KR100926535B1 - 전기적 접속 장치 및 그 조립 방법 - Google Patents
전기적 접속 장치 및 그 조립 방법 Download PDFInfo
- Publication number
- KR100926535B1 KR100926535B1 KR1020070106514A KR20070106514A KR100926535B1 KR 100926535 B1 KR100926535 B1 KR 100926535B1 KR 1020070106514 A KR1020070106514 A KR 1020070106514A KR 20070106514 A KR20070106514 A KR 20070106514A KR 100926535 B1 KR100926535 B1 KR 100926535B1
- Authority
- KR
- South Korea
- Prior art keywords
- probe
- plate
- plate member
- guide holes
- straight line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 6
- 239000000523 sample Substances 0.000 claims abstract description 221
- 230000000149 penetrating effect Effects 0.000 claims abstract description 9
- 230000005489 elastic deformation Effects 0.000 claims description 20
- 238000006073 displacement reaction Methods 0.000 claims description 14
- 238000005452 bending Methods 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000011295 pitch Substances 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 12
- 235000012431 wafers Nutrition 0.000 description 9
- 238000007689 inspection Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000002493 microarray Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 241000192308 Agrostis hyemalis Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006322825A JP5337341B2 (ja) | 2006-11-30 | 2006-11-30 | 電気的接続装置およびその組み立て方法 |
JPJP-P-2006-00322825 | 2006-11-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080049612A KR20080049612A (ko) | 2008-06-04 |
KR100926535B1 true KR100926535B1 (ko) | 2009-11-12 |
Family
ID=39600675
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070106514A Active KR100926535B1 (ko) | 2006-11-30 | 2007-10-23 | 전기적 접속 장치 및 그 조립 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5337341B2 (enrdf_load_stackoverflow) |
KR (1) | KR100926535B1 (enrdf_load_stackoverflow) |
TW (1) | TW200829921A (enrdf_load_stackoverflow) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5341456B2 (ja) * | 2008-10-06 | 2013-11-13 | 日本電子材料株式会社 | プローブカード |
CN102565470B (zh) * | 2010-12-03 | 2014-06-04 | 日本麦可罗尼克斯股份有限公司 | 探针组合体 |
KR101813283B1 (ko) | 2011-08-23 | 2018-01-30 | 삼성전기주식회사 | 프로브 및 이를 이용하는 전자 부품 테스트 장치 |
TWI467180B (zh) * | 2012-11-29 | 2015-01-01 | Winbond Electronics Corp | 探針卡 |
CN103941049A (zh) * | 2013-01-21 | 2014-07-23 | 华邦电子股份有限公司 | 探针卡 |
KR101398550B1 (ko) * | 2013-04-22 | 2014-05-27 | 리노공업주식회사 | 컨택트 프로브 및 그 제조방법 |
WO2016146499A1 (en) * | 2015-03-13 | 2016-09-22 | Technoprobe S.P.A. | Testing head with vertical probes having an improved sliding movement within respective guide holes and correct holding of the probes within the testing head under different operative conditions |
TWI596346B (zh) * | 2016-08-24 | 2017-08-21 | 中華精測科技股份有限公司 | 垂直式探針卡之探針裝置 |
IT201800021253A1 (it) * | 2018-12-27 | 2020-06-27 | Technoprobe Spa | Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare |
KR102852504B1 (ko) | 2019-10-04 | 2025-08-29 | (주)포인트엔지니어링 | 프로브 카드 |
TWI862805B (zh) * | 2020-03-27 | 2024-11-21 | 南韓商普因特工程有限公司 | 陽極氧化膜結構物及包括其的探針頭以及包括其的探針卡 |
KR20210131691A (ko) * | 2020-04-24 | 2021-11-03 | (주)포인트엔지니어링 | 적층형 양극산화막 구조체 및 이를 이용한 프로브 카드의 가이드 플레이트 및 이를 구비하는 프로브 카드 |
CN114720736B (zh) * | 2021-01-07 | 2025-04-08 | 旺矽科技股份有限公司 | 具有能横向微调的导板的探针头与导板组以及探针头调整方法 |
TWI782576B (zh) * | 2021-01-07 | 2022-11-01 | 旺矽科技股份有限公司 | 具有能橫向微調之導板的探針頭與導板組以及探針頭調整方法 |
KR102597311B1 (ko) * | 2021-08-24 | 2023-11-02 | 윌테크놀러지(주) | 미세피치 대응이 가능한 프로브 카드 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0750321A (ja) * | 1993-08-04 | 1995-02-21 | Yokowo Co Ltd | プローブカード |
JP2006003191A (ja) * | 2004-06-17 | 2006-01-05 | Micronics Japan Co Ltd | 電気的接続装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2003211215A1 (en) * | 2003-02-17 | 2004-09-06 | Kabushiki Kaisha Nihon Micronics | Electrical connection device |
JP2006003252A (ja) * | 2004-06-18 | 2006-01-05 | Micronics Japan Co Ltd | 電気的接続装置 |
-
2006
- 2006-11-30 JP JP2006322825A patent/JP5337341B2/ja active Active
-
2007
- 2007-10-08 TW TW096137663A patent/TW200829921A/zh not_active IP Right Cessation
- 2007-10-23 KR KR1020070106514A patent/KR100926535B1/ko active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0750321A (ja) * | 1993-08-04 | 1995-02-21 | Yokowo Co Ltd | プローブカード |
JP2006003191A (ja) * | 2004-06-17 | 2006-01-05 | Micronics Japan Co Ltd | 電気的接続装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2008139034A (ja) | 2008-06-19 |
KR20080049612A (ko) | 2008-06-04 |
JP5337341B2 (ja) | 2013-11-06 |
TWI342401B (enrdf_load_stackoverflow) | 2011-05-21 |
TW200829921A (en) | 2008-07-16 |
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Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20071023 |
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Patent event date: 20090914 Comment text: Request for Trial against Decision on Refusal Patent event code: PJ02012R01D Patent event date: 20090817 Comment text: Decision to Refuse Application Patent event code: PJ02011S01I Appeal kind category: Appeal against decision to decline refusal Decision date: 20091016 Appeal identifier: 2009101008530 Request date: 20090914 |
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