JP5274944B2 - 導体モジュール及び電磁圧接方法 - Google Patents
導体モジュール及び電磁圧接方法 Download PDFInfo
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- JP5274944B2 JP5274944B2 JP2008229738A JP2008229738A JP5274944B2 JP 5274944 B2 JP5274944 B2 JP 5274944B2 JP 2008229738 A JP2008229738 A JP 2008229738A JP 2008229738 A JP2008229738 A JP 2008229738A JP 5274944 B2 JP5274944 B2 JP 5274944B2
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- Prior art keywords
- conductor
- coil
- pair
- conductors
- flat circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K13/00—Welding by high-frequency current heating
- B23K13/01—Welding by high-frequency current heating by induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/06—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of high energy impulses, e.g. magnetic energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/101—Using electrical induction, e.g. for heating during soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- General Induction Heating (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Multi-Conductor Connections (AREA)
Description
11 FPC(フラット回路体)
12 FPC(フラット回路体)
13 導体
14 被覆部
15 被覆部
16 露出穴
21 コイル
22 固定具
26 飛翔材
31 レジスト膜
Claims (7)
- 平角状の導体、及び、該導体の両面を挟んで被覆する一対のシート状の被覆部、が設けられると共に前記導体同士が互いに接合された一対のフラット回路体を有する導体モジュールにおいて、
前記導体の片面を露出する前記導体の幅よりも小さい露出穴が、前記一対のフラット回路体の各々の前記被覆部に設けられ、そして、
前記一対のフラット回路体に各々設けた前記露出穴から露出した導体同士が、電磁圧接されている
ことを特徴とする導体モジュール。 - 前記一対のフラット回路体の導体同士の接合部が、前記一対のフラット回路体に各々設けた前記露出穴同士を重ね、前記導体と交わるコイルから発生する磁界のうち前記フラット回路体の厚さ方向の成分がピークとなる位置に前記露出穴が位置するように、前記コイル上に前記一対のフラット回路体を配置した後に、前記コイルに電流を流して前記導体同士を電磁圧接して設けられている
ことを特徴とする請求項1に記載の導体モジュール。 - 前記一対のフラット回路体の導体同士の接合部が、前記一対のフラット回路体に各々設けられた前記露出穴同士を重ね、前記導体よりも厚い導電性の飛翔材と交わるコイルから発生する磁界のうち前記フラット回路体の厚さ方向の成分がピークとなる位置に前記露出穴が位置するように、前記コイル上に前記飛翔材を挟んだ状態で前記一対のフラット回路体を配置した後に、前記コイルに電流を流して前記導体同士を電磁圧接して設けられている
ことを特徴とする請求項1に記載の導体モジュール。 - 前記一対の被覆部間に複数の前記導体が設けられ、
前記露出穴が、前記一対のフラット回路体に設けられた前記複数の導体の一部のみを露出するように設けられている
ことを特徴とする請求項1又は2に記載の導体モジュール。 - 前記露出穴が設けられている被覆部が、前記被覆部の溶融材を導体の一面に塗布して設けられ、
前記被覆部に設けた露出穴が、前記被覆部の前記露出穴以外の部分にレジスト膜を設けた後に前記被覆部をエッチングして設けられた
ことを特徴とする請求項1〜4何れか1項に記載の導体モジュール。 - 平角状の導体、及び、該導体の両面を挟んで被覆する一対のシート状の被覆部、が設けられた一対のフラット回路体の前記導体同士を接合する方法において、
前記一対のフラット回路体の被覆部に各々設けた前記導体の片面を露出する前記導体の幅よりも小さい露出穴同士を重ねる工程と、
前記導体と交わる前記コイルから発生する磁界のうち前記フラット回路体の厚さ方向の成分がピークとなる位置に前記露出穴が位置するように、前記コイル上に前記露出穴を配置する工程と、
前記コイルに電流を流して前記導体同士を電磁圧接する工程と、
を順次行うことを特徴とする電磁圧接方法。 - 平角状の導体、及び、該導体の両面を挟んで被覆する一対のシート状の被覆部、が設けられた一対のフラット回路体の前記導体同士を接合する方法において、
前記一対のフラット回路体の被覆部に各々設けた前記導体の片面を露出する前記導体の幅よりも小さい露出穴同士を重ねる工程と、
前記導体よりも厚い導電性の飛翔材と交わるコイルから発生する磁界のうち前記フラット回路体の厚さ方向の成分がピークとなる位置に前記露出穴が位置するように、前記コイル上に前記飛翔材を挟んだ状態で前記一対のフラット回路体を配置する工程と、
前記コイルに電流を流して前記導体同士を電磁圧接する工程と、
を順次行うことを特徴とする電磁圧接方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008229738A JP5274944B2 (ja) | 2008-09-08 | 2008-09-08 | 導体モジュール及び電磁圧接方法 |
US12/585,101 US8383947B2 (en) | 2008-09-08 | 2009-09-03 | Conductor module and electromagnetic welding method |
DE102009040625.5A DE102009040625B4 (de) | 2008-09-08 | 2009-09-08 | Leitermodul und Verfahren zum elektromagnetischen Schweißen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008229738A JP5274944B2 (ja) | 2008-09-08 | 2008-09-08 | 導体モジュール及び電磁圧接方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010067357A JP2010067357A (ja) | 2010-03-25 |
