JP5263923B2 - 拡散接合方法及びその装置 - Google Patents

拡散接合方法及びその装置 Download PDF

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Publication number
JP5263923B2
JP5263923B2 JP2007308147A JP2007308147A JP5263923B2 JP 5263923 B2 JP5263923 B2 JP 5263923B2 JP 2007308147 A JP2007308147 A JP 2007308147A JP 2007308147 A JP2007308147 A JP 2007308147A JP 5263923 B2 JP5263923 B2 JP 5263923B2
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Japan
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bonded
bonding
pressure
workpiece
container
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JP2007308147A
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Japanese (ja)
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JP2009131861A (ja
JP2009131861A5 (https=
Inventor
修 大橋
敬一 峯岸
安徳 吉田
光司 和田
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SMC Corp
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SMC Corp
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Priority to JP2007308147A priority Critical patent/JP5263923B2/ja
Priority to DE200810058773 priority patent/DE102008058773A1/de
Priority to US12/277,863 priority patent/US8901465B2/en
Priority to CN 200810179513 priority patent/CN101444873B/zh
Publication of JP2009131861A publication Critical patent/JP2009131861A/ja
Publication of JP2009131861A5 publication Critical patent/JP2009131861A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP2007308147A 2007-11-29 2007-11-29 拡散接合方法及びその装置 Expired - Fee Related JP5263923B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007308147A JP5263923B2 (ja) 2007-11-29 2007-11-29 拡散接合方法及びその装置
DE200810058773 DE102008058773A1 (de) 2007-11-29 2008-11-24 Verbindungsverfahren und Vorrichtung hierfür
US12/277,863 US8901465B2 (en) 2007-11-29 2008-11-25 Bonding method and apparatus therefor
CN 200810179513 CN101444873B (zh) 2007-11-29 2008-11-28 结合方法及其装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007308147A JP5263923B2 (ja) 2007-11-29 2007-11-29 拡散接合方法及びその装置

Publications (3)

Publication Number Publication Date
JP2009131861A JP2009131861A (ja) 2009-06-18
JP2009131861A5 JP2009131861A5 (https=) 2011-01-13
JP5263923B2 true JP5263923B2 (ja) 2013-08-14

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JP2007308147A Expired - Fee Related JP5263923B2 (ja) 2007-11-29 2007-11-29 拡散接合方法及びその装置

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US (1) US8901465B2 (https=)
JP (1) JP5263923B2 (https=)
CN (1) CN101444873B (https=)
DE (1) DE102008058773A1 (https=)

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JP4890633B2 (ja) * 2010-06-28 2012-03-07 Ｅｃｏ−Ａ株式会社 通電拡散接合装置及び方法
CN106363348A (zh) * 2010-10-29 2017-02-01 株式会社威工 容器的制造方法
CN103260809B (zh) * 2010-12-14 2016-01-06 日产自动车株式会社 导电材料的接合体
JP2013059788A (ja) * 2011-09-13 2013-04-04 Yazaki Corp 金属接続方法
US9669488B2 (en) 2011-11-04 2017-06-06 Eco-A Co., Ltd. Current diffusion bonding apparatus and current diffusion bonding method
CN102699520B (zh) * 2012-06-21 2015-08-19 江苏科技大学 脉冲电流辅助加热的低温快速扩散焊接装置及其焊接方法
DE102012109782A1 (de) * 2012-10-15 2014-04-17 Karlsruher Institut für Technologie Schichtverbund
CN103521909A (zh) * 2013-10-31 2014-01-22 北京石油化工学院 一种液相扩散焊机
US9943926B2 (en) * 2014-01-21 2018-04-17 Tk Co., Ltd. Press-fit joining apparatus
CN104493358B (zh) * 2014-12-19 2017-01-18 深圳市宝福珠宝首饰有限公司 贵金属无焊剂型自动熔接设备及其方法
CN106493466A (zh) * 2016-10-14 2017-03-15 贝原合金（苏州）有限公司 耐高压双金属复合材料及其加工设备、加工方法
CN106312286B (zh) * 2016-11-08 2019-02-26 湖南顶立科技有限公司 一种扩散焊设备
CN106392296A (zh) * 2016-12-01 2017-02-15 无锡市精盛洲科技有限公司 一种灯具热板焊设备
JP6389551B1 (ja) * 2017-08-29 2018-09-12 オリジン電気株式会社 異種金属接合物品の製造方法及び接合装置
CN107538124B (zh) * 2017-09-26 2021-03-16 东莞市大为工业科技有限公司 一种锂电池复合电极的扩散连接方法
CN107649778B (zh) * 2017-09-26 2019-09-17 东莞市大为工业科技有限公司 一种铜箔与铜端子、铝箔与铝端子的扩散接合方法
CN107971619A (zh) * 2017-11-27 2018-05-01 广东华士科技股份有限公司 分子扩散焊接装置
KR102162106B1 (ko) * 2018-03-15 2020-10-06 닛테츠 닛신 세이코 가부시키가이샤 열교환기의 제조 방법
CN108971738A (zh) * 2018-06-14 2018-12-11 惠州市隆合科技有限公司 一种锂电池极耳金属箔材焊接机构及焊接方法
JP7328504B2 (ja) * 2019-04-17 2023-08-17 日本製鉄株式会社 鋼部品およびその製造方法
CN110756981B (zh) * 2019-11-07 2020-11-24 西北工业大学 面向大尺寸内腔结构件的扩散焊成形装备及扩散焊方法
CN110860776B (zh) * 2019-11-19 2021-07-20 山东省科学院新材料研究所 一种用于低熔点合金的焊接装置及焊接方法和应用

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JP4455229B2 (ja) * 2004-08-27 2010-04-21 キヤノン株式会社 画像表示装置
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JP2006181641A (ja) * 2004-12-02 2006-07-13 Ebara Corp 接合装置及び接合方法
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TW200721242A (en) * 2005-07-25 2007-06-01 Tokyo Electron Ltd Method for processing metal member and apparatus for processing metal member
CN101090082A (zh) 2006-06-15 2007-12-19 中国科学院半导体研究所 多功能半导体晶片键合装置
CN100467186C (zh) * 2006-09-28 2009-03-11 山东大学 一种镁与铝异种金属间的快速扩散焊连接方法

Also Published As

Publication number Publication date
JP2009131861A (ja) 2009-06-18
CN101444873B (zh) 2012-07-11
CN101444873A (zh) 2009-06-03
US8901465B2 (en) 2014-12-02
US20090139646A1 (en) 2009-06-04
DE102008058773A1 (de) 2009-06-04

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