JP5318466B2 - 低融点無鉛ソルダーガラスおよびその使用 - Google Patents
低融点無鉛ソルダーガラスおよびその使用 Download PDFInfo
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- JP5318466B2 JP5318466B2 JP2008143439A JP2008143439A JP5318466B2 JP 5318466 B2 JP5318466 B2 JP 5318466B2 JP 2008143439 A JP2008143439 A JP 2008143439A JP 2008143439 A JP2008143439 A JP 2008143439A JP 5318466 B2 JP5318466 B2 JP 5318466B2
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- 239000011521 glass Substances 0.000 title claims description 75
- 229910000679 solder Inorganic materials 0.000 title claims description 41
- 238000002844 melting Methods 0.000 title description 12
- 230000008018 melting Effects 0.000 title description 12
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 19
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 14
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 7
- 150000001340 alkali metals Chemical class 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 4
- 239000004110 Zinc silicate Substances 0.000 claims description 3
- 229910052783 alkali metal Inorganic materials 0.000 claims description 3
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 3
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229910052878 cordierite Inorganic materials 0.000 claims description 3
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims description 3
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 3
- 229910000174 eucryptite Inorganic materials 0.000 claims description 3
- 229910052863 mullite Inorganic materials 0.000 claims description 3
- XSMMCTCMFDWXIX-UHFFFAOYSA-N zinc silicate Chemical compound [Zn+2].[O-][Si]([O-])=O XSMMCTCMFDWXIX-UHFFFAOYSA-N 0.000 claims description 3
- 235000019352 zinc silicate Nutrition 0.000 claims description 3
- 229910052845 zircon Inorganic materials 0.000 claims description 3
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 18
- 238000002425 crystallisation Methods 0.000 description 10
- 230000008025 crystallization Effects 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 5
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 5
- 229910052797 bismuth Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 3
- 229910000416 bismuth oxide Inorganic materials 0.000 description 3
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical group [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000004031 devitrification Methods 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 229910000464 lead oxide Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000002265 redox agent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000006025 fining agent Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
- C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Description
上記の組成(重量%で表示)のガラスを、誘電加熱されたるつぼの中で一般的な原料の溶融により900℃で調製した。溶融時間は3〜4時間であった。この溶融工程の間、溶融物への酸素の導入によって酸化状態を維持して、酸化ビスマスの反応を回避した。
[1]酸化物に基づく重量%で、>1〜2重量%のSiO 2 、5〜10重量%のB 2 O 3 、4.5〜12重量%のZnO、79〜88重量%のBi 2 O 3 、0.6〜2重量%のAl 2 O 3 を含み、<2のSiO 2 /Al 2 O 3 であって、11.5×10 -6 K -1 未満の線熱膨張率α (20-300) および380℃未満の転移温度Tgを有するソルダーガラス。
