja) 2006-11-30 2006-11-30 電気的接続装置およびその組み立て方法

Country Status (3)

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JP (1) JP5337341B2 (ko)
KR (1) KR100926535B1 (ko)
TW (1) TW200829921A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113447683A (zh) * 2020-03-27 2021-09-28 普因特工程有限公司 阳极氧化膜结构物及包括其的探针头以及包括其的探针卡
US20210331446A1 (en) * 2020-04-24 2021-10-28 Point Engineering Co., Ltd. Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having same
US11619655B2 (en) 2019-10-04 2023-04-04 Point Engineering Co., Ltd. Probe card for testing a pattern formed on a wafer

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5341456B2 (ja) * 2008-10-06 2013-11-13 日本電子材料株式会社 プローブカード
CN102565470B (zh) * 2010-12-03 2014-06-04 日本麦可罗尼克斯股份有限公司 探针组合体
KR101813283B1 (ko) 2011-08-23 2018-01-30 삼성전기주식회사 프로브 및 이를 이용하는 전자 부품 테스트 장치
TWI467180B (zh) * 2012-11-29 2015-01-01 Winbond Electronics Corp 探針卡
CN103941049A (zh) * 2013-01-21 2014-07-23 华邦电子股份有限公司 探针卡
KR101398550B1 (ko) * 2013-04-22 2014-05-27 리노공업주식회사 컨택트 프로브 및 그 제조방법
KR20170125070A (ko) * 2015-03-13 2017-11-13 테크노프로브 에스.피.에이. 상이한 작동 조건 하에서 각각의 가이드 구멍 내에서 개선된 슬라이드 이동을 하고 테스트 헤드 내에서 프로브를 정확히 유지하는 수직형 프로브를 구비한 테스트 헤드
TWI596346B (zh) * 2016-08-24 2017-08-21 中華精測科技股份有限公司 垂直式探針卡之探針裝置
IT201800021253A1 (it) * 2018-12-27 2020-06-27 Technoprobe Spa Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare
CN114720736A (zh) 2021-01-07 2022-07-08 旺矽科技股份有限公司 具有能横向微调的导板的探针头与导板组以及探针头调整方法
TWI782576B (zh) * 2021-01-07 2022-11-01 旺矽科技股份有限公司 具有能橫向微調之導板的探針頭與導板組以及探針頭調整方法
KR102597311B1 (ko) * 2021-08-24 2023-11-02 윌테크놀러지(주) 미세피치 대응이 가능한 프로브 카드

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750321A (ja) * 1993-08-04 1995-02-21 Yokowo Co Ltd プローブカード
WO2004072661A1 (ja) * 2003-02-17 2004-08-26 Kabushiki Kaisha Nihon Micronics 電気的接続装置
JP4455940B2 (ja) * 2004-06-17 2010-04-21 株式会社日本マイクロニクス 電気的接続装置
JP2006003252A (ja) * 2004-06-18 2006-01-05 Micronics Japan Co Ltd 電気的接続装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11619655B2 (en) 2019-10-04 2023-04-04 Point Engineering Co., Ltd. Probe card for testing a pattern formed on a wafer
CN113447683A (zh) * 2020-03-27 2021-09-28 普因特工程有限公司 阳极氧化膜结构物及包括其的探针头以及包括其的探针卡
US20210307160A1 (en) * 2020-03-27 2021-09-30 Point Engineering Co., Ltd. Anodic aluminum oxide structure, probe head having same, and probe card having same
US11696398B2 (en) * 2020-03-27 2023-07-04 Point Engineering Co., Ltd. Anodic aluminum oxide structure, probe head having same, and probe card having same
US20210331446A1 (en) * 2020-04-24 2021-10-28 Point Engineering Co., Ltd. Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having same
US11691387B2 (en) * 2020-04-24 2023-07-04 Point Engineering Co., Ltd. Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having same

Also Published As

Publication number Publication date
TW200829921A (en) 2008-07-16
KR100926535B1 (ko) 2009-11-12
JP2008139034A (ja) 2008-06-19
KR20080049612A (ko) 2008-06-04
TWI342401B (ko) 2011-05-21

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