JP5256466B2 - 成膜装置及び酸化物薄膜成膜用基板の製造方法 - Google Patents

成膜装置及び酸化物薄膜成膜用基板の製造方法 Download PDF

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Publication number
JP5256466B2
JP5256466B2 JP2008219784A JP2008219784A JP5256466B2 JP 5256466 B2 JP5256466 B2 JP 5256466B2 JP 2008219784 A JP2008219784 A JP 2008219784A JP 2008219784 A JP2008219784 A JP 2008219784A JP 5256466 B2 JP5256466 B2 JP 5256466B2
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Japan
Prior art keywords
substrate
metal film
film
process chamber
forming
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2008219784A
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English (en)
Japanese (ja)
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JP2010053402A (ja
JP2010053402A5 (cg-RX-API-DMAC7.html
Inventor
祐二 本多
光博 鈴木
正史 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Youtec Co Ltd
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Youtec Co Ltd
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Publication date
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Priority to JP2008219784A priority Critical patent/JP5256466B2/ja
Priority to PCT/JP2009/064303 priority patent/WO2010024131A1/ja
Publication of JP2010053402A publication Critical patent/JP2010053402A/ja
Publication of JP2010053402A5 publication Critical patent/JP2010053402A5/ja
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Expired - Fee Related legal-status Critical Current
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Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3464Sputtering using more than one target

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP2008219784A 2008-08-28 2008-08-28 成膜装置及び酸化物薄膜成膜用基板の製造方法 Expired - Fee Related JP5256466B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008219784A JP5256466B2 (ja) 2008-08-28 2008-08-28 成膜装置及び酸化物薄膜成膜用基板の製造方法
PCT/JP2009/064303 WO2010024131A1 (ja) 2008-08-28 2009-08-13 成膜装置及び酸化物薄膜成膜用基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008219784A JP5256466B2 (ja) 2008-08-28 2008-08-28 成膜装置及び酸化物薄膜成膜用基板の製造方法

Publications (3)

Publication Number Publication Date
JP2010053402A JP2010053402A (ja) 2010-03-11
JP2010053402A5 JP2010053402A5 (cg-RX-API-DMAC7.html) 2011-10-13
JP5256466B2 true JP5256466B2 (ja) 2013-08-07

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008219784A Expired - Fee Related JP5256466B2 (ja) 2008-08-28 2008-08-28 成膜装置及び酸化物薄膜成膜用基板の製造方法

Country Status (2)

Country Link
JP (1) JP5256466B2 (cg-RX-API-DMAC7.html)
WO (1) WO2010024131A1 (cg-RX-API-DMAC7.html)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58177463A (ja) * 1982-04-12 1983-10-18 Hitachi Ltd 積層薄膜成膜装置
JP2971586B2 (ja) * 1990-12-21 1999-11-08 株式会社リコー 薄膜形成装置
JP4167833B2 (ja) * 2002-01-24 2008-10-22 株式会社ユーテック 成膜装置、酸化物薄膜成膜用基板及びその製造方法
JP4586956B2 (ja) * 2002-12-24 2010-11-24 セイコーエプソン株式会社 電極膜の製造方法
JP2006108291A (ja) * 2004-10-04 2006-04-20 Seiko Epson Corp 強誘電体キャパシタ及びその製造方法、並びに強誘電体メモリ装置

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Publication number Publication date
JP2010053402A (ja) 2010-03-11
WO2010024131A1 (ja) 2010-03-04

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