[2]2重量%までのNa 2 O含有量を特徴とする[1]に記載のソルダーガラス。
[3]1.1〜1.5重量%のSiO 2 含有量を特徴とする[1]または[2]に記載のソルダーガラス。
[4]5.5〜8重量%のB 2 O 3 含有量を特徴とする[1]〜[3]のいずれかに記載のソルダーガラス。
[5]10〜12重量%のZnO含有量を特徴とする[1]〜[4]のいずれかに記載のソルダーガラス。
[6]80.5〜85重量%のBi 2 O 3 含有量を特徴とする[1]〜[5]のいずれかに記載のソルダーガラス。
[7]0.7〜1重量%のAl 2 O 3 含有量を特徴とする[1]ないし[6]のいずれかに記載のソルダーガラス。
[8]1〜1.8、特には1.45〜1.6の、SiO 2 のAl 2 O 3 に対する比を特徴とする[1]〜[7]のいずれかに記載のソルダーガラス。
[9]アルカリ金属およびアルカリ土類金属の酸化物を含有しないことを特徴とする[1]〜[8]のいずれかに記載のソルダーガラス。
[10][1]〜[9]のいずれかに記載の組成物、および全混合物に対して20重量%までの熱膨張率を改善するための充填材を含むソルダーガラス調製物。
[11]β-ユークリプタイト、コージライト、ムライト、ケイ酸亜鉛鉱、ジルコンからなる群から選択される少なくとも一つの化合物の添加を特徴とする[10]に記載のソルダーガラス調製物。
Claims (10)
- 酸化物に基づく重量%で、
>1〜2重量%のSiO2、
5〜10重量%のB2O3、
4.5〜12重量%のZnO、
79〜88重量%のBi2O3、
0.6〜2重量%のAl2O3を含み、
1〜1.8のSiO2/Al2O3であり、Na 2 O含有量が2重量%までであり、CeO 2 を含まず、
11.5×10-6K-1未満の線熱膨張率α(20-300)および380℃未満の転移温度Tgを有するソルダーガラス。 - 1.1〜1.5重量%のSiO2含有量を特徴とする請求項1に記載のソルダーガラス。
- 5.5〜8重量%のB2O3含有量を特徴とする請求項1または2に記載のソルダーガラス。
- 10〜12重量%のZnO含有量を特徴とする請求項1〜3のいずれか一項に記載のソルダーガラス。
- 80.5〜85重量%のBi2O3含有量を特徴とする請求項1〜4のいずれか一項に記載のソルダーガラス。
- 0.7〜1重量%のAl2O3含有量を特徴とする請求項1〜5のいずれか一項に記載のソルダーガラス。
- 1.45〜1.6の、SiO2のAl2O3に対する比を特徴とする請求項1〜6のいずれか一項に記載のソルダーガラス。
- アルカリ金属およびアルカリ土類金属の酸化物を含有しないことを特徴とする請求項1〜7のいずれか一項に記載のソルダーガラス。
- 請求項1〜8のいずれか一項に記載の組成物、および全混合物に対して20重量%までの熱膨張率を改善するための充填材を含むソルダーガラス調製物。
- β-ユークリプタイト、コージライト、ムライト、ケイ酸亜鉛鉱、ジルコンからなる群から選択される少なくとも一つの化合物の添加を特徴とする請求項9に記載のソルダーガラス調製物。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007025465A DE102007025465B3 (de) | 2007-05-30 | 2007-05-30 | Niedrig aufschmelzendes bleifreies Lotglas und dessen Verwendung |
DE102007025465.4 | 2007-05-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008297199A JP2008297199A (ja) | 2008-12-11 |
JP5318466B2 true JP5318466B2 (ja) | 2013-10-16 |
Family
ID=39713435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008143439A Active JP5318466B2 (ja) | 2007-05-30 | 2008-05-30 | 低融点無鉛ソルダーガラスおよびその使用 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7799712B2 (ja) |
JP (1) | JP5318466B2 (ja) |
KR (1) | KR20080106027A (ja) |
CN (2) | CN101314520A (ja) |
DE (1) | DE102007025465B3 (ja) |
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JP5314969B2 (ja) * | 2008-09-03 | 2013-10-16 | 富士フイルム株式会社 | 光学ガラス |
CN101407374B (zh) * | 2008-10-24 | 2011-06-08 | 东华大学 | 一种电子浆料无铅低熔点介质玻璃及制备方法 |
CN101723589B (zh) * | 2008-10-29 | 2013-04-17 | 珠海彩珠实业有限公司 | Pdp封接用无铅低熔点玻璃粉及其制备方法 |
KR20110098894A (ko) * | 2008-12-12 | 2011-09-02 | 아사히 가라스 가부시키가이샤 | 봉착 유리, 봉착 재료층 부착 유리 부재, 및 전자 디바이스와 그 제조 방법 |
WO2011016594A1 (ko) | 2009-08-07 | 2011-02-10 | 주식회사 엘지화학 | 실리콘 태양전지 제조용 납 프리 유리 프릿 분말 및 그 제조방법과 이를 포함하는 금속 페이스트 조성물 및 실리콘 태양전지 |
DE102009051018A1 (de) * | 2009-10-28 | 2011-05-05 | Zwiesel Kristallglas Ag | Doppelwandiges Glasgefäß und Verfahren zur Herstellung desselben |
DE102010004442B4 (de) | 2010-01-13 | 2015-08-20 | Leoni Kabel Holding Gmbh | Optisches Bauelement zur Lichtwellenleitung, optisches Steckverbindungssystem mit einem solchen Bauelement und Verfahren zur Herstellung eines solchen Bauelements |
EP2558426B1 (en) | 2010-04-15 | 2020-04-08 | Ferro Corporation | Low-melting lead-free bismuth sealing glasses |
