JP5252977B2 - 光学デバイス及びその製造方法 - Google Patents

光学デバイス及びその製造方法 Download PDF

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Publication number
JP5252977B2
JP5252977B2 JP2008106274A JP2008106274A JP5252977B2 JP 5252977 B2 JP5252977 B2 JP 5252977B2 JP 2008106274 A JP2008106274 A JP 2008106274A JP 2008106274 A JP2008106274 A JP 2008106274A JP 5252977 B2 JP5252977 B2 JP 5252977B2
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JP
Japan
Prior art keywords
light emitting
light receiving
optical device
convex portions
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008106274A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009135401A (ja
Inventor
虎 孟
裕人 大崎
哲史 西尾
清一 糸井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2008106274A priority Critical patent/JP5252977B2/ja
Priority to US12/209,233 priority patent/US7911018B2/en
Publication of JP2009135401A publication Critical patent/JP2009135401A/ja
Priority to US12/929,795 priority patent/US7977138B1/en
Application granted granted Critical
Publication of JP5252977B2 publication Critical patent/JP5252977B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Solid State Image Pick-Up Elements (AREA)
  • Led Device Packages (AREA)
JP2008106274A 2007-10-30 2008-04-16 光学デバイス及びその製造方法 Expired - Fee Related JP5252977B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008106274A JP5252977B2 (ja) 2007-10-30 2008-04-16 光学デバイス及びその製造方法
US12/209,233 US7911018B2 (en) 2007-10-30 2008-09-12 Optical device and method of manufacturing the same
US12/929,795 US7977138B1 (en) 2007-10-30 2011-02-16 Optical device and method of manufacturing the same

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007281052 2007-10-30
JP2007281052 2007-10-30
JP2008106274A JP5252977B2 (ja) 2007-10-30 2008-04-16 光学デバイス及びその製造方法

Publications (2)

Publication Number Publication Date
JP2009135401A JP2009135401A (ja) 2009-06-18
JP5252977B2 true JP5252977B2 (ja) 2013-07-31

Family

ID=40616000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008106274A Expired - Fee Related JP5252977B2 (ja) 2007-10-30 2008-04-16 光学デバイス及びその製造方法

Country Status (2)

Country Link
JP (1) JP5252977B2 (zh)
CN (1) CN101425526A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010098117A (ja) * 2008-10-16 2010-04-30 Nec Electronics Corp 電子装置および電子装置の製造方法
JP6212985B2 (ja) * 2013-06-27 2017-10-18 住友電気工業株式会社 受光装置、及び、ハイブリッド型イメージセンサ
JP7012510B2 (ja) * 2016-11-08 2022-02-14 シチズン電子株式会社 光学部材および発光装置
CN107331625A (zh) * 2017-06-06 2017-11-07 华天科技（昆山）电子有限公司 半导体器件的封装结构及其制作方法
CN111900623B (zh) * 2020-07-31 2021-11-30 常州纵慧芯光半导体科技有限公司 一种激光器及其制造方法与应用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2659852B2 (ja) * 1990-06-29 1997-09-30 株式会社クラレ 撮像素子の製造方法
JPH0786544A (ja) * 1993-09-14 1995-03-31 Casio Comput Co Ltd Ｃｃｄ素子
JP2991172B2 (ja) * 1997-10-24 1999-12-20 日本電気株式会社 半導体装置
JP2004063782A (ja) * 2002-07-29 2004-02-26 Fuji Photo Film Co Ltd 固体撮像装置およびその製造方法
JP2005026974A (ja) * 2003-07-01 2005-01-27 Daishinku Corp 圧電振動デバイスの製造方法およびその方法によって製造された圧電振動デバイス
JP2006287640A (ja) * 2005-03-31 2006-10-19 Fuji Photo Film Co Ltd 固体撮像素子パッケージ、固体撮像素子実装基板、デジタルカメラ及び固体撮像素子パッケージの実装方法
JP2007150266A (ja) * 2005-10-28 2007-06-14 Matsushita Electric Ind Co Ltd 固体撮像装置の製造方法、及び固体撮像装置

Also Published As

Publication number Publication date
JP2009135401A (ja) 2009-06-18
CN101425526A (zh) 2009-05-06

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