JP5285892B2 - 室温硬化性オルガノポリシロキサン組成物 - Google Patents

室温硬化性オルガノポリシロキサン組成物 Download PDF

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Publication number
JP5285892B2
JP5285892B2 JP2007278105A JP2007278105A JP5285892B2 JP 5285892 B2 JP5285892 B2 JP 5285892B2 JP 2007278105 A JP2007278105 A JP 2007278105A JP 2007278105 A JP2007278105 A JP 2007278105A JP 5285892 B2 JP5285892 B2 JP 5285892B2
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Japan
Prior art keywords
group
mass
parts
room temperature
component
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JP2007278105A
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English (en)
Japanese (ja)
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JP2009102591A5 (OSRAM
JP2009102591A (ja
Inventor
祥子 鍋田
正之 大西
嘉人 潮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Priority to JP2007278105A priority Critical patent/JP5285892B2/ja
Priority to TW097137994A priority patent/TWI462970B/zh
Priority to EP08843158A priority patent/EP2207856B1/en
Priority to AT08843158T priority patent/ATE548432T1/de
Priority to PCT/JP2008/068517 priority patent/WO2009054279A1/en
Priority to US12/739,343 priority patent/US8247516B2/en
Priority to CN2008801117566A priority patent/CN101827905B/zh
Priority to KR1020107008988A priority patent/KR101528789B1/ko
Publication of JP2009102591A publication Critical patent/JP2009102591A/ja
Publication of JP2009102591A5 publication Critical patent/JP2009102591A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Sealing Material Composition (AREA)
JP2007278105A 2007-10-25 2007-10-25 室温硬化性オルガノポリシロキサン組成物 Active JP5285892B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2007278105A JP5285892B2 (ja) 2007-10-25 2007-10-25 室温硬化性オルガノポリシロキサン組成物
TW097137994A TWI462970B (zh) 2007-10-25 2008-10-02 室溫下可固化之有機聚矽氧烷組合物
AT08843158T ATE548432T1 (de) 2007-10-25 2008-10-06 Bei raumtemperatur härtbare organopolysiloxanzusammensetzung
PCT/JP2008/068517 WO2009054279A1 (en) 2007-10-25 2008-10-06 Room-temperature curable organopolysiloxane composition
EP08843158A EP2207856B1 (en) 2007-10-25 2008-10-06 Room-temperature curable organopolysiloxane composition
US12/739,343 US8247516B2 (en) 2007-10-25 2008-10-06 Room-temperature curable organopolysiloxane composition
CN2008801117566A CN101827905B (zh) 2007-10-25 2008-10-06 室温可固化的有机基聚硅氧烷组合物
KR1020107008988A KR101528789B1 (ko) 2007-10-25 2008-10-06 실온 경화성 오가노폴리실록산 조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007278105A JP5285892B2 (ja) 2007-10-25 2007-10-25 室温硬化性オルガノポリシロキサン組成物

Publications (3)

Publication Number Publication Date
JP2009102591A JP2009102591A (ja) 2009-05-14
JP2009102591A5 JP2009102591A5 (OSRAM) 2010-12-16
JP5285892B2 true JP5285892B2 (ja) 2013-09-11

Family

ID=40279059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007278105A Active JP5285892B2 (ja) 2007-10-25 2007-10-25 室温硬化性オルガノポリシロキサン組成物

Country Status (8)

Country Link
US (1) US8247516B2 (OSRAM)
EP (1) EP2207856B1 (OSRAM)
JP (1) JP5285892B2 (OSRAM)
KR (1) KR101528789B1 (OSRAM)
CN (1) CN101827905B (OSRAM)
AT (1) ATE548432T1 (OSRAM)
TW (1) TWI462970B (OSRAM)
WO (1) WO2009054279A1 (OSRAM)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2477738B1 (en) 2009-09-15 2019-01-23 Basf Se Photo-latent titanium-chelate catalysts
KR101752516B1 (ko) 2009-09-15 2017-06-29 바스프 에스이 광-잠재성 티타늄 촉매
DE102010041676A1 (de) 2010-09-29 2012-03-29 Wacker Chemie Ag Vernetzbare Organopolysiloxanzusammensetzung
JP2012158619A (ja) * 2011-01-28 2012-08-23 Dow Corning Toray Co Ltd プライマー用組成物及び積層体
JP6184401B2 (ja) 2011-04-05 2017-08-23 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 光潜在性チタン−オキソ−キレート触媒
CN109563347A (zh) * 2016-08-19 2019-04-02 道康宁东丽株式会社 用于保护电气/电子部件的室温可固化的有机聚硅氧烷组合物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3725178B2 (ja) * 1991-03-22 2005-12-07 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物
US7307134B2 (en) * 2002-02-22 2007-12-11 Henkel Corporation Mixed alkoxysilyl functional polymers
JP2004269817A (ja) * 2003-03-12 2004-09-30 Ge Toshiba Silicones Co Ltd 室温硬化性ポリオルガノシロキサン組成物の製造方法
JP4283009B2 (ja) * 2003-03-12 2009-06-24 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
JP4860099B2 (ja) * 2003-03-12 2012-01-25 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
JP4180477B2 (ja) * 2003-09-10 2008-11-12 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
JP4799835B2 (ja) * 2004-07-09 2011-10-26 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器
JP4733937B2 (ja) * 2004-07-09 2011-07-27 東レ・ダウコーニング株式会社 室温硬化性オルガノポリシロキサン組成物、および電気・電子機器

Also Published As

Publication number Publication date
KR20100087129A (ko) 2010-08-03
TWI462970B (zh) 2014-12-01
ATE548432T1 (de) 2012-03-15
US8247516B2 (en) 2012-08-21
TW200932833A (en) 2009-08-01
CN101827905B (zh) 2013-04-17
US20100236450A1 (en) 2010-09-23
EP2207856A1 (en) 2010-07-21
KR101528789B1 (ko) 2015-06-15
CN101827905A (zh) 2010-09-08
EP2207856B1 (en) 2012-03-07
JP2009102591A (ja) 2009-05-14
WO2009054279A1 (en) 2009-04-30

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