JP5331799B2 - 多層基板の金属配線の製造方法及びその構造 - Google Patents
多層基板の金属配線の製造方法及びその構造 Download PDFInfo
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- JP5331799B2 JP5331799B2 JP2010508687A JP2010508687A JP5331799B2 JP 5331799 B2 JP5331799 B2 JP 5331799B2 JP 2010508687 A JP2010508687 A JP 2010508687A JP 2010508687 A JP2010508687 A JP 2010508687A JP 5331799 B2 JP5331799 B2 JP 5331799B2
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- metal wiring
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- manufacturing
- dielectric layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
102、302: 金属配線
104: フォトレジスト
301、304: フォトレジスト層
303: 金属層
306: 上被覆金属層
306‐1: 下被覆金属層
400: 表面
Claims (12)
- 多層基板の金属配線の製造方法であって、
誘電層の表面に少なくとも一つのフォトレジスト層を塗布する工程と、
前記フォトレジスト層を露光して前記金属配線の所定の位置を定義する工程と、
前記所定の位置に位置される前記フォトレジスト層を、誘電層から離れた上方側が誘電層に近い下方側より狭くなるように除去する工程と、
フォトレジスト層が除去された位置と残されたフォトレジスト層上の両方に金属層を形成させることで、前記所定の位置に前記金属配線を形成する工程と、
前記金属配線の表面に少なくとも一つの上被覆金属層を形成する工程と、
残されたフォトレジスト層を除去する工程と、
を含み、
前記上被覆金属層は、前記金属配線の上表面及び両側表面を被覆することを特徴とする製造方法。 - 前記所定の位置に位置される前記フォトレジスト層を除去する工程では、フォトレジスト層の上方の受光程度をその下方の受光程度より多くすることにより、前記フォトレジスト層を上方から突出するように除去することを特徴とする請求項1に記載の製造方法。
- 前記所定の位置に位置される前記フォトレジスト層を除去する工程では、二つの異なる現像速度があるポジ型フォトレジストを塗布することにより、前記フォトレジスト層を上方から突出するように除去することを特徴とする請求項1に記載の製造方法。
- 前記所定の位置に前記金属配線を形成する工程前に、前記所定の位置に下被覆金属層を形成する工程をさらに含むことを特徴とする請求項1に記載の製造方法。
- 前記下被覆金属層は、前記金属配線の底面を被覆することを特徴とする請求項4に記載の製造方法。
- 前記所定の位置に前記下被覆金属層を形成する工程後、前記下被覆金属層上に下被覆誘電層を形成する工程をさらに含むことを特徴とする請求項4に記載の製造方法。
- 前記金属配線の表面に前記上被覆金属層を形成する工程前に、前記金属配線の表面に上被覆誘電層を形成し、共軸導線を形成するために用いられる工程をさらに含むことを特徴とする請求項6に記載の製造方法。
- 前記上被覆誘電層及び前記下被覆誘電層は、前記金属配線の底面、上表面及び両側表面を被覆することを特徴とする請求項7に記載の製造方法。
- 前記誘電層の材料は、ポリイミドであることを特徴とする請求項1に記載の製造方法。
- 前記金属配線を形成する工程前に、前記所定の位置に前記誘電層の表面に界面接着強化処理を行うことで、前記誘電層と前記金属配線との間の接着強度を上げる工程をさらに含むことを特徴とする請求項1に記載の製造方法。
- 前記フォトレジスト層を除去する工程後、前記所定の位置に位置される前記誘電層の部分を除去する工程をさらに含むことを特徴とする請求項1に記載の製造方法。
- 前記金属配線を形成する工程前に、前記所定の位置に前記誘電層の表面に界面接着強化処理を行うことで、前記誘電層と前記金属配線との間の接着強度を上げる工程をさらに含むことを特徴とする請求項11に記載の製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2007/001678 WO2008141481A1 (fr) | 2007-05-24 | 2007-05-24 | Structure et procédé de fabrication d'un câblage métallique sur une carte multicouches |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010528461A JP2010528461A (ja) | 2010-08-19 |
JP5331799B2 true JP5331799B2 (ja) | 2013-10-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010508687A Active JP5331799B2 (ja) | 2007-05-24 | 2007-05-24 | 多層基板の金属配線の製造方法及びその構造 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2161973B1 (ja) |
JP (1) | JP5331799B2 (ja) |
KR (1) | KR101159514B1 (ja) |
WO (1) | WO2008141481A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103547055B (zh) * | 2012-07-10 | 2016-06-08 | 绿点高新科技股份有限公司 | 具有电路图案的电路基板的制造方法 |
CN111465202A (zh) * | 2020-03-05 | 2020-07-28 | 珠海崇达电路技术有限公司 | 一种提高锣平台精度的钻孔加工方法 |
