JP5295720B2 - 半導体ウエーハ加工装置 - Google Patents

半導体ウエーハ加工装置 Download PDF

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Publication number
JP5295720B2
JP5295720B2 JP2008282983A JP2008282983A JP5295720B2 JP 5295720 B2 JP5295720 B2 JP 5295720B2 JP 2008282983 A JP2008282983 A JP 2008282983A JP 2008282983 A JP2008282983 A JP 2008282983A JP 5295720 B2 JP5295720 B2 JP 5295720B2
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Japan
Prior art keywords
semiconductor wafer
wafer
cassette
box
opening
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JP2008282983A
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English (en)
Japanese (ja)
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JP2010114125A (ja
Inventor
貴彦 津野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
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Disco Corp
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Priority to JP2008282983A priority Critical patent/JP5295720B2/ja
Priority to CN200910179458A priority patent/CN101740346A/zh
Publication of JP2010114125A publication Critical patent/JP2010114125A/ja
Application granted granted Critical
Publication of JP5295720B2 publication Critical patent/JP5295720B2/ja
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  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2008282983A 2008-11-04 2008-11-04 半導体ウエーハ加工装置 Active JP5295720B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008282983A JP5295720B2 (ja) 2008-11-04 2008-11-04 半導体ウエーハ加工装置
CN200910179458A CN101740346A (zh) 2008-11-04 2009-10-13 半导体晶片加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008282983A JP5295720B2 (ja) 2008-11-04 2008-11-04 半導体ウエーハ加工装置

Publications (2)

Publication Number Publication Date
JP2010114125A JP2010114125A (ja) 2010-05-20
JP5295720B2 true JP5295720B2 (ja) 2013-09-18

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ID=42302486

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008282983A Active JP5295720B2 (ja) 2008-11-04 2008-11-04 半導体ウエーハ加工装置

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JP (1) JP5295720B2 (zh)
CN (1) CN101740346A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5494617B2 (ja) * 2011-10-26 2014-05-21 株式会社安川電機 ロボットシステムおよび加工品の製造方法
CN104112788A (zh) * 2013-04-16 2014-10-22 北京北方微电子基地设备工艺研究中心有限责任公司 插片装置
JP2016031619A (ja) * 2014-07-28 2016-03-07 グローリー株式会社 収納作業装置、有価媒体収納システム及び収納作業方法
JP7358107B2 (ja) * 2019-07-31 2023-10-10 株式会社ディスコ レーザー加工装置
JP2021089909A (ja) * 2019-12-02 2021-06-10 株式会社ディスコ 加工装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100230987B1 (ko) * 1996-10-04 1999-11-15 윤종용 광문자인식기가 부착된 반도체 웨이퍼 검사장치
JPH10270526A (ja) * 1997-03-24 1998-10-09 Canon Inc 基板収納容器および基板搬送装置
JP3628141B2 (ja) * 1997-04-25 2005-03-09 大日本スクリーン製造株式会社 基板搬入搬出装置及びその基板搬入搬出装置を備えた基板処理装置
JPH10335430A (ja) * 1997-05-28 1998-12-18 Canon Inc ウエハ搬送装置
JP2000174103A (ja) * 1998-12-01 2000-06-23 Yamatake Corp 板状部材存在状態検出装置
JP2002334924A (ja) * 2001-05-10 2002-11-22 Komatsu Ltd 密閉式ウェハキャリヤと、同キャリヤ内のウェハに付されたマークの読取装置及び読取方法
JP2003017548A (ja) * 2001-06-28 2003-01-17 Sunx Ltd ウエハ検出装置
JP2003282675A (ja) * 2002-03-20 2003-10-03 Tokyo Seimitsu Co Ltd ウエハマッピング装置
JP2006021264A (ja) * 2004-07-07 2006-01-26 Disco Abrasive Syst Ltd 研削装置
JP2006120820A (ja) * 2004-10-21 2006-05-11 Hitachi Sci Syst Ltd 薄型基板処理装置及び薄型基板搬送装置

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Publication number Publication date
JP2010114125A (ja) 2010-05-20
CN101740346A (zh) 2010-06-16

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