JP5274944B2 true JP5274944B2 (ja) | 2013-08-28 |
Family
ID=41798222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008229738A Active JP5274944B2 (ja) | 2008-09-08 | 2008-09-08 | 導体モジュール及び電磁圧接方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8383947B2 (ja) |
JP (1) | JP5274944B2 (ja) |
DE (1) | DE102009040625B4 (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8007286B1 (en) | 2008-03-18 | 2011-08-30 | Metrospec Technology, Llc | Circuit boards interconnected by overlapping plated through holes portions |
US11266014B2 (en) | 2008-02-14 | 2022-03-01 | Metrospec Technology, L.L.C. | LED lighting systems and method |
US8851356B1 (en) | 2008-02-14 | 2014-10-07 | Metrospec Technology, L.L.C. | Flexible circuit board interconnection and methods |
US10334735B2 (en) | 2008-02-14 | 2019-06-25 | Metrospec Technology, L.L.C. | LED lighting systems and methods |
US8143631B2 (en) | 2008-03-06 | 2012-03-27 | Metrospec Technology Llc | Layered structure for use with high power light emitting diode systems |
CN102248273B (zh) * | 2011-06-14 | 2014-11-05 | 西安交通大学 | 一种电磁脉冲力和机械力复合的冷压焊装置 |
JP5885226B2 (ja) | 2011-10-10 | 2016-03-15 | ダナ オートモーティブ システムズ グループ、エルエルシー | プレートのための磁気パルス溶接および成形 |
JP5850804B2 (ja) * | 2012-06-19 | 2016-02-03 | 日本写真印刷株式会社 | タッチパネル、タッチパネルの製造方法 |
JP6210489B2 (ja) * | 2013-11-06 | 2017-10-11 | 公立大学法人首都大学東京 | 金属接合板の製造方法 |
FR3026038B1 (fr) * | 2014-09-23 | 2017-03-10 | Adm28 S Ar L | Bobine pour soudage de pieces plates par impulsion magnetique et procede de soudage associe |
CN105896128B (zh) * | 2016-01-15 | 2018-07-24 | 常州印刷电子产业研究院有限公司 | 柔性电路板连接接口及柔性电路板结构 |
FR3058661B1 (fr) * | 2016-11-14 | 2019-06-28 | Adm28 S.Ar.L | Procede de soudage par impulsion magnetique d’un empilement de feuillets |
US10849200B2 (en) | 2018-09-28 | 2020-11-24 | Metrospec Technology, L.L.C. | Solid state lighting circuit with current bias and method of controlling thereof |
JP7310211B2 (ja) * | 2019-03-27 | 2023-07-19 | マツダ株式会社 | 電磁成形方法及び電磁成形装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05121139A (ja) * | 1991-10-24 | 1993-05-18 | Sumitomo Wiring Syst Ltd | フラツト導体の接続方法 |
JP3751153B2 (ja) | 1997-10-20 | 2006-03-01 | 独立行政法人科学技術振興機構 | 金属薄板の電磁溶接法及び装置 |
US6607780B1 (en) * | 2000-05-25 | 2003-08-19 | International Business Machines Corporation | Process of forming a ceramic structure using a support sheet |
JP2006310016A (ja) | 2005-04-27 | 2006-11-09 | Matsushita Electric Ind Co Ltd | ガス放電発光パネル |
JP4644559B2 (ja) * | 2005-08-08 | 2011-03-02 | 矢崎総業株式会社 | 電磁溶接方法 |
JP5243712B2 (ja) * | 2006-11-16 | 2013-07-24 | 矢崎総業株式会社 | 電磁溶接方法及び導体モジュール |
US20080149371A1 (en) * | 2006-12-22 | 2008-06-26 | Angstrom Power Inc. | Flexible circuit |
JP2008229738A (ja) | 2007-03-16 | 2008-10-02 | Seiko Epson Corp | 生産システム及び生産システム用汎用セル |
-
2008
- 2008-09-08 JP JP2008229738A patent/JP5274944B2/ja active Active
-
2009
- 2009-09-03 US US12/585,101 patent/US8383947B2/en active Active
- 2009-09-08 DE DE102009040625.5A patent/DE102009040625B4/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE102009040625B4 (de) | 2022-04-14 |
US20100059254A1 (en) | 2010-03-11 |
DE102009040625A1 (de) | 2010-04-15 |
US8383947B2 (en) | 2013-02-26 |
JP2010067357A (ja) | 2010-03-25 |
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