JP5281762B2 - 電極接合構造体 - Google Patents

電極接合構造体 Download PDF

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Publication number
JP5281762B2
JP5281762B2 JP2007165001A JP2007165001A JP5281762B2 JP 5281762 B2 JP5281762 B2 JP 5281762B2 JP 2007165001 A JP2007165001 A JP 2007165001A JP 2007165001 A JP2007165001 A JP 2007165001A JP 5281762 B2 JP5281762 B2 JP 5281762B2
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Japan
Prior art keywords
electrode
region
electrodes
resin
circuit formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007165001A
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English (en)
Japanese (ja)
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JP2009004614A5 (enExample
JP2009004614A (ja
Inventor
正三 越智
内田　　修
健太郎 西脇
茂昭 酒谷
かおり 矢野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP2007165001A priority Critical patent/JP5281762B2/ja
Publication of JP2009004614A publication Critical patent/JP2009004614A/ja
Publication of JP2009004614A5 publication Critical patent/JP2009004614A5/ja
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Publication of JP5281762B2 publication Critical patent/JP5281762B2/ja
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JP2007165001A 2007-06-22 2007-06-22 電極接合構造体 Expired - Fee Related JP5281762B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007165001A JP5281762B2 (ja) 2007-06-22 2007-06-22 電極接合構造体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007165001A JP5281762B2 (ja) 2007-06-22 2007-06-22 電極接合構造体

Publications (3)

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JP2009004614A JP2009004614A (ja) 2009-01-08
JP2009004614A5 JP2009004614A5 (enExample) 2010-07-29
JP5281762B2 true JP5281762B2 (ja) 2013-09-04

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ID=40320665

Family Applications (1)

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JP2007165001A Expired - Fee Related JP5281762B2 (ja) 2007-06-22 2007-06-22 電極接合構造体

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JP (1) JP5281762B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015037496A1 (ja) * 2013-09-10 2015-03-19 堺ディスプレイプロダクト株式会社 導電体の接続構造及び表示装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4816750B2 (ja) 2009-03-13 2011-11-16 住友電気工業株式会社 プリント配線基板の接続方法
JP5779345B2 (ja) * 2010-12-09 2015-09-16 デクセリアルズ株式会社 接合体、及び接合体の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3219140B2 (ja) * 1997-10-14 2001-10-15 ソニーケミカル株式会社 電気・電子機器
JP3956622B2 (ja) * 2001-01-31 2007-08-08 セイコーエプソン株式会社 配線基板、電気光学装置および電子機器
JP2007005640A (ja) * 2005-06-24 2007-01-11 Three M Innovative Properties Co 回路基板の相互接続方法
JP2007012674A (ja) * 2005-06-28 2007-01-18 Toshiba Corp 基板パッド接続構造及び基板パッド接続用ボンディングツール

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015037496A1 (ja) * 2013-09-10 2015-03-19 堺ディスプレイプロダクト株式会社 導電体の接続構造及び表示装置
JPWO2015037496A1 (ja) * 2013-09-10 2017-03-02 堺ディスプレイプロダクト株式会社 導電体の接続構造及び表示装置
US9814141B2 (en) 2013-09-10 2017-11-07 Sakai Display Products Corporation Connection structure of conductors and display apparatus

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Publication number Publication date
JP2009004614A (ja) 2009-01-08

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