US8802203B2 (en) | 2011-02-22 | 2014-08-12 | Guardian Industries Corp. | Vanadium-based frit materials, and/or methods of making the same |
US9290408B2 (en) | 2011-02-22 | 2016-03-22 | Guardian Industries Corp. | Vanadium-based frit materials, and/or methods of making the same |
US9309146B2 (en) | 2011-02-22 | 2016-04-12 | Guardian Industries Corp. | Vanadium-based frit materials, binders, and/or solvents and methods of making the same |
KR101379061B1 (ko) * | 2011-08-11 | 2014-03-28 | (주)엘지하우시스 | 배강도 진공유리 |
US20140105546A1 (en) * | 2012-10-15 | 2014-04-17 | Corning Cable Systems Llc | Ferrule system for fiber optic connectors |
DE102013114793A1 (de) | 2013-12-23 | 2015-06-25 | Johann Wolfgang Goethe-Universität Frankfurt am Main | Verfahren zum Einfärben von Glas, gefärbtes Glas und Verwendung |
US9593527B2 (en) * | 2014-02-04 | 2017-03-14 | Guardian Industries Corp. | Vacuum insulating glass (VIG) unit with lead-free dual-frit edge seals and/or methods of making the same |
US9988302B2 (en) * | 2014-02-04 | 2018-06-05 | Guardian Glass, LLC | Frits for use in vacuum insulating glass (VIG) units, and/or associated methods |
JP2015199620A (ja) * | 2014-04-07 | 2015-11-12 | 旭硝子株式会社 | 封着材料、封着体 |
CN103894694B (zh) * | 2014-04-17 | 2016-01-20 | 哈尔滨工业大学 | 一种复合型绿色低熔玻璃钎料连接碳化硅增强铝基复合材料的方法 |
DE102015107171A1 (de) * | 2015-05-07 | 2016-11-10 | Nemak, S.A.B. De C.V. | Metallteil und Verfahren zu seiner Herstellung |
CN105149890A (zh) * | 2015-10-19 | 2015-12-16 | 哈尔滨工业大学 | 一种复合玻璃钎料连接Li系铁氧体的方法 |
GB201806411D0 (en) | 2018-04-19 | 2018-06-06 | Johnson Matthey Plc | Kit, particle mixture, paste and methods |
JP6638794B2 (ja) * | 2018-10-31 | 2020-01-29 | Agc株式会社 | 封着材料、封着体 |
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JP4815975B2 (ja) * | 2005-06-23 | 2011-11-16 | 旭硝子株式会社 | 低融点ガラスおよび封着用組成物ならびに封着用ペースト |
JP4774721B2 (ja) * | 2004-11-12 | 2011-09-14 | 旭硝子株式会社 | 低融点ガラスおよび封着用組成物ならびに封着用ペースト |
US7291573B2 (en) * | 2004-11-12 | 2007-11-06 | Asahi Techno Glass Corporation | Low melting glass, sealing composition and sealing paste |
JP5150058B2 (ja) * | 2006-03-17 | 2013-02-20 | 日本山村硝子株式会社 | ステンレス製真空二重容器の封着用無鉛ガラス組成物 |
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2007
- 2007-05-30 DE DE102007025465A patent/DE102007025465B3/de active Active
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- 2008-05-27 KR KR1020080049094A patent/KR20080106027A/ko not_active Application Discontinuation
- 2008-05-29 US US12/128,847 patent/US7799712B2/en active Active
- 2008-05-30 CN CNA2008101084545A patent/CN101314520A/zh active Pending
- 2008-05-30 JP JP2008143439A patent/JP5318466B2/ja active Active
- 2008-05-30 CN CN201510058142.8A patent/CN104692664A/zh active Pending
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JP2008297199A (ja) | 2008-12-11 |
US7799712B2 (en) | 2010-09-21 |
KR20080106027A (ko) | 2008-12-04 |
CN101314520A (zh) | 2008-12-03 |
DE102007025465B3 (de) | 2008-09-25 |
US20080300126A1 (en) | 2008-12-04 |
CN104692664A (zh) | 2015-06-10 |
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