TW200829921A - Electric connection device and its assembling method - Google Patents

Electric connection device and its assembling method Download PDF

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Publication number
TW200829921A
TW200829921A TW096137663A TW96137663A TW200829921A TW 200829921 A TW200829921 A TW 200829921A TW 096137663 A TW096137663 A TW 096137663A TW 96137663 A TW96137663 A TW 96137663A TW 200829921 A TW200829921 A TW 200829921A
Authority
TW
Taiwan
Prior art keywords
probe
plate
plate member
guide holes
connection device
Prior art date
Application number
TW096137663A
Other languages
English (en)
Chinese (zh)
Other versions
TWI342401B (enrdf_load_stackoverflow
Inventor
Yoshiei Hasegawa
Original Assignee
Nihon Micronics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micronics Kk filed Critical Nihon Micronics Kk
Publication of TW200829921A publication Critical patent/TW200829921A/zh
Application granted granted Critical
Publication of TWI342401B publication Critical patent/TWI342401B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW096137663A 2006-11-30 2007-10-08 Electric connection device and its assembling method TW200829921A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006322825A JP5337341B2 (ja) 2006-11-30 2006-11-30 電気的接続装置およびその組み立て方法

Publications (2)

Publication Number Publication Date
TW200829921A true TW200829921A (en) 2008-07-16
TWI342401B TWI342401B (enrdf_load_stackoverflow) 2011-05-21

Family

ID=39600675

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096137663A TW200829921A (en) 2006-11-30 2007-10-08 Electric connection device and its assembling method

Country Status (3)

Country Link
JP (1) JP5337341B2 (enrdf_load_stackoverflow)
KR (1) KR100926535B1 (enrdf_load_stackoverflow)
TW (1) TW200829921A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103941049A (zh) * 2013-01-21 2014-07-23 华邦电子股份有限公司 探针卡
TWI596346B (zh) * 2016-08-24 2017-08-21 中華精測科技股份有限公司 垂直式探針卡之探針裝置
CN114720736A (zh) * 2021-01-07 2022-07-08 旺矽科技股份有限公司 具有能横向微调的导板的探针头与导板组以及探针头调整方法
TWI782576B (zh) * 2021-01-07 2022-11-01 旺矽科技股份有限公司 具有能橫向微調之導板的探針頭與導板組以及探針頭調整方法
TWI862805B (zh) * 2020-03-27 2024-11-21 南韓商普因特工程有限公司 陽極氧化膜結構物及包括其的探針頭以及包括其的探針卡

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5341456B2 (ja) * 2008-10-06 2013-11-13 日本電子材料株式会社 プローブカード
CN102565470B (zh) * 2010-12-03 2014-06-04 日本麦可罗尼克斯股份有限公司 探针组合体
KR101813283B1 (ko) 2011-08-23 2018-01-30 삼성전기주식회사 프로브 및 이를 이용하는 전자 부품 테스트 장치
TWI467180B (zh) * 2012-11-29 2015-01-01 Winbond Electronics Corp 探針卡
KR101398550B1 (ko) * 2013-04-22 2014-05-27 리노공업주식회사 컨택트 프로브 및 그 제조방법
TW201636622A (zh) * 2015-03-13 2016-10-16 探針科技公司 包含在不同操作條件下於各導孔中具改良式滑動及於測試頭中正確夾握之垂直探針的測試頭
IT201800021253A1 (it) 2018-12-27 2020-06-27 Technoprobe Spa Testa di misura a sonde verticali avente un contatto perfezionato con un dispositivo da testare
KR102852504B1 (ko) 2019-10-04 2025-08-29 (주)포인트엔지니어링 프로브 카드
KR20210131691A (ko) * 2020-04-24 2021-11-03 (주)포인트엔지니어링 적층형 양극산화막 구조체 및 이를 이용한 프로브 카드의 가이드 플레이트 및 이를 구비하는 프로브 카드
KR102597311B1 (ko) * 2021-08-24 2023-11-02 윌테크놀러지(주) 미세피치 대응이 가능한 프로브 카드

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750321A (ja) * 1993-08-04 1995-02-21 Yokowo Co Ltd プローブカード
AU2003211215A1 (en) * 2003-02-17 2004-09-06 Kabushiki Kaisha Nihon Micronics Electrical connection device
JP4455940B2 (ja) * 2004-06-17 2010-04-21 株式会社日本マイクロニクス 電気的接続装置
JP2006003252A (ja) * 2004-06-18 2006-01-05 Micronics Japan Co Ltd 電気的接続装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103941049A (zh) * 2013-01-21 2014-07-23 华邦电子股份有限公司 探针卡
TWI596346B (zh) * 2016-08-24 2017-08-21 中華精測科技股份有限公司 垂直式探針卡之探針裝置
US10060949B2 (en) 2016-08-24 2018-08-28 Chunghwa Precision Test Tech. Co., Ltd. Probe device of vertical probe card
TWI862805B (zh) * 2020-03-27 2024-11-21 南韓商普因特工程有限公司 陽極氧化膜結構物及包括其的探針頭以及包括其的探針卡
CN114720736A (zh) * 2021-01-07 2022-07-08 旺矽科技股份有限公司 具有能横向微调的导板的探针头与导板组以及探针头调整方法
TWI782576B (zh) * 2021-01-07 2022-11-01 旺矽科技股份有限公司 具有能橫向微調之導板的探針頭與導板組以及探針頭調整方法
US11619656B2 (en) 2021-01-07 2023-04-04 Mpi Corporation Probe head and die set having horizontally fine adjustable die and probe head adjusting method

Also Published As

Publication number Publication date
JP5337341B2 (ja) 2013-11-06
KR100926535B1 (ko) 2009-11-12
KR20080049612A (ko) 2008-06-04
JP2008139034A (ja) 2008-06-19
TWI342401B (enrdf_load_stackoverflow) 2011-05-21

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