JP5337341B2 - 電気的接続装置およびその組み立て方法 - Google Patents

電気的接続装置およびその組み立て方法 Download PDF

Info

Publication number
JP5337341B2
JP5337341B2 JP2006322825A JP2006322825A JP5337341B2 JP 5337341 B2 JP5337341 B2 JP 5337341B2 JP 2006322825 A JP2006322825 A JP 2006322825A JP 2006322825 A JP2006322825 A JP 2006322825A JP 5337341 B2 JP5337341 B2 JP 5337341B2
Authority
JP
Japan
Prior art keywords
probe
plate
plate member
guide holes
straight line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2006322825A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008139034A (ja
Inventor
義榮 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Priority to JP2006322825A priority Critical patent/JP5337341B2/ja
Priority to TW096137663A priority patent/TW200829921A/zh
Priority to KR1020070106514A priority patent/KR100926535B1/ko
Publication of JP2008139034A publication Critical patent/JP2008139034A/ja
Application granted granted Critical
Publication of JP5337341B2 publication Critical patent/JP5337341B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2006322825A 2006-11-30 2006-11-30 電気的接続装置およびその組み立て方法 Active JP5337341B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006322825A JP5337341B2 (ja) 2006-11-30 2006-11-30 電気的接続装置およびその組み立て方法
TW096137663A TW200829921A (en) 2006-11-30 2007-10-08 Electric connection device and its assembling method
KR1020070106514A KR100926535B1 (ko) 2006-11-30 2007-10-23 전기적 접속 장치 및 그 조립 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006322825A JP5337341B2 (ja) 2006-11-30 2006-11-30 電気的接続装置およびその組み立て方法

Publications (2)

Publication Number Publication Date
JP2008139034A JP2008139034A (ja) 2008-06-19
JP5337341B2 true JP5337341B2 (ja) 2013-11-06

Family

ID=39600675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006322825A Active JP5337341B2 (ja) 2006-11-30 2006-11-30 電気的接続装置およびその組み立て方法

Country Status (3)

Country Link
JP (1) JP5337341B2 (enrdf_load_stackoverflow)
KR (1) KR100926535B1 (enrdf_load_stackoverflow)
TW (1) TW200829921A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210040685A (ko) 2019-10-04 2021-04-14 (주)포인트엔지니어링 프로브 카드
CN113447683A (zh) * 2020-03-27 2021-09-28 普因特工程有限公司 阳极氧化膜结构物及包括其的探针头以及包括其的探针卡
US20210331446A1 (en) * 2020-04-24 2021-10-28 Point Engineering Co., Ltd. Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having same

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5341456B2 (ja) * 2008-10-06 2013-11-13 日本電子材料株式会社 プローブカード
CN102565470B (zh) * 2010-12-03 2014-06-04 日本麦可罗尼克斯股份有限公司 探针组合体
KR101813283B1 (ko) 2011-08-23 2018-01-30 삼성전기주식회사 프로브 및 이를 이용하는 전자 부품 테스트 장치
TWI467180B (zh) * 2012-11-29 2015-01-01 Winbond Electronics Corp 探針卡
CN103941049A (zh) * 2013-01-21 2014-07-23 华邦电子股份有限公司 探针卡
KR101398550B1 (ko) * 2013-04-22 2014-05-27 리노공업주식회사 컨택트 프로브 및 그 제조방법
EP3268752A1 (en) * 2015-03-13 2018-01-17 Technoprobe S.p.A Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions
TWI596346B (zh) * 2016-08-24 2017-08-21 中華精測科技股份有限公司 垂直式探針卡之探針裝置
IT201800021253A1 (it) * 2018-12-27 2020-06-27 Technoprobe Spa Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare
CN114720736B (zh) * 2021-01-07 2025-04-08 旺矽科技股份有限公司 具有能横向微调的导板的探针头与导板组以及探针头调整方法
TWI782576B (zh) * 2021-01-07 2022-11-01 旺矽科技股份有限公司 具有能橫向微調之導板的探針頭與導板組以及探針頭調整方法
KR102597311B1 (ko) * 2021-08-24 2023-11-02 윌테크놀러지(주) 미세피치 대응이 가능한 프로브 카드