Family Cites Families (21)
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JPS5062731A (ja) * | 1973-10-05 | 1975-05-28 | ||
US4339305A (en) * | 1981-02-05 | 1982-07-13 | Rockwell International Corporation | Planar circuit fabrication by plating and liftoff |
DE3368447D1 (en) * | 1982-03-18 | 1987-01-29 | Ibm | Method for selectively coating metallurgical patterns on dielectric substrates |
US4493856A (en) | 1982-03-18 | 1985-01-15 | International Business Machines Corporation | Selective coating of metallurgical features of a dielectric substrate with diverse metals |
CA1302947C (en) * | 1985-09-13 | 1992-06-09 | Jerome S. Sallo | Copper-chromium-polyimide composite |
JPH01205495A (ja) * | 1988-02-10 | 1989-08-17 | Furukawa Electric Co Ltd:The | フレキシブルプリント回路基板の製造方法 |
JPH03229484A (ja) * | 1990-02-05 | 1991-10-11 | Fujikura Ltd | プリント配線板の製造方法 |
US5158657A (en) * | 1990-03-22 | 1992-10-27 | Canon Kabushiki Kaisha | Circuit substrate and process for its production |
JP2606115B2 (ja) * | 1993-12-27 | 1997-04-30 | 日本電気株式会社 | 半導体実装基板用素子接合パッド |
JP3368852B2 (ja) * | 1998-11-27 | 2003-01-20 | 株式会社村田製作所 | 積層パターンの形成方法 |
JP2000340901A (ja) * | 1999-05-27 | 2000-12-08 | Kyocera Corp | 配線基板 |
JP2001093821A (ja) * | 1999-09-24 | 2001-04-06 | Toshiba Corp | 製造装置組立部品、製造装置組立部品の製造方法、半導体製造装置及び電子ビーム露光装置 |
JP2001177951A (ja) * | 1999-12-15 | 2001-06-29 | Yazaki Corp | 導電回路構造 |
JP2002261189A (ja) * | 2001-03-05 | 2002-09-13 | Murata Mfg Co Ltd | 高周波用回路チップ及びその製造方法 |
JP2004186460A (ja) * | 2002-12-04 | 2004-07-02 | Sanyo Electric Co Ltd | 回路装置の製造方法 |
JP2005229041A (ja) * | 2004-02-16 | 2005-08-25 | Alps Electric Co Ltd | 高周波配線構造および高周波配線構造の製造方法 |
US7378225B2 (en) * | 2004-04-06 | 2008-05-27 | Kyle Baldwin | Method of forming a metal pattern on a substrate |
JP2005317836A (ja) * | 2004-04-30 | 2005-11-10 | Nitto Denko Corp | 配線回路基板およびその製造方法 |
JP4351129B2 (ja) * | 2004-09-01 | 2009-10-28 | 日東電工株式会社 | 配線回路基板 |
WO2006134399A1 (en) * | 2005-06-15 | 2006-12-21 | Bae Systems Plc | Transmission line |
WO2007037553A1 (ja) * | 2005-09-30 | 2007-04-05 | Zeon Corporation | 金属配線付き基板の製造方法 |
-
2007
- 2007-05-24 KR KR1020097024333A patent/KR101159514B1/ko active IP Right Grant
- 2007-05-24 JP JP2010508687A patent/JP5331799B2/ja active Active
- 2007-05-24 WO PCT/CN2007/001678 patent/WO2008141481A1/zh active Application Filing
- 2007-05-24 EP EP07721251.2A patent/EP2161973B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
EP2161973A1 (en) | 2010-03-10 |
KR101159514B1 (ko) | 2012-06-26 |
EP2161973B1 (en) | 2019-05-22 |
EP2161973A4 (en) | 2011-08-03 |
WO2008141481A1 (fr) | 2008-11-27 |
KR20100018513A (ko) | 2010-02-17 |
JP2010528461A (ja) | 2010-08-19 |
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