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750321A (ja) * 1993-08-04 1995-02-21 Yokowo Co Ltd プローブカード
WO2004072661A1 (ja) * 2003-02-17 2004-08-26 Kabushiki Kaisha Nihon Micronics 電気的接続装置
JP4455940B2 (ja) * 2004-06-17 2010-04-21 株式会社日本マイクロニクス 電気的接続装置
JP2006003252A (ja) * 2004-06-18 2006-01-05 Micronics Japan Co Ltd 電気的接続装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210040685A (ko) 2019-10-04 2021-04-14 (주)포인트엔지니어링 프로브 카드
US11619655B2 (en) 2019-10-04 2023-04-04 Point Engineering Co., Ltd. Probe card for testing a pattern formed on a wafer
CN113447683A (zh) * 2020-03-27 2021-09-28 普因特工程有限公司 阳极氧化膜结构物及包括其的探针头以及包括其的探针卡
US20210307160A1 (en) * 2020-03-27 2021-09-30 Point Engineering Co., Ltd. Anodic aluminum oxide structure, probe head having same, and probe card having same
KR20210120732A (ko) 2020-03-27 2021-10-07 (주)포인트엔지니어링 양극산화막 구조체 및 이를 포함하는 프로브 헤드 및 이를 포함하는 프로브 카드
US11696398B2 (en) * 2020-03-27 2023-07-04 Point Engineering Co., Ltd. Anodic aluminum oxide structure, probe head having same, and probe card having same
US20210331446A1 (en) * 2020-04-24 2021-10-28 Point Engineering Co., Ltd. Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having same
US11691387B2 (en) * 2020-04-24 2023-07-04 Point Engineering Co., Ltd. Laminated anodic aluminum oxide structure, guide plate of probe card using same, and probe card having same

Also Published As

Publication number Publication date
KR100926535B1 (ko) 2009-11-12
TWI342401B (enrdf_load_stackoverflow) 2011-05-21
KR20080049612A (ko) 2008-06-04
JP2008139034A (ja) 2008-06-19
TW200829921A (en) 2008-07-16

Similar Documents

Publication Publication Date Title
KR100926535B1 (ko) 전기적 접속 장치 및 그 조립 방법
US6731123B2 (en) Probe device
JP4583766B2 (ja) 接触子及び電気的接続装置
TW201405130A (zh) 晶圓級積體電路接觸器及建構方法
KR20080048920A (ko) 전기적 접속 장치
US7619430B2 (en) Electrical testing probe assembly having nonparallel facing surfaces and slots formed thereon for receiving probes
EP3715866B1 (en) Probe head and probe card
CN110678759A (zh) 电连接装置
KR20210039292A (ko) 전기적 접촉자, 전기적 접속 구조 및 전기적 접속 장치
US8310068B2 (en) TCP-type semiconductor device
JP2001074779A (ja) プローブ、プローブユニット及びプローブカード
KR20080002793A (ko) 적층 기판을 구비한 프로브
US8138777B2 (en) TCP-type semiconductor device and method of testing thereof
JP2007017234A (ja) 検査装置用ソケット
JP2008216060A (ja) 電気的接続装置
JP2010122057A (ja) プローブユニット
JP4209696B2 (ja) 電気的接続装置
KR101369406B1 (ko) 탐침 구조물 및 이를 갖는 전기적 검사 장치
JP4455940B2 (ja) 電気的接続装置
JP2003224170A (ja) 電気的接続装置
TWI745750B (zh) 電性連接件及電性連接裝置
JP2008145224A (ja) 電気的接続装置
KR101183612B1 (ko) 프로브 카드의 탐침 구조물
JP4842761B2 (ja) 電気的接続体及びその製造方法
JP2006003252A (ja) 電気的接続装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091006

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120417

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20120515

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121113

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121130

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130312

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130325

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130723

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20130805

R150 Certificate of patent or registration of utility model

Ref document number: 5337341

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250